JPH01315147A - 樹脂封止形半導体装置の製造方法 - Google Patents

樹脂封止形半導体装置の製造方法

Info

Publication number
JPH01315147A
JPH01315147A JP1086910A JP8691089A JPH01315147A JP H01315147 A JPH01315147 A JP H01315147A JP 1086910 A JP1086910 A JP 1086910A JP 8691089 A JP8691089 A JP 8691089A JP H01315147 A JPH01315147 A JP H01315147A
Authority
JP
Japan
Prior art keywords
resin
strip
section
support plate
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1086910A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0451975B2 (cg-RX-API-DMAC10.html
Inventor
Takaaki Yokoyama
隆昭 横山
Yoshiharu Tada
多田　吉晴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanken Electric Co Ltd
Original Assignee
Sanken Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanken Electric Co Ltd filed Critical Sanken Electric Co Ltd
Priority to JP1086910A priority Critical patent/JPH01315147A/ja
Publication of JPH01315147A publication Critical patent/JPH01315147A/ja
Publication of JPH0451975B2 publication Critical patent/JPH0451975B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/016—
    • H10W72/5449—
    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1086910A 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法 Granted JPH01315147A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1086910A JPH01315147A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1086910A JPH01315147A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP59159047A Division JPS6156420A (ja) 1984-07-31 1984-07-31 樹脂封止形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPH01315147A true JPH01315147A (ja) 1989-12-20
JPH0451975B2 JPH0451975B2 (cg-RX-API-DMAC10.html) 1992-08-20

Family

ID=13899999

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1086910A Granted JPH01315147A (ja) 1989-04-07 1989-04-07 樹脂封止形半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPH01315147A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0545487A3 (en) * 1991-12-05 1994-06-08 Cons Ric Microelettronica Semiconductor device encapsulated in resin and electrically insulated having improved insulation characteristics and related manufacturing process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0545487A3 (en) * 1991-12-05 1994-06-08 Cons Ric Microelettronica Semiconductor device encapsulated in resin and electrically insulated having improved insulation characteristics and related manufacturing process
US5766985A (en) * 1991-12-05 1998-06-16 Consorzio Per La Ricerca Sulla Microelettronica Nel Mezzogiorno Process for encapsulating a semiconductor device having a heat sink

Also Published As

Publication number Publication date
JPH0451975B2 (cg-RX-API-DMAC10.html) 1992-08-20

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees