WO2023162367A1 - 伝送基板の製造方法 - Google Patents

伝送基板の製造方法 Download PDF

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Publication number
WO2023162367A1
WO2023162367A1 PCT/JP2022/042376 JP2022042376W WO2023162367A1 WO 2023162367 A1 WO2023162367 A1 WO 2023162367A1 JP 2022042376 W JP2022042376 W JP 2022042376W WO 2023162367 A1 WO2023162367 A1 WO 2023162367A1
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WO
WIPO (PCT)
Prior art keywords
speed transmission
copper foil
transmission
panel
portions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2022/042376
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English (en)
French (fr)
Japanese (ja)
Inventor
悠也 田中
由大 宮川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to US18/835,728 priority Critical patent/US20250151203A1/en
Priority to CN202280090300.6A priority patent/CN118648383A/zh
Priority to JP2024502828A priority patent/JP7790546B2/ja
Publication of WO2023162367A1 publication Critical patent/WO2023162367A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist

Definitions

  • the present disclosure relates to a method of manufacturing a transmission board.
  • This application claims priority based on Japanese application No. 2022-026841 filed on February 24, 2022, and incorporates all the descriptions described in the Japanese application.
  • a test coupon is used.
  • a test coupon is formed on a single panel to create a plurality of high speed transmission substrates. If the impedance of the test coupon conforms to the design value (that is, within the allowable range), it is estimated that the impedance of the high-speed transmission line included in the high-speed transmission board manufactured from the same panel also conforms to the design value.
  • Patent Literature 1 and Patent Literature 2 below disclose a printed circuit board in which a test coupon for characteristic impedance measurement is provided in an area different from the product wiring area on the printed circuit board.
  • the test coupon of Patent Literature 1 includes a zigzag wiring portion that is wired in a zigzag manner so that the wiring intervals are constant, and a straight wiring portion that is wired in a straight line.
  • the test coupon of Patent Literature 2 has serially connected first wiring and second wiring based on the first design rule, and third wiring based on the second design rule.
  • the first wiring and the second wiring have substantially perpendicular first and second straight portions, respectively, and the third wiring has either the first straight portion or the second straight portion. It has a third straight portion that is substantially perpendicular to the heel.
  • a method of manufacturing a transmission board is a method of manufacturing a plurality of transmission boards from a panel having a copper foil on its surface, each of the plurality of transmission boards including a transmission line and a copper foil any of a resist forming step of forming a photoresist thereon, an exposure step of irradiating the photoresist with light through a photomask, and a portion of the photoresist that is irradiated with light and a portion that is not irradiated with light and an etching step of wet-etching the portions of the copper foil exposed by the resist removal step using an etchant, wherein the photomask is a transmission substrate included in each of the plurality of transmission substrates.
  • the etchant is formed to be removed or left so that the portion and the non-remaining portion are not mixed, and in the etching step, the etchant moves with respect to the panel along the transmission path formed by the etching step.
  • FIG. 1 is a cross-sectional view showing the configuration of a high-speed transmission line with one signal line.
  • FIG. 2 is a cross-sectional view showing the configuration of a high-speed transmission line for transmitting differential signals using two signal lines.
  • FIG. 3 is a plan view showing an example of a test coupon imitating a high-speed transmission line for transmitting differential signals.
  • FIG. 4 is a plan view showing a state in which a plurality of test coupons shown in FIG. 3 are formed on one panel.
  • FIG. 5 is a graph showing an example of the result of measuring the impedance of the manufactured test coupon.
  • FIG. 6 is a plan view showing an example of a high-speed transmission board including high-speed transmission lines manufactured by the manufacturing method according to the embodiment of the present disclosure.
  • FIG. 1 is a cross-sectional view showing the configuration of a high-speed transmission line with one signal line.
  • FIG. 2 is a cross-sectional view showing the configuration of a high-speed transmission line for transmitting differential
  • FIG. 7 is a plan view showing an arrangement when a plurality of high-speed transmission boards shown in FIG. 6 are formed on one panel.
  • FIG. 8 is a cross-sectional view showing steps of a manufacturing method according to an embodiment of the present disclosure.
  • FIG. 9 is a cross-sectional view showing a wet etching step in the manufacturing method according to the embodiment of the present disclosure.
  • FIG. 10 is a plan view showing the arrangement when all the four high-speed transmission boards shown in FIG. 6 are formed in the same direction (that is, translational symmetry).
  • FIG. 11 is a plan view showing the arrangement when two high-speed transmission boards shown in FIG. 6 are formed on one panel.
  • FIG. 12 is a plan view showing the arrangement of a plurality of high-speed transmission boards on one panel in the manufacturing method according to the first modified example.
  • FIG. 13 is a plan view showing the arrangement of a plurality of high-speed transmission boards on one panel in the manufacturing method according to the second modified example.
  • FIG. 14 is a plan view showing an arrangement in which two high-speed transmission boards shown in FIG. 6 and a discarding portion are formed on one panel.
  • FIG. 15 is a plan view showing the arrangement of a plurality of high-speed transmission boards on one panel in the manufacturing method according to the third modification.
