JPH0141032B2 - - Google Patents

Info

Publication number
JPH0141032B2
JPH0141032B2 JP57092737A JP9273782A JPH0141032B2 JP H0141032 B2 JPH0141032 B2 JP H0141032B2 JP 57092737 A JP57092737 A JP 57092737A JP 9273782 A JP9273782 A JP 9273782A JP H0141032 B2 JPH0141032 B2 JP H0141032B2
Authority
JP
Japan
Prior art keywords
input
terminals
chip
terminal
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57092737A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58209158A (ja
Inventor
Soichi Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP57092737A priority Critical patent/JPS58209158A/ja
Publication of JPS58209158A publication Critical patent/JPS58209158A/ja
Publication of JPH0141032B2 publication Critical patent/JPH0141032B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/90—Masterslice integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP57092737A 1982-05-31 1982-05-31 マスタスライス半導体装置 Granted JPS58209158A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57092737A JPS58209158A (ja) 1982-05-31 1982-05-31 マスタスライス半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57092737A JPS58209158A (ja) 1982-05-31 1982-05-31 マスタスライス半導体装置

Publications (2)

Publication Number Publication Date
JPS58209158A JPS58209158A (ja) 1983-12-06
JPH0141032B2 true JPH0141032B2 (enrdf_load_stackoverflow) 1989-09-01

Family

ID=14062725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57092737A Granted JPS58209158A (ja) 1982-05-31 1982-05-31 マスタスライス半導体装置

Country Status (1)

Country Link
JP (1) JPS58209158A (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5941852A (ja) * 1982-06-24 1984-03-08 ストレイジ・テクノロジ−・パ−トナ−ズ 集積回路チツプ
JPS59139646A (ja) * 1983-01-31 1984-08-10 Hitachi Micro Comput Eng Ltd 半導体集積回路装置
JPS59159557A (ja) * 1983-03-01 1984-09-10 Hitachi Ltd 半導体集積回路装置
JPS61204957A (ja) * 1985-03-08 1986-09-11 Hitachi Ltd 大規模集積回路装置
JPS61263241A (ja) * 1985-05-17 1986-11-21 Matsushita Electronics Corp ゲ−トアレイ
JPH05308136A (ja) * 1992-04-01 1993-11-19 Nec Corp マスタスライス集積回路

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925381B2 (ja) * 1977-12-30 1984-06-16 富士通株式会社 半導体集積回路装置
JPS5561054A (en) * 1978-10-30 1980-05-08 Mitsubishi Electric Corp Large scale integrated circuit
JPS58197746A (ja) * 1982-05-14 1983-11-17 Hitachi Ltd 半導体集積回路装置

Also Published As

Publication number Publication date
JPS58209158A (ja) 1983-12-06

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