JPH01246393A - 内層用銅箔または銅張積層板の表面処理方法 - Google Patents

内層用銅箔または銅張積層板の表面処理方法

Info

Publication number
JPH01246393A
JPH01246393A JP63072706A JP7270688A JPH01246393A JP H01246393 A JPH01246393 A JP H01246393A JP 63072706 A JP63072706 A JP 63072706A JP 7270688 A JP7270688 A JP 7270688A JP H01246393 A JPH01246393 A JP H01246393A
Authority
JP
Japan
Prior art keywords
copper
inner layer
hydrochloric acid
copper foil
foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63072706A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0335394B2 (OSRAM
Inventor
Toshiyuki Kajiwara
俊之 梶原
Katsuto Fukuda
勝人 福田
Masato Takami
正人 高見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fukuda Metal Foil and Powder Co Ltd
Original Assignee
Fukuda Metal Foil and Powder Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fukuda Metal Foil and Powder Co Ltd filed Critical Fukuda Metal Foil and Powder Co Ltd
Priority to JP63072706A priority Critical patent/JPH01246393A/ja
Priority to EP89302924A priority patent/EP0334657B1/en
Priority to DE68919498T priority patent/DE68919498T2/de
Priority to US07/327,552 priority patent/US4981560A/en
Publication of JPH01246393A publication Critical patent/JPH01246393A/ja
Publication of JPH0335394B2 publication Critical patent/JPH0335394B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP63072706A 1988-03-25 1988-03-25 内層用銅箔または銅張積層板の表面処理方法 Granted JPH01246393A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP63072706A JPH01246393A (ja) 1988-03-25 1988-03-25 内層用銅箔または銅張積層板の表面処理方法
EP89302924A EP0334657B1 (en) 1988-03-25 1989-03-23 Method of surface treatment of copper foil or copper clad laminate for internal layer
DE68919498T DE68919498T2 (de) 1988-03-25 1989-03-23 Verfahren für die Oberflächenbehandlung einer Kupferfolie oder eines kupferbeschichteten Laminates zur Verwendung als Innenschicht.
US07/327,552 US4981560A (en) 1988-03-25 1989-03-23 Method of surface treatment of copper foil or a copper clad laminate for internal layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63072706A JPH01246393A (ja) 1988-03-25 1988-03-25 内層用銅箔または銅張積層板の表面処理方法

Publications (2)

Publication Number Publication Date
JPH01246393A true JPH01246393A (ja) 1989-10-02
JPH0335394B2 JPH0335394B2 (OSRAM) 1991-05-28

Family

ID=13497064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63072706A Granted JPH01246393A (ja) 1988-03-25 1988-03-25 内層用銅箔または銅張積層板の表面処理方法

Country Status (4)

Country Link
US (1) US4981560A (OSRAM)
EP (1) EP0334657B1 (OSRAM)
JP (1) JPH01246393A (OSRAM)
DE (1) DE68919498T2 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005206915A (ja) * 2004-01-26 2005-08-04 Fukuda Metal Foil & Powder Co Ltd プリント配線板用銅箔及びその製造方法

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5869130A (en) * 1997-06-12 1999-02-09 Mac Dermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US6146701A (en) * 1997-06-12 2000-11-14 Macdermid, Incorporated Process for improving the adhension of polymeric materials to metal surfaces
US6162503A (en) * 1997-06-12 2000-12-19 Macdermid, Incorporated Process for improving the adhesion of polymeric materials to metal surfaces
US6020029A (en) * 1997-06-12 2000-02-01 Macdermid, Incorporated Process for treating metal surfaces
US6120639A (en) * 1997-11-17 2000-09-19 Macdermid, Incorporated Method for the manufacture of printed circuit boards
US6383272B1 (en) 2000-06-08 2002-05-07 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6419784B1 (en) 2000-06-21 2002-07-16 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
RU2185463C2 (ru) * 2000-06-26 2002-07-20 Закрытое акционерное общество "Кабелькомплект" Электролит для нанесения медного покрытия
US6554948B1 (en) 2000-08-22 2003-04-29 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US20040161545A1 (en) * 2000-11-28 2004-08-19 Shipley Company, L.L.C. Adhesion method
US6746547B2 (en) 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper
US7186305B2 (en) * 2002-11-26 2007-03-06 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
TWI232710B (en) * 2004-05-17 2005-05-11 Hannstar Display Corp Printed circuit board
US20060065365A1 (en) * 2004-09-30 2006-03-30 Ferrier Donald R Melamine-formaldehyde post-dip composition for improving adhesion of metal to polymer
KR20060045208A (ko) * 2004-11-12 2006-05-17 삼성테크윈 주식회사 반도체 팩키지용 회로기판 및 이의 제조방법
US20070246158A1 (en) * 2006-04-21 2007-10-25 3M Innovative Properties Company Wiring board, production process thereof and connection method using same
US7704562B2 (en) * 2006-08-14 2010-04-27 Cordani Jr John L Process for improving the adhesion of polymeric materials to metal surfaces
US8088246B2 (en) 2009-01-08 2012-01-03 Cordani Jr John L Process for improving the adhesion of polymeric materials to metal surfaces
US8512504B2 (en) 2009-05-06 2013-08-20 Steven A. Castaldi Process for improving adhesion of polymeric materials to metal surfaces
US8308893B2 (en) * 2010-02-01 2012-11-13 Ming De Wang Nano-oxide process for bonding copper/copper alloy and resin
KR101933529B1 (ko) * 2012-12-28 2019-03-15 동우 화인켐 주식회사 구리계 금속막의 식각액 조성물 및 이를 이용한 액정표시장치용 어레이 기판의 제조방법
KR20150025245A (ko) * 2013-08-28 2015-03-10 삼성전기주식회사 인쇄회로기판용 동박 적층판 및 그의 제조방법
CN110004468B (zh) * 2019-04-20 2021-03-23 山东金盛源电子材料有限公司 一种制备低脆性电解铜箔的复合添加剂
KR102190217B1 (ko) * 2019-09-30 2020-12-14 케이지이티에스(주) 전기동으로부터 구리도금용 고순도 산화제2구리를 제조하는 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529128A (en) * 1978-08-23 1980-03-01 Mitsui Mining & Smelting Co Method of surface treating printed circuit copper foil
JPS5530818A (en) * 1978-08-25 1980-03-04 Mitsui Mining & Smelting Co Method of surface treating printed circuit copper foil
JPS60133794A (ja) * 1983-12-21 1985-07-16 富士通株式会社 多層プリント基板の製造方法
JPS60143689A (ja) * 1983-12-29 1985-07-29 株式会社日立製作所 絶縁板上の回路形成法
JPS6113400A (ja) * 1984-06-29 1986-01-21 株式会社京三製作所 信号灯の監視制御システム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005206915A (ja) * 2004-01-26 2005-08-04 Fukuda Metal Foil & Powder Co Ltd プリント配線板用銅箔及びその製造方法

Also Published As

Publication number Publication date
DE68919498D1 (de) 1995-01-12
EP0334657B1 (en) 1994-11-30
JPH0335394B2 (OSRAM) 1991-05-28
EP0334657A3 (en) 1989-11-15
DE68919498T2 (de) 1995-05-18
US4981560A (en) 1991-01-01
EP0334657A2 (en) 1989-09-27

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Legal Events

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LAPS Cancellation because of no payment of annual fees