JPWO2023145964A1 - - Google Patents

Info

Publication number
JPWO2023145964A1
JPWO2023145964A1 JP2023577087A JP2023577087A JPWO2023145964A1 JP WO2023145964 A1 JPWO2023145964 A1 JP WO2023145964A1 JP 2023577087 A JP2023577087 A JP 2023577087A JP 2023577087 A JP2023577087 A JP 2023577087A JP WO2023145964 A1 JPWO2023145964 A1 JP WO2023145964A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023577087A
Other languages
Japanese (ja)
Other versions
JP7791217B2 (ja
JPWO2023145964A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023145964A1 publication Critical patent/JPWO2023145964A1/ja
Publication of JPWO2023145964A5 publication Critical patent/JPWO2023145964A5/ja
Application granted granted Critical
Publication of JP7791217B2 publication Critical patent/JP7791217B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/20—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
    • H10H29/24—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/858—Means for heat extraction or cooling
    • H10H29/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/858—Means for heat extraction or cooling
    • H10H29/8583—Means for heat extraction or cooling not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2023577087A 2022-01-31 2023-01-31 半導体モジュール Active JP7791217B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022013589 2022-01-31
JP2022013589 2022-01-31
PCT/JP2023/003039 WO2023145964A1 (ja) 2022-01-31 2023-01-31 半導体モジュール

Publications (3)

Publication Number Publication Date
JPWO2023145964A1 true JPWO2023145964A1 (https=) 2023-08-03
JPWO2023145964A5 JPWO2023145964A5 (https=) 2024-10-04
JP7791217B2 JP7791217B2 (ja) 2025-12-23

Family

ID=87471787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023577087A Active JP7791217B2 (ja) 2022-01-31 2023-01-31 半導体モジュール

Country Status (5)

Country Link
US (1) US20250164719A1 (https=)
EP (1) EP4475180A1 (https=)
JP (1) JP7791217B2 (https=)
CN (1) CN118633154A (https=)
WO (1) WO2023145964A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001111158A (ja) * 1999-10-13 2001-04-20 Sumitomo Electric Ind Ltd 光通信モジュールおよびその製造方法
JP2003264388A (ja) * 2002-03-08 2003-09-19 Toshiba Kyaria Kk 電気部品装置
JP2010141279A (ja) * 2008-11-14 2010-06-24 Calsonic Kansei Corp 素子の放熱構造及び方法
JP2010175911A (ja) * 2009-01-30 2010-08-12 Furukawa Electric Co Ltd:The 並列光伝送装置
JP2014138102A (ja) * 2013-01-17 2014-07-28 Yamaha Corp 熱電発電ユニット
JP2014178383A (ja) * 2013-03-13 2014-09-25 Hitachi Metals Ltd 通信モジュール及びそれを備えた信号伝送装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3793648B2 (ja) 1998-07-24 2006-07-05 三菱電機株式会社 マルチチップモジュールの製造方法
JP3946975B2 (ja) * 2001-10-09 2007-07-18 富士通株式会社 冷却装置
WO2015045648A1 (ja) * 2013-09-30 2015-04-02 富士電機株式会社 半導体装置、半導体装置の組み立て方法、半導体装置用部品及び単位モジュール

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001111158A (ja) * 1999-10-13 2001-04-20 Sumitomo Electric Ind Ltd 光通信モジュールおよびその製造方法
JP2003264388A (ja) * 2002-03-08 2003-09-19 Toshiba Kyaria Kk 電気部品装置
JP2010141279A (ja) * 2008-11-14 2010-06-24 Calsonic Kansei Corp 素子の放熱構造及び方法
JP2010175911A (ja) * 2009-01-30 2010-08-12 Furukawa Electric Co Ltd:The 並列光伝送装置
JP2014138102A (ja) * 2013-01-17 2014-07-28 Yamaha Corp 熱電発電ユニット
JP2014178383A (ja) * 2013-03-13 2014-09-25 Hitachi Metals Ltd 通信モジュール及びそれを備えた信号伝送装置

Also Published As

Publication number Publication date
JP7791217B2 (ja) 2025-12-23
EP4475180A1 (en) 2024-12-11
WO2023145964A1 (ja) 2023-08-03
CN118633154A (zh) 2024-09-10
US20250164719A1 (en) 2025-05-22

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