JPWO2023145964A5 - - Google Patents

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Publication number
JPWO2023145964A5
JPWO2023145964A5 JP2023577087A JP2023577087A JPWO2023145964A5 JP WO2023145964 A5 JPWO2023145964 A5 JP WO2023145964A5 JP 2023577087 A JP2023577087 A JP 2023577087A JP 2023577087 A JP2023577087 A JP 2023577087A JP WO2023145964 A5 JPWO2023145964 A5 JP WO2023145964A5
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JP
Japan
Prior art keywords
substrate
leg
module according
semiconductor module
semiconductor
Prior art date
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Application number
JP2023577087A
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English (en)
Japanese (ja)
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JP7791217B2 (ja
JPWO2023145964A1 (https=
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Priority claimed from PCT/JP2023/003039 external-priority patent/WO2023145964A1/ja
Publication of JPWO2023145964A1 publication Critical patent/JPWO2023145964A1/ja
Publication of JPWO2023145964A5 publication Critical patent/JPWO2023145964A5/ja
Application granted granted Critical
Publication of JP7791217B2 publication Critical patent/JP7791217B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2023577087A 2022-01-31 2023-01-31 半導体モジュール Active JP7791217B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022013589 2022-01-31
JP2022013589 2022-01-31
PCT/JP2023/003039 WO2023145964A1 (ja) 2022-01-31 2023-01-31 半導体モジュール

Publications (3)

Publication Number Publication Date
JPWO2023145964A1 JPWO2023145964A1 (https=) 2023-08-03
JPWO2023145964A5 true JPWO2023145964A5 (https=) 2024-10-04
JP7791217B2 JP7791217B2 (ja) 2025-12-23

Family

ID=87471787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023577087A Active JP7791217B2 (ja) 2022-01-31 2023-01-31 半導体モジュール

Country Status (5)

Country Link
US (1) US20250164719A1 (https=)
EP (1) EP4475180A1 (https=)
JP (1) JP7791217B2 (https=)
CN (1) CN118633154A (https=)
WO (1) WO2023145964A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3793648B2 (ja) 1998-07-24 2006-07-05 三菱電機株式会社 マルチチップモジュールの製造方法
JP2001111158A (ja) 1999-10-13 2001-04-20 Sumitomo Electric Ind Ltd 光通信モジュールおよびその製造方法
JP3946975B2 (ja) * 2001-10-09 2007-07-18 富士通株式会社 冷却装置
JP2003264388A (ja) 2002-03-08 2003-09-19 Toshiba Kyaria Kk 電気部品装置
JP5388598B2 (ja) 2008-11-14 2014-01-15 カルソニックカンセイ株式会社 素子の放熱構造
JP5075139B2 (ja) 2009-01-30 2012-11-14 古河電気工業株式会社 並列光伝送装置
JP5751261B2 (ja) 2013-01-17 2015-07-22 ヤマハ株式会社 熱電発電ユニット
JP5904146B2 (ja) 2013-03-13 2016-04-13 日立金属株式会社 通信モジュール及びそれを備えた信号伝送装置
WO2015045648A1 (ja) * 2013-09-30 2015-04-02 富士電機株式会社 半導体装置、半導体装置の組み立て方法、半導体装置用部品及び単位モジュール

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