CN118633154A - 半导体模块 - Google Patents

半导体模块 Download PDF

Info

Publication number
CN118633154A
CN118633154A CN202380018981.XA CN202380018981A CN118633154A CN 118633154 A CN118633154 A CN 118633154A CN 202380018981 A CN202380018981 A CN 202380018981A CN 118633154 A CN118633154 A CN 118633154A
Authority
CN
China
Prior art keywords
substrate
region
semiconductor module
leg
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380018981.XA
Other languages
English (en)
Chinese (zh)
Inventor
山本崇
赤星知幸
辻野咲季
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN118633154A publication Critical patent/CN118633154A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
    • G02B6/4268—Cooling
    • G02B6/4269—Cooling with heat sinks or radiation fins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/20—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
    • H10H29/24—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/858—Means for heat extraction or cooling
    • H10H29/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/858—Means for heat extraction or cooling
    • H10H29/8583—Means for heat extraction or cooling not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202380018981.XA 2022-01-31 2023-01-31 半导体模块 Pending CN118633154A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-013589 2022-01-31
JP2022013589 2022-01-31
PCT/JP2023/003039 WO2023145964A1 (ja) 2022-01-31 2023-01-31 半導体モジュール

Publications (1)

Publication Number Publication Date
CN118633154A true CN118633154A (zh) 2024-09-10

Family

ID=87471787

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380018981.XA Pending CN118633154A (zh) 2022-01-31 2023-01-31 半导体模块

Country Status (5)

Country Link
US (1) US20250164719A1 (https=)
EP (1) EP4475180A1 (https=)
JP (1) JP7791217B2 (https=)
CN (1) CN118633154A (https=)
WO (1) WO2023145964A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3793648B2 (ja) 1998-07-24 2006-07-05 三菱電機株式会社 マルチチップモジュールの製造方法
JP2001111158A (ja) 1999-10-13 2001-04-20 Sumitomo Electric Ind Ltd 光通信モジュールおよびその製造方法
JP3946975B2 (ja) * 2001-10-09 2007-07-18 富士通株式会社 冷却装置
JP2003264388A (ja) 2002-03-08 2003-09-19 Toshiba Kyaria Kk 電気部品装置
JP5388598B2 (ja) 2008-11-14 2014-01-15 カルソニックカンセイ株式会社 素子の放熱構造
JP5075139B2 (ja) 2009-01-30 2012-11-14 古河電気工業株式会社 並列光伝送装置
JP5751261B2 (ja) 2013-01-17 2015-07-22 ヤマハ株式会社 熱電発電ユニット
JP5904146B2 (ja) 2013-03-13 2016-04-13 日立金属株式会社 通信モジュール及びそれを備えた信号伝送装置
WO2015045648A1 (ja) * 2013-09-30 2015-04-02 富士電機株式会社 半導体装置、半導体装置の組み立て方法、半導体装置用部品及び単位モジュール

Also Published As

Publication number Publication date
JP7791217B2 (ja) 2025-12-23
EP4475180A1 (en) 2024-12-11
JPWO2023145964A1 (https=) 2023-08-03
WO2023145964A1 (ja) 2023-08-03
US20250164719A1 (en) 2025-05-22

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