JP7790546B2 - 伝送基板の製造方法 - Google Patents

伝送基板の製造方法

Info

Publication number
JP7790546B2
JP7790546B2 JP2024502828A JP2024502828A JP7790546B2 JP 7790546 B2 JP7790546 B2 JP 7790546B2 JP 2024502828 A JP2024502828 A JP 2024502828A JP 2024502828 A JP2024502828 A JP 2024502828A JP 7790546 B2 JP7790546 B2 JP 7790546B2
Authority
JP
Japan
Prior art keywords
copper foil
speed transmission
transmission
panel
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024502828A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023162367A5 (https=
JPWO2023162367A1 (https=
Inventor
悠也 田中
由大 宮川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Publication of JPWO2023162367A1 publication Critical patent/JPWO2023162367A1/ja
Publication of JPWO2023162367A5 publication Critical patent/JPWO2023162367A5/ja
Application granted granted Critical
Publication of JP7790546B2 publication Critical patent/JP7790546B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2024502828A 2022-02-24 2022-11-15 伝送基板の製造方法 Active JP7790546B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022026841 2022-02-24
JP2022026841 2022-02-24
PCT/JP2022/042376 WO2023162367A1 (ja) 2022-02-24 2022-11-15 伝送基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023162367A1 JPWO2023162367A1 (https=) 2023-08-31
JPWO2023162367A5 JPWO2023162367A5 (https=) 2024-08-23
JP7790546B2 true JP7790546B2 (ja) 2025-12-23

Family

ID=87765437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024502828A Active JP7790546B2 (ja) 2022-02-24 2022-11-15 伝送基板の製造方法

Country Status (4)

Country Link
US (1) US20250151203A1 (https=)
JP (1) JP7790546B2 (https=)
CN (1) CN118648383A (https=)
WO (1) WO2023162367A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003198097A (ja) 2001-12-28 2003-07-11 Seiko Epson Corp 配線基板の製造方法及び製造装置
JP2004140587A (ja) 2002-10-17 2004-05-13 Toyo Aluminium Kk アンテナ回路構成体およびそれを備えた機能カード
JP2005285884A (ja) 2004-03-29 2005-10-13 Hitachi Cable Ltd 半導体装置用テープキャリアの製造方法およびそのエッチング処理装置
JP2008172602A (ja) 2007-01-12 2008-07-24 Mitsubishi Electric Corp アンテナ装置
JP2013026401A (ja) 2011-07-20 2013-02-04 Kyocera Corp 多数個取り配線基板
JP2016046376A (ja) 2014-08-22 2016-04-04 アルプス電気株式会社 高周波モジュール及び高周波モジュールの製造方法
JP2019212657A (ja) 2018-05-31 2019-12-12 日東電工株式会社 配線回路基板集合体シート、その製造方法および配線回路基板の製造方法
WO2020031615A1 (ja) 2018-08-10 2020-02-13 日東電工株式会社 配線回路基板集合体シートおよびその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003198097A (ja) 2001-12-28 2003-07-11 Seiko Epson Corp 配線基板の製造方法及び製造装置
JP2004140587A (ja) 2002-10-17 2004-05-13 Toyo Aluminium Kk アンテナ回路構成体およびそれを備えた機能カード
JP2005285884A (ja) 2004-03-29 2005-10-13 Hitachi Cable Ltd 半導体装置用テープキャリアの製造方法およびそのエッチング処理装置
JP2008172602A (ja) 2007-01-12 2008-07-24 Mitsubishi Electric Corp アンテナ装置
JP2013026401A (ja) 2011-07-20 2013-02-04 Kyocera Corp 多数個取り配線基板
JP2016046376A (ja) 2014-08-22 2016-04-04 アルプス電気株式会社 高周波モジュール及び高周波モジュールの製造方法
JP2019212657A (ja) 2018-05-31 2019-12-12 日東電工株式会社 配線回路基板集合体シート、その製造方法および配線回路基板の製造方法
WO2020031615A1 (ja) 2018-08-10 2020-02-13 日東電工株式会社 配線回路基板集合体シートおよびその製造方法

Also Published As

Publication number Publication date
CN118648383A (zh) 2024-09-13
US20250151203A1 (en) 2025-05-08
WO2023162367A1 (ja) 2023-08-31
JPWO2023162367A1 (https=) 2023-08-31

Similar Documents

Publication Publication Date Title
US6555913B1 (en) Electronic component having a coil conductor with photosensitive conductive paste
KR100941570B1 (ko) 인쇄 회로 기판의 제조방법
CN101022699B (zh) 布线电路基板及其制造方法
TWI835831B (zh) 配線電路基板集合體片材及其製造方法
CN100574555C (zh) 软性电路板基板
JP7790546B2 (ja) 伝送基板の製造方法
CN112711174A (zh) 光罩、阵列基板的制备方法与显示面板
KR100855851B1 (ko) 반도체 소자 및 그 제조 방법
CN105491796A (zh) 电路板的制作方法
CN102196672B (zh) 电路板制作方法
KR102833995B1 (ko) 플렉시블 프린트 배선판의 제조 방법
KR20130132089A (ko) 인쇄회로기판 및 그 제조 방법
US20260059649A1 (en) Signaling Trace with Width-Modulated Discontinuity Mitigation
CN106502040B (zh) 用于化学铣削工艺制作镀金铜带微连接线的光刻掩膜版
KR100382565B1 (ko) 매립된 저항을 갖는 인쇄회로기판의 제조방법
CN114914252B (zh) 光罩、触控模组、显示模组、网格导电结构及其制备方法
JP4676317B2 (ja) レジストパターンの形成方法、回路基板の製造方法及び回路基板
JP4892835B2 (ja) フォトマスク及びそれを用いた配線基板の製造方法
KR20050109653A (ko) 빌드업 기술을 이용한 반도체 실장기판의 제조방법
CN218446646U (zh) 触摸传感器、触摸屏及电子设备
CN217655879U (zh) 阵列基板及显示面板
CN117456831B (zh) 显示面板及其制备方法和显示装置
KR20040046194A (ko) 회로기판의 패턴검사구조
TWI394496B (zh) 具有電阻層的線路基板的製造方法
CN116456615A (zh) 一种折断边阻抗线的制备方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240612

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240612

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20250603

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250724

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20251111

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20251124

R150 Certificate of patent or registration of utility model

Ref document number: 7790546

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150