JPWO2023008566A5 - - Google Patents
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- Publication number
- JPWO2023008566A5 JPWO2023008566A5 JP2023538642A JP2023538642A JPWO2023008566A5 JP WO2023008566 A5 JPWO2023008566 A5 JP WO2023008566A5 JP 2023538642 A JP2023538642 A JP 2023538642A JP 2023538642 A JP2023538642 A JP 2023538642A JP WO2023008566 A5 JPWO2023008566 A5 JP WO2023008566A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- element mounting
- mounting
- electric element
- electrical element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021126316 | 2021-07-30 | ||
| JP2021126316 | 2021-07-30 | ||
| PCT/JP2022/029326 WO2023008566A1 (ja) | 2021-07-30 | 2022-07-29 | 電気素子実装用基板および電気装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023008566A1 JPWO2023008566A1 (https=) | 2023-02-02 |
| JPWO2023008566A5 true JPWO2023008566A5 (https=) | 2024-04-12 |
| JP7813797B2 JP7813797B2 (ja) | 2026-02-13 |
Family
ID=85086892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023538642A Active JP7813797B2 (ja) | 2021-07-30 | 2022-07-29 | 電気素子実装用基板および電気装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240251505A1 (https=) |
| EP (1) | EP4379803A1 (https=) |
| JP (1) | JP7813797B2 (https=) |
| CN (1) | CN117730415A (https=) |
| WO (1) | WO2023008566A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025143246A1 (ja) * | 2023-12-28 | 2025-07-03 | 京セラ株式会社 | 配線基板および半導体デバイス |
| WO2025143247A1 (ja) * | 2023-12-28 | 2025-07-03 | 京セラ株式会社 | 配線基板および半導体デバイス |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011134777A (ja) * | 2009-12-22 | 2011-07-07 | Panasonic Electric Works Co Ltd | 回路基板、回路モジュール、回路基板の製造方法および回路モジュールの製造方法 |
| EP2869549B1 (en) * | 2012-06-29 | 2018-08-08 | Sony Corporation | Camera module and electronic device |
| JP6502205B2 (ja) * | 2015-08-07 | 2019-04-17 | 日本特殊陶業株式会社 | 多層配線基板およびその製造方法 |
| JP6951134B2 (ja) * | 2017-06-28 | 2021-10-20 | 京セラ株式会社 | 撮像装置用蓋体および撮像装置 |
| US11405569B2 (en) * | 2017-07-25 | 2022-08-02 | Sony Semiconductor Solutions Corporation | Solid-state imaging device |
| JP7025819B2 (ja) | 2017-10-26 | 2022-02-25 | 京セラ株式会社 | 撮像素子実装用基板、撮像装置および撮像モジュール |
| TWI905469B (zh) | 2017-10-30 | 2025-11-21 | 日商索尼半導體解決方案公司 | 固體攝像裝置及電子機器 |
| JP2020004901A (ja) * | 2018-06-29 | 2020-01-09 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置および撮像装置の製造方法 |
-
2022
- 2022-07-29 WO PCT/JP2022/029326 patent/WO2023008566A1/ja not_active Ceased
- 2022-07-29 US US18/293,247 patent/US20240251505A1/en active Pending
- 2022-07-29 CN CN202280051249.8A patent/CN117730415A/zh active Pending
- 2022-07-29 EP EP22849626.1A patent/EP4379803A1/en not_active Withdrawn
- 2022-07-29 JP JP2023538642A patent/JP7813797B2/ja active Active
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