JPH0136243B2 - - Google Patents
Info
- Publication number
- JPH0136243B2 JPH0136243B2 JP56172442A JP17244281A JPH0136243B2 JP H0136243 B2 JPH0136243 B2 JP H0136243B2 JP 56172442 A JP56172442 A JP 56172442A JP 17244281 A JP17244281 A JP 17244281A JP H0136243 B2 JPH0136243 B2 JP H0136243B2
- Authority
- JP
- Japan
- Prior art keywords
- fine
- conductive film
- powder
- parts
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 29
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 24
- 239000000843 powder Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 5
- 239000010408 film Substances 0.000 description 51
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 19
- 229910052709 silver Inorganic materials 0.000 description 18
- 239000004332 silver Substances 0.000 description 18
- 229910052573 porcelain Inorganic materials 0.000 description 17
- 239000010953 base metal Substances 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 8
- 230000007935 neutral effect Effects 0.000 description 7
- 238000013508 migration Methods 0.000 description 6
- 230000005012 migration Effects 0.000 description 6
- 238000006722 reduction reaction Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 229910052796 boron Inorganic materials 0.000 description 5
- 229910052810 boron oxide Inorganic materials 0.000 description 5
- 239000003985 ceramic capacitor Substances 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- MOWNZPNSYMGTMD-UHFFFAOYSA-N oxidoboron Chemical class O=[B] MOWNZPNSYMGTMD-UHFFFAOYSA-N 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000012808 vapor phase Substances 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical class [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000010946 fine silver Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Conductive Materials (AREA)
- Ceramic Capacitors (AREA)
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56172442A JPS5874030A (ja) | 1981-10-28 | 1981-10-28 | 電子部品、導電皮膜組成物及び製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56172442A JPS5874030A (ja) | 1981-10-28 | 1981-10-28 | 電子部品、導電皮膜組成物及び製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5874030A JPS5874030A (ja) | 1983-05-04 |
| JPH0136243B2 true JPH0136243B2 (US06203919-20010320-C00004.png) | 1989-07-31 |
Family
ID=15942055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56172442A Granted JPS5874030A (ja) | 1981-10-28 | 1981-10-28 | 電子部品、導電皮膜組成物及び製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5874030A (US06203919-20010320-C00004.png) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6215735A (ja) * | 1985-07-11 | 1987-01-24 | Matsushita Electric Ind Co Ltd | 画像表示装置 |
| JPH0722064B2 (ja) * | 1986-02-21 | 1995-03-08 | 京セラ株式会社 | チツプ型積層磁器コンデンサ |
| JPH01235204A (ja) * | 1988-03-15 | 1989-09-20 | Matsushita Electric Ind Co Ltd | 電圧非直線抵抗器 |
| JPH01146515U (US06203919-20010320-C00004.png) * | 1988-03-31 | 1989-10-09 | ||
| US8129088B2 (en) * | 2009-07-02 | 2012-03-06 | E.I. Du Pont De Nemours And Company | Electrode and method for manufacturing the same |
| JP6570478B2 (ja) | 2016-05-31 | 2019-09-04 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
| JP2017216360A (ja) * | 2016-05-31 | 2017-12-07 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
| JP2017216358A (ja) * | 2016-05-31 | 2017-12-07 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51138898A (en) * | 1975-04-21 | 1976-11-30 | Engelhard Min & Chem | Base metal conductor which can be calcinated in atmosphere |
| JPS56129313A (en) * | 1980-03-12 | 1981-10-09 | Tdk Electronics Co Ltd | Method of forming electrode of electronic component |
| JPS56133814A (en) * | 1980-03-24 | 1981-10-20 | Matsushita Electric Ind Co Ltd | Method of producing ceramic electronic part |
-
1981
- 1981-10-28 JP JP56172442A patent/JPS5874030A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51138898A (en) * | 1975-04-21 | 1976-11-30 | Engelhard Min & Chem | Base metal conductor which can be calcinated in atmosphere |
| JPS56129313A (en) * | 1980-03-12 | 1981-10-09 | Tdk Electronics Co Ltd | Method of forming electrode of electronic component |
| JPS56133814A (en) * | 1980-03-24 | 1981-10-20 | Matsushita Electric Ind Co Ltd | Method of producing ceramic electronic part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5874030A (ja) | 1983-05-04 |
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