JPWO2023008566A1 - - Google Patents

Info

Publication number
JPWO2023008566A1
JPWO2023008566A1 JP2023538642A JP2023538642A JPWO2023008566A1 JP WO2023008566 A1 JPWO2023008566 A1 JP WO2023008566A1 JP 2023538642 A JP2023538642 A JP 2023538642A JP 2023538642 A JP2023538642 A JP 2023538642A JP WO2023008566 A1 JPWO2023008566 A1 JP WO2023008566A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023538642A
Other languages
Japanese (ja)
Other versions
JP7813797B2 (ja
JPWO2023008566A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023008566A1 publication Critical patent/JPWO2023008566A1/ja
Publication of JPWO2023008566A5 publication Critical patent/JPWO2023008566A5/ja
Application granted granted Critical
Publication of JP7813797B2 publication Critical patent/JP7813797B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023538642A 2021-07-30 2022-07-29 電気素子実装用基板および電気装置 Active JP7813797B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021126316 2021-07-30
JP2021126316 2021-07-30
PCT/JP2022/029326 WO2023008566A1 (ja) 2021-07-30 2022-07-29 電気素子実装用基板および電気装置

Publications (3)

Publication Number Publication Date
JPWO2023008566A1 true JPWO2023008566A1 (https=) 2023-02-02
JPWO2023008566A5 JPWO2023008566A5 (https=) 2024-04-12
JP7813797B2 JP7813797B2 (ja) 2026-02-13

Family

ID=85086892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023538642A Active JP7813797B2 (ja) 2021-07-30 2022-07-29 電気素子実装用基板および電気装置

Country Status (5)

Country Link
US (1) US20240251505A1 (https=)
EP (1) EP4379803A1 (https=)
JP (1) JP7813797B2 (https=)
CN (1) CN117730415A (https=)
WO (1) WO2023008566A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025143246A1 (ja) * 2023-12-28 2025-07-03 京セラ株式会社 配線基板および半導体デバイス
WO2025143247A1 (ja) * 2023-12-28 2025-07-03 京セラ株式会社 配線基板および半導体デバイス

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011134777A (ja) * 2009-12-22 2011-07-07 Panasonic Electric Works Co Ltd 回路基板、回路モジュール、回路基板の製造方法および回路モジュールの製造方法
WO2014002860A1 (ja) * 2012-06-29 2014-01-03 ソニー株式会社 カメラモジュールおよび電子機器
JP2017037929A (ja) * 2015-08-07 2017-02-16 日本特殊陶業株式会社 多層配線基板およびその製造方法
JP2019009381A (ja) * 2017-06-28 2019-01-17 京セラ株式会社 撮像装置用蓋体および撮像装置
WO2019021705A1 (ja) * 2017-07-25 2019-01-31 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置
WO2019087764A1 (ja) * 2017-10-30 2019-05-09 ソニーセミコンダクタソリューションズ株式会社 裏面照射型の固体撮像装置、および裏面照射型の固体撮像装置の製造方法、撮像装置、並びに電子機器
JP2020004901A (ja) * 2018-06-29 2020-01-09 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7025819B2 (ja) 2017-10-26 2022-02-25 京セラ株式会社 撮像素子実装用基板、撮像装置および撮像モジュール

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011134777A (ja) * 2009-12-22 2011-07-07 Panasonic Electric Works Co Ltd 回路基板、回路モジュール、回路基板の製造方法および回路モジュールの製造方法
WO2014002860A1 (ja) * 2012-06-29 2014-01-03 ソニー株式会社 カメラモジュールおよび電子機器
JP2017037929A (ja) * 2015-08-07 2017-02-16 日本特殊陶業株式会社 多層配線基板およびその製造方法
JP2019009381A (ja) * 2017-06-28 2019-01-17 京セラ株式会社 撮像装置用蓋体および撮像装置
WO2019021705A1 (ja) * 2017-07-25 2019-01-31 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置
WO2019087764A1 (ja) * 2017-10-30 2019-05-09 ソニーセミコンダクタソリューションズ株式会社 裏面照射型の固体撮像装置、および裏面照射型の固体撮像装置の製造方法、撮像装置、並びに電子機器
JP2020004901A (ja) * 2018-06-29 2020-01-09 ソニーセミコンダクタソリューションズ株式会社 撮像装置および撮像装置の製造方法

Also Published As

Publication number Publication date
CN117730415A (zh) 2024-03-19
EP4379803A1 (en) 2024-06-05
US20240251505A1 (en) 2024-07-25
JP7813797B2 (ja) 2026-02-13
WO2023008566A1 (ja) 2023-02-02

Similar Documents

Publication Publication Date Title
BR112023005462A2 (https=)
BR112023012656A2 (https=)
BR112021014123A2 (https=)
BR112023009656A2 (https=)
BR112022009896A2 (https=)
BR112021017747A2 (https=)
JPWO2023008566A1 (https=)
BR112022024743A2 (https=)
BR112022026905A2 (https=)
BR112023011738A2 (https=)
BR112023004146A2 (https=)
BR112023006729A2 (https=)
BR102021018859A2 (https=)
BR102021015500A2 (https=)
BR112023016292A2 (https=)
BR112023011539A2 (https=)
BR112023011610A2 (https=)
BR112023008976A2 (https=)
BR102021020147A2 (https=)
BR102021018926A2 (https=)
BR102021018167A2 (https=)
BR102021017576A2 (https=)
BR102021016837A2 (https=)
BR102021016551A2 (https=)
BR102021016375A2 (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240115

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240115

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250311

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20250502

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250709

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20251104

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251216

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20260106

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20260202

R150 Certificate of patent or registration of utility model

Ref document number: 7813797

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150