  • FIG. 16 is a plan view showing an example of a high-speed transmission board including high-speed transmission lines manufactured by the manufacturing method according to the fourth modification.
  • FIG. 17 is a plan view showing an arrangement when a plurality of high-speed transmission boards shown in FIG. 16 are formed on one panel.
  • FIG. 18 is a plan view showing the arrangement when all four high-speed transmission boards shown in FIG. 16 are formed in the same direction (that is, translational symmetry).
  • FIG. 19 is a plan view showing the arrangement when two high-speed transmission boards shown in FIG. 16 are formed on one panel.
  • FIG. 20 is an enlarged plan view showing a pattern corresponding to a high-speed transmission line and its surroundings on a photomask.
  • a plurality of transmission substrates that is, substrates including wiring for transmitting signals
  • the wiring on the transmission substrate is It is known that the impedance is not formed according to the designed dimensions and the impedance varies. In particular, for high-speed transmission lines, dimensional accuracy has a great influence on impedance variations.
  • the impedance of a high-speed transmission line having a single signal line is determined by the width W and thickness T of conductive member 102, which is a wiring for transmitting signals, and the width W and thickness T of conductive member 104 and conductive member 102.
  • the impedance of a high-speed transmission line for transmitting differential signals through two signal lines is the width W and the width W of each of conductive member 106 and conductive member 108, which are two signal lines. It is a function of the thickness T, the distance S between them, and the height H and dielectric constant of the dielectric member 100 . Therefore, impedance is affected by dimensional accuracy.
  • a known problem is that the impedance of transmission lines (that is, wiring for transmitting signals) included in a transmission board varies depending on the position of each of a plurality of transmission boards formed on one panel.
  • a possible cause of the variation is the non-uniformity of wet etching on one panel.
  • an object of the present disclosure is to provide a method of manufacturing a transmission board that can suppress variations in the impedance of the transmission line included in the transmission board from the design value.
  • a method of manufacturing a transmission board is a method of manufacturing a plurality of transmission boards from a panel having a copper foil on its surface, each of the plurality of transmission boards including a transmission line. , a resist forming step of forming a photoresist on a copper foil, an exposure step of irradiating the photoresist with light through a photomask, and a portion of the photoresist that has been irradiated with light and a portion that has not been irradiated with light. and an etching step of performing wet etching using an etchant on the portion of the copper foil exposed by the resist removal step, wherein the photomask is applied to each of the plurality of transmission substrates.
  • the transmission line includes a first connection portion to which the semiconductor element is connected and a second connection portion to which the connector is connected, and the transmission line, the first connection portion and the second connection portion can be arranged eccentrically in a predetermined orientation from the center of the transmission substrate, at least two transmission substrates can be fabricated from the panel, and the photomask is etched out of the copper foil by an etching step A portion around each of the plurality of transmission lines to be formed can be formed by an etching step such that portions where the copper foil remains and portions where the copper foil does not remain are not mixed, and in the photomask, at least A pair of patterns can be placed close to each other at two-fold rotational symmetry.
  • the etching rate of the portions forming the transmission lines can be made uniform, and variations in the impedance of the transmission lines can be suppressed.
  • the transmission line may include a first connection portion to which the semiconductor element is connected and a second connection portion to which the connector is connected.
  • the portion and the second connection portion may be eccentric in a predetermined direction from the center of the transmission substrate and arranged in a first region adjacent to the outer periphery of the transmission substrate, the photomask being the copper foil, the etching step A portion around each of the plurality of transmission lines formed by the etching step may be formed such that portions where the copper foil remains and portions where the copper foil does not remain are not mixed, and the panel is formed so that the transmission lines
  • the rejection portion may be a portion within a predetermined distance from the perimeter of the panel that does not constitute the substrate, the rejection portion may be positioned adjacent the first region of the at least one transmission substrate, the rejection portion
  • the copper foil may remain after the etching step.
  • the predetermined distance may be 2 cm or more. Thereby, it is possible to further suppress variations in the impedance of the transmission line.
  • the transmission line may include a first connection portion to which the semiconductor element is connected and a second connection portion to which the connector is connected.
  • the portion and the second connection portion may be arranged in the first region off-center in a predetermined orientation from the center of the transmission substrate, the transmission substrate including a second region where the copper foil remains after the etching step. and the second region may be located opposite the first region across the center of the transmission substrate, at least two transmission substrates may be fabricated from the panel, and the photomask may be a copper foil Of these, even if the portions around each of the plurality of transmission lines formed by the etching step are removed by the etching step so that portions where the copper foil remains and portions where the copper foil does not remain are not mixed.
  • At least one pair of patterns may be spaced apart from each other at two-fold rotational symmetry.
  • the etching rate of the portions forming the transmission lines can be made uniform, and variations in the impedance of the transmission lines can be suppressed.
  • the transmission line may be an antenna. Thereby, it is possible to suppress variations in impedance of antennas included in a plurality of transmission substrates manufactured from one panel.
  • the photomask has a mixture of portions where the copper foil remains and portions where the copper foil does not remain due to the etching step for each of the plurality of patterns. It may have a predetermined area for forming a portion that is removed or left in such a manner that a predetermined outer edge along the pattern among the outer edges of the predetermined area may be separated from the pattern by 4 cm or more. good.
