JPS60109926U - 二層構造 - Google Patents
二層構造Info
- Publication number
- JPS60109926U JPS60109926U JP1983204834U JP20483483U JPS60109926U JP S60109926 U JPS60109926 U JP S60109926U JP 1983204834 U JP1983204834 U JP 1983204834U JP 20483483 U JP20483483 U JP 20483483U JP S60109926 U JPS60109926 U JP S60109926U
- Authority
- JP
- Japan
- Prior art keywords
- layer structure
- synthetic resin
- double layer
- conductive filler
- thermoplastic synthetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0013—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor using fillers dispersed in the moulding material, e.g. metal particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6581—Shield structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/256—Heavy metal or aluminum or compound thereof
- Y10T428/257—Iron oxide or aluminum oxide
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
め要約のデータは記録されません。
Description
第1図は従来例の部分側断面図、第2図は本考案の一実
施例の部分側断面図である。 。 図中、11・・・熱可塑性合成樹脂層、IIA・・・ボ
ス、12・・・導電性充填材を混合した熱可塑性合成樹
脂層。
施例の部分側断面図である。 。 図中、11・・・熱可塑性合成樹脂層、IIA・・・ボ
ス、12・・・導電性充填材を混合した熱可塑性合成樹
脂層。
Claims (1)
- 導電性充填材を混合しない熱可塑性合成樹脂層と、導電
性充填材を混合した熱可塑性合成樹脂層と力)、らなる
二層構造において導電性充填材を混合しない熱可塑性合
成樹脂層には突起部を一体的に形成し、該突起部は該導
電性充填材を混合した熱可塑性合成樹脂層を貫通突出し
、かつ該突起部の直径は該二層構造に及ぼされる電磁波
の波長の1160以下であることを特徴とする二層構造
。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983204834U JPS60109926U (ja) | 1983-12-28 | 1983-12-28 | 二層構造 |
US06/682,432 US4585686A (en) | 1983-12-28 | 1984-12-17 | Two-layer structure molded by using thermoplastic resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983204834U JPS60109926U (ja) | 1983-12-28 | 1983-12-28 | 二層構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60109926U true JPS60109926U (ja) | 1985-07-25 |
JPH0136607Y2 JPH0136607Y2 (ja) | 1989-11-07 |
Family
ID=16497153
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983204834U Granted JPS60109926U (ja) | 1983-12-28 | 1983-12-28 | 二層構造 |
Country Status (2)
Country | Link |
---|---|
US (1) | US4585686A (ja) |
JP (1) | JPS60109926U (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0180383A3 (en) * | 1984-10-26 | 1987-06-03 | Aronkasei Co., Limited | A manufacturing method for housings with a two-layer structure |
FR2619655A1 (fr) * | 1987-08-21 | 1989-02-24 | Mennecier Philippe | Systeme de faradisation d'un equipement electrique base sur l'utilisation d'un polymere conducteur |
EP0485991B1 (en) * | 1990-11-14 | 1997-01-29 | Matrix Science Corporation | Conductive fiber composite electrical connector and method of making same |
FR2723268A1 (fr) * | 1994-07-28 | 1996-02-02 | Alcatel Cable Interface Sa | Connecteur femelle protege contre des pertubations, pour reseau de communication |
JP2776753B2 (ja) * | 1994-11-24 | 1998-07-16 | 埼玉日本電気株式会社 | プラスチックシールド筐体 |
WO1999010158A1 (de) * | 1997-08-21 | 1999-03-04 | Structoform Spritzgiessen Anisotroper Strukturkomponenten Gmbh | Verfahren zum spritzgiessen, spritzgiessform und spritzgiessvorrichtung sowie verfahren zum befüllen eines hauptextruders aus einem nebenextruder |
SE9800488L (sv) * | 1998-02-19 | 1999-08-20 | Nolato Silikonteknik Ab | Skärmning |
DE10063696A1 (de) * | 2000-12-20 | 2002-07-18 | Siemens Ag | Verfahren zur Herstellung eines Gehäuses eines mobilen Kommunikations-Endgerätes, Gehäuse und mobiles Kommunikations-Endgerät |
US6585925B2 (en) | 2000-12-27 | 2003-07-01 | Intel Corporation | Process for forming molded heat dissipation devices |
EP1245361A1 (de) * | 2001-03-26 | 2002-10-02 | Abb Research Ltd. | Verfahren zum Spritzgiessen von Formteilen mit elektrischer Leitungsfunktion und elektrisches Bauelement mit einem solchen Formteil |
JP5105985B2 (ja) * | 2007-07-26 | 2012-12-26 | 株式会社東芝 | 電気部品 |
US10959343B2 (en) * | 2017-08-25 | 2021-03-23 | Hewlett Packard Enterprise Development Lp | Integrated stand-offs for printed circuit boards |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4218507A (en) * | 1975-01-13 | 1980-08-19 | Graham Magnetics, Inc. | Coated particles and process of preparing same |
US4092459A (en) * | 1975-01-13 | 1978-05-30 | Graham Magnetics Incorporated | Powder products |
US4447492A (en) * | 1977-11-21 | 1984-05-08 | Occidental Chemical Corporation | Articles having an electrically conductive surface |
-
1983
- 1983-12-28 JP JP1983204834U patent/JPS60109926U/ja active Granted
-
1984
- 1984-12-17 US US06/682,432 patent/US4585686A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US4585686A (en) | 1986-04-29 |
JPH0136607Y2 (ja) | 1989-11-07 |
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