JPH0137853B2 - - Google Patents
Info
- Publication number
- JPH0137853B2 JPH0137853B2 JP59117315A JP11731584A JPH0137853B2 JP H0137853 B2 JPH0137853 B2 JP H0137853B2 JP 59117315 A JP59117315 A JP 59117315A JP 11731584 A JP11731584 A JP 11731584A JP H0137853 B2 JPH0137853 B2 JP H0137853B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- groove
- resin
- burrs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 description 8
- 239000003566 sealing material Substances 0.000 description 5
- 230000008602 contraction Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11731584A JPS60261163A (ja) | 1984-06-07 | 1984-06-07 | リードフレームの製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11731584A JPS60261163A (ja) | 1984-06-07 | 1984-06-07 | リードフレームの製造方法 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63319001A Division JPH01215412A (ja) | 1988-12-16 | 1988-12-16 | プレス加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60261163A JPS60261163A (ja) | 1985-12-24 |
JPH0137853B2 true JPH0137853B2 (ko) | 1989-08-09 |
Family
ID=14708705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11731584A Granted JPS60261163A (ja) | 1984-06-07 | 1984-06-07 | リードフレームの製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60261163A (ko) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62186555A (ja) * | 1986-02-12 | 1987-08-14 | Hitachi Cable Ltd | プレス成形リードフレームの製造方法 |
JPS6333642U (ko) * | 1986-08-19 | 1988-03-04 | ||
JPH0677374A (ja) * | 1992-08-27 | 1994-03-18 | Nec Corp | 半導体装置用リードおよびその製造方法 |
JP3685057B2 (ja) * | 1999-12-08 | 2005-08-17 | 日亜化学工業株式会社 | Ledランプ及びその製造方法 |
JP4132052B2 (ja) * | 2001-12-24 | 2008-08-13 | ファン ドーンズ トランスミッシー ベー.ファウ. | 横断要素、金属プッシュ・ベルト、およびこれを製造するための方法および処理ツール |
JP5549612B2 (ja) * | 2011-01-31 | 2014-07-16 | 三菱電機株式会社 | 半導体装置の製造方法 |
JP6236484B2 (ja) * | 2016-02-24 | 2017-11-22 | シャープ株式会社 | 発光装置 |
JP6394634B2 (ja) | 2016-03-31 | 2018-09-26 | 日亜化学工業株式会社 | リードフレーム、パッケージ及び発光装置、並びにこれらの製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS501649A (ko) * | 1973-05-07 | 1975-01-09 | ||
JPS501658A (ko) * | 1973-05-07 | 1975-01-09 | ||
JPS51150185A (en) * | 1975-06-18 | 1976-12-23 | Hirata Press Kogyo Kk | Shearing processing |
JPS5574013A (en) * | 1978-11-28 | 1980-06-04 | Tanaka Precious Metal Ind | Electric contact band material and method of fabricating same |
JPS55160449A (en) * | 1979-05-31 | 1980-12-13 | Toshiba Corp | Semiconductor device |
JPS60123047A (ja) * | 1983-12-07 | 1985-07-01 | Toshiba Corp | 半導体装置 |
-
1984
- 1984-06-07 JP JP11731584A patent/JPS60261163A/ja active Granted
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS501649A (ko) * | 1973-05-07 | 1975-01-09 | ||
JPS501658A (ko) * | 1973-05-07 | 1975-01-09 | ||
JPS51150185A (en) * | 1975-06-18 | 1976-12-23 | Hirata Press Kogyo Kk | Shearing processing |
JPS5574013A (en) * | 1978-11-28 | 1980-06-04 | Tanaka Precious Metal Ind | Electric contact band material and method of fabricating same |
JPS55160449A (en) * | 1979-05-31 | 1980-12-13 | Toshiba Corp | Semiconductor device |
JPS60123047A (ja) * | 1983-12-07 | 1985-07-01 | Toshiba Corp | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS60261163A (ja) | 1985-12-24 |
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