  • the etching rate of the portion forming each transmission line can be made more uniform, and variations in the impedance of the transmission lines can be further suppressed.
  • the predetermined outer edge may be separated from the pattern by 6 cm or more.
  • the predetermined outer edge may be separated from the pattern by 12 cm or more.
  • test coupon 110 imitating a high-speed transmission line was used.
  • the test coupon 110 includes conductive wiring 112 and wiring 114 made of copper or the like formed on a substrate 116 made of resin or the like, conductive terminal portions 120 and 122 arranged at both ends of the wiring 112, and the wiring. It includes conductive terminals 124 and 126 located at opposite ends of 114 .
  • the substrate 116 is rectangular with a length of about 8 cm and a width of about 4 cm.
  • Each of the wiring 112 and the wiring 114 is bent and composed of linear partial wirings of areas A1 to A5.
  • the wiring 112 and the wiring 114 are close to each other and arranged in parallel with a predetermined interval.
  • wiring 112 and wiring 114 are arranged at an angle of 90 degrees to each other.
  • the wiring 112 and the wiring 114 are arranged in parallel and separated from each other.
  • Wiring 112 and wiring 114 simulate high-speed transmission lines for transmitting differential signals.
  • the design value of the impedance of the test coupon 110 was set to 100 ⁇ .
  • test coupons 110 shown in FIG. 3 were formed on panel 130 by wet etching.
  • the panel 130 is, for example, a rectangle about 34 cm long and about 48 cm wide.
  • the panel 130 before etching is a flat plate made of resin or the like, and a copper foil is formed on the entire surface of one of both sides thereof.
  • a photoresist is formed on the copper foil of the panel 130 by coating or the like, and a single photomask is placed thereon, and light (e.g., UV (Ultraviolet) light) is applied to alter (e.g., harden) the photoresist. ) was irradiated.
  • light e.g., UV (Ultraviolet) light
  • test coupons 110A to 110H having the same specifications (that is, designation of shape and size) as the test coupon 110 shown in FIG. 3 were formed. That is, the test coupons 110A to 110D are formed in the copper foil area 132 (see hatched area), and the test coupons 110E to 110H are formed in the resin area 134 where the resin is exposed without the copper foil. , formed a photomask. After irradiating the resist with light through a photomask, the resist was removed from a portion altered by light irradiation or a portion not irradiated with light.
  • a negative photoresist When a negative photoresist is used, it cures (for example, photopolymerizes) when it is irradiated with light, so the portion not irradiated with light is removed with an organic solvent or the like.
  • a positive photoresist When a positive photoresist is used, the portion irradiated with light is degraded and removed with an alkaline aqueous solution or the like.
  • the panel 130 on which the photoresist remained was wet-etched using an etchant, and then the test coupons 110A to 110H were separated from the panel 130, and the impedance of each test coupon was measured.
  • the panel 130 was moved at a constant speed in the direction indicated by the downward arrow in FIG. 4 in a tank filled with an etchant. Therefore, the relationship between the direction in which the panel is run in the etchant (hereinafter referred to as flow direction) and the direction along the wiring in the area A1 (see FIG. 1) from test coupon 110A to test coupon 110H is different.
  • test coupon 110A, test coupon 110C, test coupon 110E, and test coupon 110G are along the flow direction.
  • Test coupon 110B, test coupon 110D, test coupon 110F and test coupon 110H are generally orthogonal to the flow orientation.
  • the TDR method Time Domain Reflectometry was used for impedance measurement.
  • test coupons 110A to 110H are formed as shown in FIG. Five sheets of each were produced.
  • the test coupon is for differential signal transmission, and its designed impedance value is 100 ⁇ as described above.
  • FIG. 5 shows the results of impedance measurement for five test coupons 110A.
  • the vertical axis is the impedance (in units of ⁇ ).
  • the horizontal axis is the distance (in mm) representing the measurement position, that is, the length along the wiring 112 and the wiring 114 shown in FIG.
  • FIG. 5 shows areas A1 to A5 shown in FIG. 3 corresponding to the length of the wiring.
  • test coupons 110A and their average values represent the measured data of the five test coupons 110A and their average values (that is, the solid-line graph indicated by the downward arrows in FIG. 5).
  • test coupons formed at the same location on the panel have variations in impedance.
  • Graphs with similar variations were also obtained for the test coupons 110B to 110H.
  • the measurement data obtained from each of the five test coupons 110A to 110H were evaluated, and the conditions under which the variation was small and the impedance close to the design value (ie, 100 ⁇ ) was obtained were examined. Specifically, considering the electromagnetic coupling state of the wiring 112 and the wiring 114, the wiring 112 and the wiring 114 were divided into two types of regions and evaluated. That is, the impedance of the area A1 shown in FIG. 3 is assumed to be coupled, and the impedance of the areas A2 to A5 is assumed to be uncoupled.
