JP7813797B2 - 電気素子実装用基板および電気装置 - Google Patents

電気素子実装用基板および電気装置

Info

Publication number
JP7813797B2
JP7813797B2 JP2023538642A JP2023538642A JP7813797B2 JP 7813797 B2 JP7813797 B2 JP 7813797B2 JP 2023538642 A JP2023538642 A JP 2023538642A JP 2023538642 A JP2023538642 A JP 2023538642A JP 7813797 B2 JP7813797 B2 JP 7813797B2
Authority
JP
Japan
Prior art keywords
substrate
element mounting
electric element
mounting
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023538642A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023008566A1 (https=
JPWO2023008566A5 (https=
Inventor
和弘 岡本
真光 柴田
泉太郎 山元
有平 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2023008566A1 publication Critical patent/JPWO2023008566A1/ja
Publication of JPWO2023008566A5 publication Critical patent/JPWO2023008566A5/ja
Application granted granted Critical
Publication of JP7813797B2 publication Critical patent/JP7813797B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023538642A 2021-07-30 2022-07-29 電気素子実装用基板および電気装置 Active JP7813797B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021126316 2021-07-30
JP2021126316 2021-07-30
PCT/JP2022/029326 WO2023008566A1 (ja) 2021-07-30 2022-07-29 電気素子実装用基板および電気装置

Publications (3)

Publication Number Publication Date
JPWO2023008566A1 JPWO2023008566A1 (https=) 2023-02-02
JPWO2023008566A5 JPWO2023008566A5 (https=) 2024-04-12
JP7813797B2 true JP7813797B2 (ja) 2026-02-13

Family

ID=85086892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023538642A Active JP7813797B2 (ja) 2021-07-30 2022-07-29 電気素子実装用基板および電気装置

Country Status (5)

Country Link
US (1) US20240251505A1 (https=)
EP (1) EP4379803A1 (https=)
JP (1) JP7813797B2 (https=)
CN (1) CN117730415A (https=)
WO (1) WO2023008566A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025143246A1 (ja) * 2023-12-28 2025-07-03 京セラ株式会社 配線基板および半導体デバイス
WO2025143247A1 (ja) * 2023-12-28 2025-07-03 京セラ株式会社 配線基板および半導体デバイス

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011134777A (ja) 2009-12-22 2011-07-07 Panasonic Electric Works Co Ltd 回路基板、回路モジュール、回路基板の製造方法および回路モジュールの製造方法
WO2014002860A1 (ja) 2012-06-29 2014-01-03 ソニー株式会社 カメラモジュールおよび電子機器
JP2017037929A (ja) 2015-08-07 2017-02-16 日本特殊陶業株式会社 多層配線基板およびその製造方法
JP2019009381A (ja) 2017-06-28 2019-01-17 京セラ株式会社 撮像装置用蓋体および撮像装置
WO2019021705A1 (ja) 2017-07-25 2019-01-31 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置
WO2019087764A1 (ja) 2017-10-30 2019-05-09 ソニーセミコンダクタソリューションズ株式会社 裏面照射型の固体撮像装置、および裏面照射型の固体撮像装置の製造方法、撮像装置、並びに電子機器
JP2020004901A (ja) 2018-06-29 2020-01-09 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7025819B2 (ja) 2017-10-26 2022-02-25 京セラ株式会社 撮像素子実装用基板、撮像装置および撮像モジュール

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011134777A (ja) 2009-12-22 2011-07-07 Panasonic Electric Works Co Ltd 回路基板、回路モジュール、回路基板の製造方法および回路モジュールの製造方法
WO2014002860A1 (ja) 2012-06-29 2014-01-03 ソニー株式会社 カメラモジュールおよび電子機器
JP2017037929A (ja) 2015-08-07 2017-02-16 日本特殊陶業株式会社 多層配線基板およびその製造方法
JP2019009381A (ja) 2017-06-28 2019-01-17 京セラ株式会社 撮像装置用蓋体および撮像装置
WO2019021705A1 (ja) 2017-07-25 2019-01-31 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置
WO2019087764A1 (ja) 2017-10-30 2019-05-09 ソニーセミコンダクタソリューションズ株式会社 裏面照射型の固体撮像装置、および裏面照射型の固体撮像装置の製造方法、撮像装置、並びに電子機器
JP2020004901A (ja) 2018-06-29 2020-01-09 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法

Also Published As

Publication number Publication date
CN117730415A (zh) 2024-03-19
EP4379803A1 (en) 2024-06-05
US20240251505A1 (en) 2024-07-25
WO2023008566A1 (ja) 2023-02-02
JPWO2023008566A1 (https=) 2023-02-02

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