JPH0136607Y2 - - Google Patents

Info

Publication number
JPH0136607Y2
JPH0136607Y2 JP1983204834U JP20483483U JPH0136607Y2 JP H0136607 Y2 JPH0136607 Y2 JP H0136607Y2 JP 1983204834 U JP1983204834 U JP 1983204834U JP 20483483 U JP20483483 U JP 20483483U JP H0136607 Y2 JPH0136607 Y2 JP H0136607Y2
Authority
JP
Japan
Prior art keywords
synthetic resin
thermoplastic synthetic
resin layer
conductive filler
mixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983204834U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60109926U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1983204834U priority Critical patent/JPS60109926U/ja
Priority to US06/682,432 priority patent/US4585686A/en
Publication of JPS60109926U publication Critical patent/JPS60109926U/ja
Application granted granted Critical
Publication of JPH0136607Y2 publication Critical patent/JPH0136607Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0013—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor using fillers dispersed in the moulding material, e.g. metal particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y10T428/257—Iron oxide or aluminum oxide

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP1983204834U 1983-12-28 1983-12-28 二層構造 Granted JPS60109926U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1983204834U JPS60109926U (ja) 1983-12-28 1983-12-28 二層構造
US06/682,432 US4585686A (en) 1983-12-28 1984-12-17 Two-layer structure molded by using thermoplastic resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983204834U JPS60109926U (ja) 1983-12-28 1983-12-28 二層構造

Publications (2)

Publication Number Publication Date
JPS60109926U JPS60109926U (ja) 1985-07-25
JPH0136607Y2 true JPH0136607Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-11-07

Family

ID=16497153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983204834U Granted JPS60109926U (ja) 1983-12-28 1983-12-28 二層構造

Country Status (2)

Country Link
US (1) US4585686A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS60109926U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0180383A3 (en) * 1984-10-26 1987-06-03 Aronkasei Co., Limited A manufacturing method for housings with a two-layer structure
FR2619655A1 (fr) * 1987-08-21 1989-02-24 Mennecier Philippe Systeme de faradisation d'un equipement electrique base sur l'utilisation d'un polymere conducteur
EP0485991B1 (en) * 1990-11-14 1997-01-29 Matrix Science Corporation Conductive fiber composite electrical connector and method of making same
FR2723268A1 (fr) * 1994-07-28 1996-02-02 Alcatel Cable Interface Sa Connecteur femelle protege contre des pertubations, pour reseau de communication
JP2776753B2 (ja) * 1994-11-24 1998-07-16 埼玉日本電気株式会社 プラスチックシールド筐体
EP1007318A1 (de) * 1997-08-21 2000-06-14 Structoform Spritzgiessen Anisotroper Strukturkomponenten Gmbh Verfahren zum spritzgiessen, spritzgiessform und spritzgiessvorrichtung sowie verfahren zum befüllen eines hauptextruders aus einem nebenextruder
SE9800488L (sv) * 1998-02-19 1999-08-20 Nolato Silikonteknik Ab Skärmning
DE10063696A1 (de) * 2000-12-20 2002-07-18 Siemens Ag Verfahren zur Herstellung eines Gehäuses eines mobilen Kommunikations-Endgerätes, Gehäuse und mobiles Kommunikations-Endgerät
US6585925B2 (en) 2000-12-27 2003-07-01 Intel Corporation Process for forming molded heat dissipation devices
EP1245361A1 (de) * 2001-03-26 2002-10-02 Abb Research Ltd. Verfahren zum Spritzgiessen von Formteilen mit elektrischer Leitungsfunktion und elektrisches Bauelement mit einem solchen Formteil
JP5105985B2 (ja) * 2007-07-26 2012-12-26 株式会社東芝 電気部品
US10959343B2 (en) * 2017-08-25 2021-03-23 Hewlett Packard Enterprise Development Lp Integrated stand-offs for printed circuit boards

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4218507A (en) * 1975-01-13 1980-08-19 Graham Magnetics, Inc. Coated particles and process of preparing same
US4092459A (en) * 1975-01-13 1978-05-30 Graham Magnetics Incorporated Powder products
US4447492A (en) * 1977-11-21 1984-05-08 Occidental Chemical Corporation Articles having an electrically conductive surface

Also Published As

Publication number Publication date
JPS60109926U (ja) 1985-07-25
US4585686A (en) 1986-04-29

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