JPH0133959B2 - - Google Patents

Info

Publication number
JPH0133959B2
JPH0133959B2 JP4335683A JP4335683A JPH0133959B2 JP H0133959 B2 JPH0133959 B2 JP H0133959B2 JP 4335683 A JP4335683 A JP 4335683A JP 4335683 A JP4335683 A JP 4335683A JP H0133959 B2 JPH0133959 B2 JP H0133959B2
Authority
JP
Japan
Prior art keywords
copper
metal plate
insulator
metal
clad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4335683A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59168696A (ja
Inventor
Tooru Higuchi
Takeshi Kano
Satoshi Morimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP4335683A priority Critical patent/JPS59168696A/ja
Publication of JPS59168696A publication Critical patent/JPS59168696A/ja
Publication of JPH0133959B2 publication Critical patent/JPH0133959B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP4335683A 1983-03-15 1983-03-15 金属ベ−ス印刷配線板の製造方法 Granted JPS59168696A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4335683A JPS59168696A (ja) 1983-03-15 1983-03-15 金属ベ−ス印刷配線板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4335683A JPS59168696A (ja) 1983-03-15 1983-03-15 金属ベ−ス印刷配線板の製造方法

Publications (2)

Publication Number Publication Date
JPS59168696A JPS59168696A (ja) 1984-09-22
JPH0133959B2 true JPH0133959B2 (enrdf_load_stackoverflow) 1989-07-17

Family

ID=12661569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4335683A Granted JPS59168696A (ja) 1983-03-15 1983-03-15 金属ベ−ス印刷配線板の製造方法

Country Status (1)

Country Link
JP (1) JPS59168696A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62214696A (ja) * 1986-03-15 1987-09-21 松下電工株式会社 プリント配線板およびその製造方法
JPH10117069A (ja) * 1996-10-08 1998-05-06 Denki Kagaku Kogyo Kk 金属ベース多層回路基板

Also Published As

Publication number Publication date
JPS59168696A (ja) 1984-09-22

Similar Documents

Publication Publication Date Title
US6320140B1 (en) One-sided circuit board for multi-layer printed wiring board, multi-layer printed wiring board, and method of its production
KR20040014394A (ko) 코어 기판, 이것을 사용한 다층 회로 기판
KR100632560B1 (ko) 병렬적 인쇄회로기판 제조 방법
JPS6227558B2 (enrdf_load_stackoverflow)
KR100536315B1 (ko) 반도체 패키지 기판 및 그 제조 방법
JPH08153971A (ja) 多層プリント配線基板及びその製造方法
JPH1041631A (ja) チップ埋め込み構造高密度実装基板の製造方法
JPS63241995A (ja) 多層印刷回路板およびその製法
JPH0133959B2 (enrdf_load_stackoverflow)
JPH07221460A (ja) 多層プリント配線板の製造方法
JP3955799B2 (ja) 配線基板の製造方法
JPS63133596A (ja) 多層印刷配線板およびその製造方法
JPS63137498A (ja) スル−ホ−ルプリント板の製法
JP2001144445A (ja) 多層プリント配線板の製造方法
JPH0312792B2 (enrdf_load_stackoverflow)
JPS63246897A (ja) 金属ベ−ス２層配線板の製造法
JPH07221458A (ja) 多層プリント配線板
JPH01151293A (ja) 多層プリント配線板の内層導通方法
JPS624877B2 (enrdf_load_stackoverflow)
JPS62140495A (ja) 金属ベ−スプリント配線板の製造方法
JPS6235692A (ja) 印刷配線基板
JPS59168697A (ja) 金属ベ−ス印刷配線板の製造方法
JPH07221459A (ja) 多層プリント配線板の製造方法
JPH0521960A (ja) 多層プリント配線板およびその製造方法
JPH01194500A (ja) 多層配線基板