  • the above Z1 and Z2 were calculated from the measurement data on each of the five test coupons 110A to 110H, and each was scored according to the difference from the design value of 100 ⁇ to obtain an evaluation score. That is, if the difference between Z1 and 100 ⁇ was 0 ⁇ or more and 2 ⁇ or less, 3 points were given, if it was more than 2 ⁇ and 3 ⁇ or less, it was 2 points, if it was more than 3 ⁇ and 4 ⁇ or less, it was 1 point, and if it was more than 4 ⁇ , it was 0 points. .
  • Z2 if the difference between Z2 and 100 ⁇ is 0 or more and 2 ⁇ or less, 3 points, if it is greater than 2 ⁇ and 3 ⁇ or less, it is 2 points, if it is greater than 3 ⁇ and 4 ⁇ or less, it is 1 point, and if it is greater than 4 ⁇ , A score of 0 was given.
  • ⁇ 1 and ⁇ 2 were calculated and scored according to the values. That is, 4 points if ⁇ 1 is 0 ⁇ or more and 2 ⁇ or less, 3 points if ⁇ 1 is greater than 2 ⁇ and 3 ⁇ or less, 2 points if ⁇ 1 is greater than 3 ⁇ and 4 ⁇ or less, 1 point if ⁇ 1 is greater than 4 ⁇ and 5 ⁇ or less, and is greater than 5 ⁇ . If it was large, it was set as 0 points. ⁇ 2 was similarly scored. Further, if
  • ⁇ 1 P Z1 ⁇ P ⁇ 1 ⁇ 50/[P Z1 ⁇ P ⁇ 1 ]
  • ⁇ 2 P Z2 ⁇ P ⁇ 2 ⁇ P
  • are obtained from Z1, Z2, ⁇ 1, ⁇ 2 and
  • ⁇ 3 is a value in the range from 0 to 100. It can be said that the larger ⁇ 3 is, the better, and the closer to "100" the closer the impedance is to the design value and the smaller the variation (hereinafter referred to as "good finish”).
  • the ⁇ 3 values for test coupons 110A through 110H were 18.8, 32.8, 78.1, 39.8, 75.0, 49.2, 78.1 and 15.6, respectively. From these results, the following facts were generally found regarding the preferred arrangement of the test coupons. ⁇ If the test coupon is arranged along the flow direction of the wet etching, the finish is good. ⁇ The test coupon in the center of the panel has a good finish.
  • the uniformity of the copper foil around the test coupon greatly affects the finish. ⁇ If the copper foil around the test coupon is not uniform, that is, if there is a mixture of copper foil and non-copper foil parts, the test coupon arranged along the wet etching flow direction will not Central placement is preferred. • If the copper foil around the test coupon is not uniform, test coupons that are not aligned with the wet etch flow direction are preferably placed at the edge of the panel.
  • the high-speed transmission line is preferably arranged along the direction of the wet etching flow.
  • the copper foil is uniformly present in a predetermined region around the high-speed transmission line, or that the copper foil is uniformly absent (that is, the absence of the copper foil is uniform).
  • a high-speed transmission board 150 which is an example of an object to be manufactured, includes a high-speed transmission line 152 and a chip for mounting a semiconductor element (for example, a semiconductor IC (Integrated Circuit) such as a high-speed I/F chip). It includes a mounting area 154 and a connector mounting area 156 for mounting a high frequency connector or the like.
  • the high-speed transmission board 150 is formed by wet-etching a copper foil formed on a flat plate made of resin or the like. The portion where the copper foil is present is indicated by diagonal lines.
  • the high-speed transmission line 152 is wiring for connecting the semiconductor element and the connector arranged together on the high-speed transmission board 150 and transmitting a high frequency of 1 GHz or more.
  • High-speed transmission line 152 includes a first terminal portion and a second terminal portion (both not shown) to which a semiconductor element and a connector are connected, respectively, similar to terminal portion 120 and the like shown in FIG.
  • the chip mounting area 154 is separated from the outer circumference (that is, four sides) of the high-speed transmission board 150, and the connector mounting area 156 is part of the outer circumference of the high-speed transmission board 150 (specifically, the lower side 160). ) is located adjacent to Note that the arrangement of the chip mounting area 154 and the connector mounting area 156 is not limited to the arrangement shown in FIG.
  • the high-speed transmission line 152 is composed of two wires and transmits differential signals. Although the chip mounting area 154 and the connector mounting area 156 are not shaded and wiring patterns are not shown, wiring patterns corresponding to the terminals of the semiconductor elements and connectors mounted thereon are formed. The wiring patterns formed in the chip mounting area 154 and the connector mounting area 156 include wiring patterns connected to the high-speed transmission line 152 .
  • the high-speed transmission line 152, the chip mounting area 154, and the connector mounting area 156 are arranged eccentrically from the center of the high-speed transmission board 150 in a predetermined direction. That is, the high-speed transmission line 152, the chip mounting area 154, and the connector mounting area 156 are arranged in a first area 158 located on the right side of the center line 164 of the high-speed transmission board 150 perpendicular to the lower side 160 of the high-speed transmission board 150. there is Therefore, the semiconductor element and the connector mounted on each of chip mounting area 154 and connector mounting area 156 are also arranged at positions eccentric from the center of high-speed transmission board 150 in a predetermined direction.
