JPH0127003B2 - - Google Patents
Info
- Publication number
- JPH0127003B2 JPH0127003B2 JP59159133A JP15913384A JPH0127003B2 JP H0127003 B2 JPH0127003 B2 JP H0127003B2 JP 59159133 A JP59159133 A JP 59159133A JP 15913384 A JP15913384 A JP 15913384A JP H0127003 B2 JPH0127003 B2 JP H0127003B2
- Authority
- JP
- Japan
- Prior art keywords
- silica
- melting
- less
- silica gel
- hydrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Silicon Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15913384A JPS6140811A (ja) | 1984-07-31 | 1984-07-31 | 溶融用水和シリカおよびこれを用いた溶融シリカの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15913384A JPS6140811A (ja) | 1984-07-31 | 1984-07-31 | 溶融用水和シリカおよびこれを用いた溶融シリカの製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6140811A JPS6140811A (ja) | 1986-02-27 |
| JPH0127003B2 true JPH0127003B2 (enrdf_load_stackoverflow) | 1989-05-26 |
Family
ID=15686966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15913384A Granted JPS6140811A (ja) | 1984-07-31 | 1984-07-31 | 溶融用水和シリカおよびこれを用いた溶融シリカの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6140811A (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01230422A (ja) * | 1988-03-10 | 1989-09-13 | Nippon Chem Ind Co Ltd | 高純度シリカ及びその製造方法 |
| EP1420035B1 (en) | 2002-11-12 | 2007-06-06 | Nitto Denko Corporation | Filled epoxy resin composition for semiconductor encapsulation and semiconductor using same |
| JP2012142439A (ja) * | 2010-12-28 | 2012-07-26 | Jgc Catalysts & Chemicals Ltd | 半導体装置実装用ペ−スト |
| JP6011361B2 (ja) * | 2013-01-25 | 2016-10-19 | 株式会社ニコン | シリカ粒子分散液の製造方法およびシリカ粒子分散液を用いた研磨方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5125235A (enrdf_load_stackoverflow) * | 1974-08-23 | 1976-03-01 | Ichikoh Industries Ltd | |
| JPS54141569A (en) * | 1978-04-26 | 1979-11-02 | Toshiba Corp | Semiconductor device |
| JPS554952A (en) * | 1978-06-28 | 1980-01-14 | Toshiba Corp | Semiconductor device |
| JPS5610947A (en) * | 1979-07-10 | 1981-02-03 | Toshiba Corp | Semiconductor sealing resin composition |
| JPS5659837A (en) * | 1979-09-28 | 1981-05-23 | Hitachi Chem Co Ltd | Epoxy resin composition |
| JPS5693749A (en) * | 1979-12-27 | 1981-07-29 | Hitachi Chem Co Ltd | Epoxy resin composition |
| JPS56116647A (en) * | 1980-02-20 | 1981-09-12 | Hitachi Ltd | Manufacturing of silica-alumina type filler for semiconductor memory element covering resin |
| JPS57195151A (en) * | 1981-05-27 | 1982-11-30 | Denki Kagaku Kogyo Kk | Low-radioactive resin composition |
| JPS57212224A (en) * | 1981-06-24 | 1982-12-27 | Nitto Electric Ind Co Ltd | Epoxy resin composition for encapsulation of semiconductor |
| JPS58145613A (ja) * | 1982-02-15 | 1983-08-30 | Denki Kagaku Kogyo Kk | 溶融シリカ球状体、その製造法およびその装置 |
| JPS5954632A (ja) * | 1982-09-21 | 1984-03-29 | Mitsubishi Metal Corp | 石英ガラス粉末の製造法 |
| JPS5955722A (ja) * | 1982-09-27 | 1984-03-30 | Nichias Corp | 弗素樹脂製隔膜の製造法 |
| JPS59107937A (ja) * | 1982-12-10 | 1984-06-22 | Seiko Epson Corp | 石英ガラスの製造法 |
-
1984
- 1984-07-31 JP JP15913384A patent/JPS6140811A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6140811A (ja) | 1986-02-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |