JP7791217B2 - 半導体モジュール - Google Patents

半導体モジュール

Info

Publication number
JP7791217B2
JP7791217B2 JP2023577087A JP2023577087A JP7791217B2 JP 7791217 B2 JP7791217 B2 JP 7791217B2 JP 2023577087 A JP2023577087 A JP 2023577087A JP 2023577087 A JP2023577087 A JP 2023577087A JP 7791217 B2 JP7791217 B2 JP 7791217B2
Authority
JP
Japan
Prior art keywords
substrate
leg
region
longitudinal direction
semiconductor module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023577087A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023145964A1 (https=
JPWO2023145964A5 (https=
Inventor
崇 山本
知幸 赤星
咲季 辻野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2023145964A1 publication Critical patent/JPWO2023145964A1/ja
Publication of JPWO2023145964A5 publication Critical patent/JPWO2023145964A5/ja
Application granted granted Critical
Publication of JP7791217B2 publication Critical patent/JP7791217B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/20—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
    • H10H29/24—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/858—Means for heat extraction or cooling
    • H10H29/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/858—Means for heat extraction or cooling
    • H10H29/8583—Means for heat extraction or cooling not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023577087A 2022-01-31 2023-01-31 半導体モジュール Active JP7791217B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022013589 2022-01-31
JP2022013589 2022-01-31
PCT/JP2023/003039 WO2023145964A1 (ja) 2022-01-31 2023-01-31 半導体モジュール

Publications (3)

Publication Number Publication Date
JPWO2023145964A1 JPWO2023145964A1 (https=) 2023-08-03
JPWO2023145964A5 JPWO2023145964A5 (https=) 2024-10-04
JP7791217B2 true JP7791217B2 (ja) 2025-12-23

Family

ID=87471787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023577087A Active JP7791217B2 (ja) 2022-01-31 2023-01-31 半導体モジュール

Country Status (5)

Country Link
US (1) US20250164719A1 (https=)
EP (1) EP4475180A1 (https=)
JP (1) JP7791217B2 (https=)
CN (1) CN118633154A (https=)
WO (1) WO2023145964A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001111158A (ja) 1999-10-13 2001-04-20 Sumitomo Electric Ind Ltd 光通信モジュールおよびその製造方法
JP2003264388A (ja) 2002-03-08 2003-09-19 Toshiba Kyaria Kk 電気部品装置
JP2010141279A (ja) 2008-11-14 2010-06-24 Calsonic Kansei Corp 素子の放熱構造及び方法
JP2010175911A (ja) 2009-01-30 2010-08-12 Furukawa Electric Co Ltd:The 並列光伝送装置
JP2014138102A (ja) 2013-01-17 2014-07-28 Yamaha Corp 熱電発電ユニット
JP2014178383A (ja) 2013-03-13 2014-09-25 Hitachi Metals Ltd 通信モジュール及びそれを備えた信号伝送装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3793648B2 (ja) 1998-07-24 2006-07-05 三菱電機株式会社 マルチチップモジュールの製造方法
JP3946975B2 (ja) * 2001-10-09 2007-07-18 富士通株式会社 冷却装置
WO2015045648A1 (ja) * 2013-09-30 2015-04-02 富士電機株式会社 半導体装置、半導体装置の組み立て方法、半導体装置用部品及び単位モジュール

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001111158A (ja) 1999-10-13 2001-04-20 Sumitomo Electric Ind Ltd 光通信モジュールおよびその製造方法
JP2003264388A (ja) 2002-03-08 2003-09-19 Toshiba Kyaria Kk 電気部品装置
JP2010141279A (ja) 2008-11-14 2010-06-24 Calsonic Kansei Corp 素子の放熱構造及び方法
JP2010175911A (ja) 2009-01-30 2010-08-12 Furukawa Electric Co Ltd:The 並列光伝送装置
JP2014138102A (ja) 2013-01-17 2014-07-28 Yamaha Corp 熱電発電ユニット
JP2014178383A (ja) 2013-03-13 2014-09-25 Hitachi Metals Ltd 通信モジュール及びそれを備えた信号伝送装置

Also Published As

Publication number Publication date
EP4475180A1 (en) 2024-12-11
JPWO2023145964A1 (https=) 2023-08-03
WO2023145964A1 (ja) 2023-08-03
CN118633154A (zh) 2024-09-10
US20250164719A1 (en) 2025-05-22

Similar Documents

Publication Publication Date Title
JP7339075B2 (ja) 電気機器、電子制御装置
US6967845B2 (en) Integrated heat dissipating device with curved fins
KR101084880B1 (ko) 다이 패키지와 시스템 보드 사이의 접속들의 변형
JP7549469B2 (ja) 電子制御装置
US6670699B2 (en) Semiconductor device packaging structure
JP2901835B2 (ja) 半導体装置
US20080192428A1 (en) Thermal management system for computers
JPH09223883A (ja) 電子機器の冷却装置
JP7709902B2 (ja) 電子制御装置
JP7791217B2 (ja) 半導体モジュール
JP3840970B2 (ja) ヒートシンク
JP4199915B2 (ja) 電子モジュール及びその実装装置
JP7817919B2 (ja) 電子制御装置
KR101996616B1 (ko) 방열 장치를 구비하는 전자기기
TWI726668B (zh) 散熱組件
JPH01133338A (ja) ヒートシンク
JP2006210611A (ja) 放熱フィンを備えたヒートシンク及びその製造方法。
TWI810845B (zh) 固定裝置
JPH11145349A (ja) 強制冷却用ヒートシンク
WO2024071110A1 (ja) 半導体モジュール
JPH03208398A (ja) 半導体装置
JP3000846B2 (ja) 電子部品用冷却装置
JPS5821179Y2 (ja) 半導体部品の放熱装置
TWM619527U (zh) 散熱組件及電子組件
JPH07202095A (ja) 電子デバイスの冷却装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240724

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240724

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250603

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250804

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250826

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20251016

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20251111

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20251211

R150 Certificate of patent or registration of utility model

Ref document number: 7791217

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150