  • the direction of high-speed transmission line 152 ie, upward and downward in FIG.
  • Each wiring of the high-speed transmission line 152 is composed of three kinds of straight portions, the central straight portion extending obliquely, and the straight portions on both sides thereof extending along the right side 162 .
  • the direction of the high-speed transmission line 152 refers to the direction along the straight line portion that has the largest sum of the lengths of parallel straight line portions of the straight line portions that constitute the high-speed transmission line 152 . Even if the shape of the high-speed transmission line formed on the high-speed transmission board 150 is different from the shape of the high-speed transmission line 152 shown in FIG. 6, the direction of the high-speed transmission line is similarly determined. That is, with respect to a plurality of straight line portions forming the high-speed transmission line, the direction along the straight line portion having the largest sum of the lengths of the parallel straight line portions is the direction of the high-speed transmission line.
  • a plurality of high-speed transmission boards 150 can be produced using one panel. Referring to FIG. 7, during wet etching, from one panel 170, the panel 170 is run in the etching liquid in the direction indicated by the downward arrow, and four high-speed transmission substrates 150 (that is, from the high-speed transmission substrate 172 to the high-speed A transmission substrate 178) is fabricated. In FIG. 7, hatched portions represent portions where the copper foil remains after wet etching.
  • the high-speed transmission board 172 and the high-speed transmission board 174 are formed in the same direction as the high-speed transmission board 150 (that is, translational symmetry), and the high-speed transmission board 176 and the high-speed transmission board 178 are formed in a state in which the high-speed transmission board 150 is rotated 180 degrees. be. That is, with respect to the high-speed transmission substrate 172 and the high-speed transmission substrate 176 that are arranged adjacent to each other in the direction perpendicular to the flow direction of wet etching, the high-speed transmission lines 152A and 152C are arranged close to each other (that is, the panel 170 ), are arranged with two-fold rotational symmetry.
  • the high-speed transmission line 152B formed on the high-speed transmission board 174 and the high-speed transmission line 152D formed on the high-speed transmission board 178 are adjacent to each other and arranged with two-fold rotational symmetry.
  • a photomask for forming the high-speed transmission substrate 172 to the high-speed transmission substrate 178 in this manner copper foil is uniformly present around each of the high-speed transmission lines 152A to 152D during wet etching. state can be realized. That is, a photomask is used so that the copper foil remains uniformly around each of the formed high-speed transmission lines 152A to 152D after etching.
  • step (A) A method of manufacturing the high-speed transmission board 150 shown in FIG. 6 by arranging it as shown in FIG. 7 will be described.
  • a photomask 500 is produced by forming a pattern on a glass substrate or the like. Specifically, as shown in FIG. 7, a photomask 500 is formed on the panel 170 so that the high-speed transmission substrates 172 to 176 are formed. That is, the photomask 500 has a pattern corresponding to the high-speed transmission line 152A to the high-speed transmission line 152D.
  • a light shielding portion (hereinafter referred to as a , mask portion) is provided, and the mask portion is not provided when a negative photoresist is used.
  • step (B) a photoresist 506 is formed, for example, by coating on the panel having the copper foil 504 formed on the substrate 502 . Photoresist 506 is assumed to be positive.
  • step (C) a photomask 500 is placed on the substrate on which step (B) has been performed, and light 508 such as UV light that alters the photoresist 506 is irradiated. A portion of the photoresist 506 that has been degraded by being irradiated with light 508 is shown as a degraded photoresist 510 .
  • step (D) the photomask 500 is removed, and the degraded photoresist 510 degraded in step (C) is removed with, for example, an alkaline aqueous solution.
  • the photoresist 506 is uniformly left on the copper foil 504 in a portion corresponding to the pattern of the photomask and around the pattern.
  • step (E) the copper foil 504 is etched using an etchant.
  • panel 526 which is the substrate after step (D)
  • etching bath 520 is placed on rollers 524 of etching bath 520 and moved in etching solution 522 in the direction of the arrow (that is, rightward). to run.
  • the direction of the rightward arrow in FIG. 9 is the direction of the downward arrow shown in FIG.
  • the copper foil 504 that remains after etching is indicated by residual copper foil 512 .
  • step (F) the remaining photoresist 506 is removed, and after cleaning, each high-speed transmission substrate is cut. As a result, four high-speed transmission boards 150 shown in FIG. 6 are produced from one panel.
  • the photoresist for uniformly leaving the copper foil remains around each of the high-speed transmission lines 152A to 152D shown in FIG.
  • Wet etching can be performed in a state in which the etchant flows along the . Therefore, the etching rate of the portion forming each high-speed transmission line can be made uniform, and variations in the impedance of the high-speed transmission lines included in a plurality of high-speed transmission substrates fabricated from one panel with respect to the design value can be suppressed.
  • the photoresist is positive, it is not limited to this.
  • a negative photoresist may also be used.
  • the photomask may be a positive photoresist photomask in which the light-transmitting portion and the light-shielding portion are reversed. After exposure, the unexposed photoresist may be removed using an organic solvent or the like.
