JPH01152735A - 樹脂封止型電子部品の製造方法 - Google Patents
樹脂封止型電子部品の製造方法Info
- Publication number
- JPH01152735A JPH01152735A JP62313328A JP31332887A JPH01152735A JP H01152735 A JPH01152735 A JP H01152735A JP 62313328 A JP62313328 A JP 62313328A JP 31332887 A JP31332887 A JP 31332887A JP H01152735 A JPH01152735 A JP H01152735A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- runner
- lead frame
- guide hole
- resin body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 71
- 229920005989 resin Polymers 0.000 title claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000000565 sealant Substances 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract description 28
- 229910000679 solder Inorganic materials 0.000 abstract description 18
- 239000004065 semiconductor Substances 0.000 abstract description 13
- 238000007789 sealing Methods 0.000 abstract description 7
- 239000011800 void material Substances 0.000 abstract description 6
- 230000000903 blocking effect Effects 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000007493 shaping process Methods 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62313328A JPH01152735A (ja) | 1987-12-10 | 1987-12-10 | 樹脂封止型電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62313328A JPH01152735A (ja) | 1987-12-10 | 1987-12-10 | 樹脂封止型電子部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01152735A true JPH01152735A (ja) | 1989-06-15 |
| JPH0458180B2 JPH0458180B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-09-16 |
Family
ID=18039911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62313328A Granted JPH01152735A (ja) | 1987-12-10 | 1987-12-10 | 樹脂封止型電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01152735A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04276648A (ja) * | 1991-03-04 | 1992-10-01 | Rohm Co Ltd | 電子部品製造用フレーム、およびこれを用いた電子部品製造方法、ならびにこの製造方法により製造された電子部品 |
| JP2014157855A (ja) * | 2013-02-14 | 2014-08-28 | Dainippon Printing Co Ltd | 樹脂付きリードフレームの多面付け体、光半導体装置の多面付け体 |
-
1987
- 1987-12-10 JP JP62313328A patent/JPH01152735A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04276648A (ja) * | 1991-03-04 | 1992-10-01 | Rohm Co Ltd | 電子部品製造用フレーム、およびこれを用いた電子部品製造方法、ならびにこの製造方法により製造された電子部品 |
| JP2014157855A (ja) * | 2013-02-14 | 2014-08-28 | Dainippon Printing Co Ltd | 樹脂付きリードフレームの多面付け体、光半導体装置の多面付け体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0458180B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1992-09-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3971435B2 (ja) | 半導体集積回路装置 | |
| US5710064A (en) | Method for manufacturing a semiconductor package | |
| DE19640255C2 (de) | Verfahren zur Herstellung eines elektronischen Moduls mit einem kunststoffumspritzten Leadframe | |
| JPH01118364A (ja) | 予備半田ディップ方法 | |
| JPH01152735A (ja) | 樹脂封止型電子部品の製造方法 | |
| KR960010011B1 (ko) | 플라스틱 핀 그리드 어레이 실장 제조공정 | |
| US9111952B2 (en) | Semiconductor device | |
| EP0250450A1 (en) | Lead finishing for a surface mount package | |
| JP3243951B2 (ja) | 電子部品の製造方法 | |
| JPS62196840A (ja) | 半導体装置及びその製造方法 | |
| JPH03264140A (ja) | 半導体装置のリードカツト方法 | |
| JPS62142338A (ja) | 半導体装置用パツケ−ジ | |
| JPH04171855A (ja) | 半導体装置用リードフレーム | |
| JPH03171760A (ja) | 半導体装置の製造方法 | |
| JP2537630B2 (ja) | 半導体装置の製造方法 | |
| JPH01298754A (ja) | リードフレームおよびそれを用いた電子部品の製造方法 | |
| JPH04326755A (ja) | 樹脂封止型半導体装置およびその製造方法 | |
| KR930007173Y1 (ko) | 리드프레임 구멍 삽입랙 | |
| JPH0289349A (ja) | Ｔａｂ用フィルムキャリアテープ | |
| JPH04137657A (ja) | 混成集積回路基板 | |
| JPH01223755A (ja) | 半導体装置用リードフレーム | |
| JPH01111363A (ja) | 半導体装置の製造方法 | |
| JP2917556B2 (ja) | 絶縁物封止型電子部品の製造方法 | |
| JPS60257549A (ja) | 半導体装置 | |
| JPH04364766A (ja) | 半導体装置の製造方法および半導体装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |