JPWO2023008566A5 - - Google Patents
Download PDFInfo
- Publication number
- JPWO2023008566A5 JPWO2023008566A5 JP2023538642A JP2023538642A JPWO2023008566A5 JP WO2023008566 A5 JPWO2023008566 A5 JP WO2023008566A5 JP 2023538642 A JP2023538642 A JP 2023538642A JP 2023538642 A JP2023538642 A JP 2023538642A JP WO2023008566 A5 JPWO2023008566 A5 JP WO2023008566A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- element mounting
- mounting
- electric element
- electrical element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021126316 | 2021-07-30 | ||
| JP2021126316 | 2021-07-30 | ||
| PCT/JP2022/029326 WO2023008566A1 (ja) | 2021-07-30 | 2022-07-29 | 電気素子実装用基板および電気装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023008566A1 JPWO2023008566A1 (https=) | 2023-02-02 |
| JPWO2023008566A5 true JPWO2023008566A5 (https=) | 2024-04-12 |
| JP7813797B2 JP7813797B2 (ja) | 2026-02-13 |
Family
ID=85086892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023538642A Active JP7813797B2 (ja) | 2021-07-30 | 2022-07-29 | 電気素子実装用基板および電気装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240251505A1 (https=) |
| EP (1) | EP4379803A1 (https=) |
| JP (1) | JP7813797B2 (https=) |
| CN (1) | CN117730415A (https=) |
| WO (1) | WO2023008566A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025143246A1 (ja) * | 2023-12-28 | 2025-07-03 | 京セラ株式会社 | 配線基板および半導体デバイス |
| WO2025143247A1 (ja) * | 2023-12-28 | 2025-07-03 | 京セラ株式会社 | 配線基板および半導体デバイス |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011134777A (ja) * | 2009-12-22 | 2011-07-07 | Panasonic Electric Works Co Ltd | 回路基板、回路モジュール、回路基板の製造方法および回路モジュールの製造方法 |
| CN104380705B (zh) | 2012-06-29 | 2018-01-19 | 索尼公司 | 相机模块和电子设备 |
| JP6502205B2 (ja) | 2015-08-07 | 2019-04-17 | 日本特殊陶業株式会社 | 多層配線基板およびその製造方法 |
| JP6951134B2 (ja) | 2017-06-28 | 2021-10-20 | 京セラ株式会社 | 撮像装置用蓋体および撮像装置 |
| US11405569B2 (en) * | 2017-07-25 | 2022-08-02 | Sony Semiconductor Solutions Corporation | Solid-state imaging device |
| CN111466028A (zh) | 2017-10-26 | 2020-07-28 | 京瓷株式会社 | 摄像元件安装用基板、摄像装置以及摄像模块 |
| TWI905469B (zh) | 2017-10-30 | 2025-11-21 | 日商索尼半導體解決方案公司 | 固體攝像裝置及電子機器 |
| JP2020004901A (ja) | 2018-06-29 | 2020-01-09 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置および撮像装置の製造方法 |
-
2022
- 2022-07-29 JP JP2023538642A patent/JP7813797B2/ja active Active
- 2022-07-29 US US18/293,247 patent/US20240251505A1/en active Pending
- 2022-07-29 WO PCT/JP2022/029326 patent/WO2023008566A1/ja not_active Ceased
- 2022-07-29 EP EP22849626.1A patent/EP4379803A1/en not_active Withdrawn
- 2022-07-29 CN CN202280051249.8A patent/CN117730415A/zh active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5851439B2 (ja) | 高周波半導体用パッケージ | |
| US20040061138A1 (en) | Power semiconductor device with high radiating efficiency | |
| US10159166B2 (en) | Heat dissipating structure | |
| CN102340973A (zh) | 控制装置 | |
| CN104425399A (zh) | 半导体模块 | |
| KR20110090762A (ko) | 반도체 소자 수납용 패키지 및 그것을 사용한 반도체 장치 | |
| JPWO2023008566A5 (https=) | ||
| JP2020047765A (ja) | 電気機器及び放熱器 | |
| JP2008187146A (ja) | 回路装置 | |
| KR102543495B1 (ko) | 다면 방열구조를 갖는 pcb 모듈, 및 이 모듈에 사용되는 방열 플레이트, 다층 pcb 어셈블리, 및 모듈 케이스 | |
| JP6058171B2 (ja) | オプトエレクトロニクス部品およびオプトエレクトロニクス部品を有する電子装置 | |
| US20170303385A1 (en) | Heat dissipating structure | |
| US12159820B2 (en) | Flat no-lead package with surface mounted structure | |
| KR20140073087A (ko) | 이미지 센서 패키지 | |
| CN110798961A (zh) | 一种电路板及具有其的光模块 | |
| CN106531693B (zh) | 半导体装置 | |
| JP5277597B2 (ja) | モジュール | |
| KR20060105403A (ko) | 혼성회로와 복합기판을 가지는 패키지 구조물 | |
| JP2795063B2 (ja) | 混成集積回路装置 | |
| US10917972B2 (en) | Switching device and electronic device | |
| CN102460696B (zh) | 光电子半导体器件 | |
| JP2001237368A (ja) | パワーモジュール | |
| KR102592659B1 (ko) | 다면 방열구조를 갖는 pcb 모듈 및 이 모듈에 사용되는 다층 pcb 어셈블리 | |
| WO2016067390A1 (ja) | 放熱構造 | |
| JP2013093620A (ja) | モジュール |