  • the high-speed transmission board 178 can also be formed in the same orientation as the high-speed transmission board 172 and the high-speed transmission board 174 (that is, translational symmetry).
  • the high-speed transmission lines 152C and 152D of the high-speed transmission board 176 and the high-speed transmission board 178 formed on the right side of the panel 170 are closer to the right side than the center of the panel 170, and the high-speed transmission line 152C And there is no region where the copper foil exists uniformly over a sufficient range on the right side of the high-speed transmission line 152D. Therefore, the variation in impedance from high-speed transmission line 152A to high-speed transmission line 152D is greater in the arrangement shown in FIG. 10 than in the arrangement shown in FIG.
  • a high-speed transmission board having the same specifications as the high-speed transmission board 174 and the high-speed transmission board 178 is repeatedly formed under the high-speed transmission board 174 and the high-speed transmission board 178. You may do so. As a result, more high-speed transmission substrates 150 shown in FIG. 6, such as six or eight, can be manufactured from one panel.
  • two high-speed transmission boards 150 shown in FIG. 6 may be produced from one panel.
  • the high-speed transmission lines included in each high-speed transmission board are brought close to each other and arranged at two-fold rotational symmetry, and the direction of the high-speed transmission lines (that is, the direction indicated by the arrow in FIG. 11 and the opposite direction) direction) in the etching solution.
  • the flow direction of the rectangular panel there are two options for the flow direction of the rectangular panel, that is, the direction in which the panel is run in the etchant. Therefore, depending on the size of the panel, the flow direction may be fixed. In that case, a photomask having a pattern corresponding to the high-speed transmission lines formed on the panel may be used so that the high-speed transmission lines are aligned with the running direction of the panel. Note that the flow direction may be specified in the specifications at the time of board manufacture.
  • a figure for example, an arrow or the like indicating the flow direction may be formed on each manufactured high-speed transmission board by silk printing or the like. If the flow direction is known, it becomes possible to manage the high-speed transmission board after manufacturing.
  • the high-speed transmission boards 202 to 208 are formed in the same orientation as the high-speed transmission board 150 (that is, translational symmetry), and the high-speed transmission boards 210 and 212 are formed in a direction obtained by rotating the high-speed transmission board 150 by 180 degrees. be. That is, as in FIG. 7, the high-speed transmission lines formed in each of the high-speed transmission substrates 206 and 210 arranged in the direction perpendicular to the wet etching flow are brought close to each other and rotated twice. arranged symmetrically. Similarly, the high-speed transmission lines formed in each of high-speed transmission substrate 208 and high-speed transmission substrate 212 are arranged close to each other with two-fold rotational symmetry.
  • the photomask for forming the high-speed transmission board 212 from the high-speed transmission board 202 and executing the manufacturing method shown in FIG. can realize a state in which That is, wet etching is performed by flowing an etchant along each high-speed transmission line in the state shown in FIG. 12 where the copper foil is evenly present around each high-speed transmission line. Therefore, the etching rate of the portion forming each high-speed transmission line can be made uniform, and the impedance variation of the high-speed transmission lines included in a plurality of high-speed transmission substrates fabricated from one panel can be suppressed from the design value.
  • the same high-speed transmission substrates 204, 208 and 212 as the high-speed transmission substrates 204, 208 and 212 are placed below the high-speed transmission substrates 204, 208 and 212.
  • a high-speed transmission substrate with specifications may be repeatedly formed.
  • more high-speed transmission boards such as 9 or 12 high-speed transmission boards 150 shown in FIG. 6 can be manufactured from one panel.
  • the panel 230 is moved in the direction indicated by the downward arrow in the etchant, and from one panel 230 four high-speed transmission substrates 150 (that is, from the high-speed transmission substrate 232 to the high-speed transmission Substrate 238) is fabricated.
  • hatched portions represent portions where the copper foil remains after wet etching.
  • the high-speed transmission boards 232 to 238 are all formed in the same direction as the high-speed transmission board 150 (that is, in translational symmetry).
  • a rejection portion 240 is formed in a portion of the outer periphery of the panel 230 , that is, within a predetermined distance from the right side 242 .
  • the etching rate of the portion forming each high-speed transmission line can be made uniform, and the impedance variation of the high-speed transmission lines included in a plurality of high-speed transmission substrates fabricated from one panel can be suppressed from the design value.
  • the width of the rejecting portion 240 (that is, the length in the direction perpendicular to the right side 242) is preferably 2 cm or more.
  • a high-speed transmission board having the same specifications as the high-speed transmission board 234 and the high-speed transmission board 238 is repeatedly formed under the high-speed transmission board 234 and the high-speed transmission board 238. You may do so. As a result, more high-speed transmission substrates 150 shown in FIG. 6, such as six or eight, can be manufactured from one panel.
  • two high-speed transmission boards 150 shown in FIG. 6 may be produced from one panel.
  • the rejection unit is arranged adjacent to the high-speed transmission line included in one high-speed transmission board (that is, the high-speed transmission board on the right side in FIG. 14), and is arranged in the direction of the high-speed transmission line (that is, in FIG. 14) It is preferred to run the panel in the etchant in the direction indicated by the arrow and in the opposite direction).
  • a single panel may contain multiple rejects.
  • the third modification even in such a case, a plurality of high-speed transmission substrates including high-speed transmission lines with small impedance variations can be produced from one panel.
  • panel 250 is run in the etching solution in the direction indicated by the downward arrow, and four high-speed transmission substrates 150 shown in FIG.
  • a high-speed transmission board 258 is fabricated from the high-speed transmission board 252 .
  • hatched portions represent portions where the copper foil remains after wet etching.
  • the high-speed transmission boards 252 to 258 are all formed in the same direction as the high-speed transmission board 150 (that is, in translational symmetry).
  • a rejection section 260 and a rejection section 262 are formed within a predetermined distance from a part of the outer circumference of the panel 250 (specifically, the right side and the left side). Also, a rejection portion 264 is formed including the central portion of the panel 250 .
  • the photomask is formed so that the copper foil remains in the rejecting portion 260 to the rejecting portion 264, which is the area other than the high-speed transmission substrate 252 to the high-speed transmission substrate 258 on the panel 250, and the manufacturing method shown in FIG. By doing so, it is possible to achieve a state in which the copper foil is uniformly present around each high-speed transmission line during wet etching.
  • wet etching is performed by flowing an etchant along each high-speed transmission line in a state where a photoresist for uniformly leaving copper foil exists around each high-speed transmission line shown in FIG. . Therefore, the etching rate of the portion forming each high-speed transmission line can be made uniform, and variations in the impedance of the high-speed transmission lines included in a plurality of high-speed transmission substrates fabricated from one panel with respect to the design value can be suppressed.
  • a high speed transmission board 300 includes a high speed transmission line 302, a chip mounting area 304, a connector mounting area 306 and a copper foil area 310.
  • the high-speed transmission board 300 is formed by wet-etching a copper foil formed on a flat plate made of resin or the like.
  • the high-speed transmission line 302 is wiring for connecting the semiconductor element and the connector arranged together on the high-speed transmission board 300 and transmitting a high frequency of 1 GHz or higher.
  • the chip mounting area 304 is separated from the outer circumference (that is, four sides) of the high-speed transmission board 300, and the connector mounting area 306 is part of the outer circumference of the high-speed transmission board 300 (specifically, the lower side 312).
  • the high-speed transmission line 302 is composed of two wires and transmits differential signals. Although wiring patterns are not shown in the chip mounting area 304 and the connector mounting area 306, wiring patterns corresponding to the terminals of the semiconductor elements and connectors mounted thereon are formed. Wiring patterns formed in the chip mounting area 304 and the connector mounting area 306 include wiring patterns connected to the high-speed transmission line 302 .
  • the high-speed transmission line 302, the chip mounting area 304, and the connector mounting area 306 are arranged eccentrically in a predetermined direction from the center of the high-speed transmission board 300. That is, the high-speed transmission line 302 , the chip mounting area 304 and the connector mounting area 306 are arranged in a first area 308 perpendicular to the lower side 312 and located on the left side of the center line 318 of the high-speed transmission board 300 . Therefore, the semiconductor elements and connectors mounted in chip mounting area 304 and connector mounting area 306 are also arranged at positions eccentrically from the center of high-speed transmission board 300 in a predetermined direction.
  • the direction of high speed transmission line 302 ie, upward and downward in FIG. 16) is along left side 316 .
  • the copper foil region 310 is a region where the copper foil remains in a predetermined range from the right side 314 after wet etching (that is, the second region), and is located on the opposite side of the first region 308 across the center line 318 .
  • a plurality of high-speed transmission boards 300 can be produced using one panel. Referring to FIG. 17, during wet etching, from one panel 320, the panel 320 is run in the etching liquid in the direction indicated by the downward arrow, and four high-speed transmission substrates 300 (that is, from the high-speed transmission substrate 322 to the high-speed A transmission substrate 328) is fabricated. In FIG. 17, hatched portions represent portions where the copper foil remains after wet etching.
  • the high-speed transmission board 322 and the high-speed transmission board 324 are formed in the same direction as the high-speed transmission board 300 (that is, translational symmetry), and the high-speed transmission board 326 and the high-speed transmission board 328 are formed in a state in which the high-speed transmission board 300 is rotated 180 degrees. be. That is, with respect to the high-speed transmission substrate 322 and the high-speed transmission substrate 326 arranged in the direction perpendicular to the wet etching flow direction, the high-speed transmission line 302A and the high-speed transmission line 302C are separated from each other (that is, the panels 320 are separated from each other). closer to the left and right ends than the center), and are arranged with two-fold rotational symmetry.
  • the high-speed transmission line 302B formed on the high-speed transmission board 324 and the high-speed transmission line 302D formed on the high-speed transmission board 328 are separated from each other and are arranged with two-fold rotational symmetry.
  • the copper foil regions 310A to 310D gather at the center of the panel 320. As shown in FIG.
  • the etching rate of the portion forming each high-speed transmission line can be made uniform, and variations in the impedance of the high-speed transmission lines included in a plurality of high-speed transmission substrates fabricated from one panel with respect to the design value can be suppressed.
  • each of the high speed transmission board 326 and the high speed transmission board 328 is rotated 180 degrees to form the high speed transmission board 326 as shown in FIG. and the high-speed transmission board 328 can be formed in the same orientation as the high-speed transmission board 322 and the high-speed transmission board 324 (that is, translational symmetry).
  • the high-speed transmission lines 302C and 302D of the high-speed transmission board 326 and the high-speed transmission board 328 formed on the right side of the panel 320 are respectively closer to the copper foil area 310A and the copper foil than the right side of the panel 320.
  • a high-speed transmission board having the same specifications as the high-speed transmission board 324 and the high-speed transmission board 328 is repeatedly formed under the high-speed transmission board 324 and the high-speed transmission board 328. You may do so. As a result, more high-speed transmission boards 300 shown in FIG. 16, such as six or eight, can be manufactured from one panel.
  • two high-speed transmission boards 300 shown in FIG. 16 may be produced from one panel.
  • the high-speed transmission lines included in each high-speed transmission board are separated from each other and arranged at two-fold rotational symmetry (that is, the copper foil regions 310 are arranged close to each other), and the high-speed transmission lines It is preferable to run the panel in the etchant in a direction (ie, the direction indicated by the arrow in FIG. 19 and the opposite direction).
  • the predetermined area in which the presence or absence of the copper foil around the high-speed transmission line should be made uniform was determined by considering the results of the preliminary experiment described above. It can be appropriately determined according to the size of the transmission path. Accordingly, a predetermined region in which a mask portion is formed around the pattern corresponding to the high-speed transmission line on the photomask or in which the mask portion is not formed is determined accordingly. Regarding the interpretation of the predetermined area, it is assumed that the area essential for making the wiring function as a high-speed transmission line is included in the high-speed transmission line.
  • an area indispensable for separating two wirings from each other (hereinafter referred to as a first essential area), and two wirings in a surrounding area when copper foil is arranged around a high-speed transmission line.
  • a region essential for separating from the copper foil (hereinafter referred to as a second essential region) is not included in the predetermined region.
  • the first essential area is, for example, an area in which there is no copper foil between two wirings forming the high-speed transmission line 152 shown in FIG.
  • the second essential area is, for example, an area where the copper foil on both sides of the high-speed transmission line 152 shown in FIG. 6 does not exist.
  • the high-speed transmission line may include not only two wires, but also a first required area and a second required area.
  • the predetermined area where the copper foil is evenly present may include a narrow area where the copper foil is not present and which is provided for distinguishing between a plurality of high-speed transmission substrates on the panel.
  • FIG. 7 shows areas of crosses where there is no copper foil to separate high speed transmission substrates 172 from high speed transmission substrates 178 from each other. Even in that case, it is said that the copper foil is uniformly present in a predetermined area around the high-speed transmission line on the panel.
  • each of the outer edges 404 and 406 along the pattern 400 corresponding to the high-speed transmission line.
  • the distance from the pattern 400 is 4 cm or more.
  • the distance between each of the outer edges 404 and 406 and the pattern 400 is more precisely the distance L from the geometric center 408 of the pattern 400 . That is, it is preferable that L ⁇ 4 (cm).
  • the length of outer edge 404 and outer edge 406 along pattern 400 need only be greater than the length of pattern 400 (ie, the dimension in the direction along pattern 400).
  • the etching rate of the portions forming the high-speed transmission lines can be made more uniform, and variations in the impedance of the high-speed transmission lines can be suppressed.
  • the shape of the pattern 400 corresponds to the high-speed transmission line, is not limited to that shown in FIG. 20, and can be changed according to the shape of the high-speed transmission line.
  • the distance between each of the outer edges 404 and 406 along the pattern 400 and the pattern 400 is preferably 6 cm or more (L ⁇ 6 (cm)). preferable.
  • the distance between each of the outer edges 404 and 406 along the pattern 400 and the pattern 400 is 12 cm or more (L ⁇ 12 (cm)). preferable.
  • the etching rate of the portions forming the high-speed transmission lines can be made even more uniform, and variations in the impedance of the high-speed transmission lines can be further suppressed.
  • the high-speed transmission line may be of a form (that is, single-ended) in which signals are transmitted through one wiring (for example, the ground is used as a reference level).
  • the high speed transmission line may be an antenna.
  • the antenna can be configured by, for example, one wire. Usually no copper foil is formed around the antenna.
  • the present invention is not limited to this.
  • the panel may be fixed and the etchant may be flowed. If the direction of flow of the etchant is along the high-speed transmission line formed on the panel, the etching speed can be made uniform, and the variations in impedance of the high-speed transmission line can be suppressed as described above.
  • the design value of the impedance of the high-speed transmission line is 100 ⁇
  • the design value of the impedance of the high-speed transmission line is arbitrary, and may be, for example, 75 ⁇ or 50 ⁇ .
  • High frequency substrates and panels may be of any shape.
  • the photomask is formed so that the high-speed transmission lines formed on the panel are aligned with each other, and the copper foil is placed around each high-speed transmission line so that there are portions where the copper foil remains and portions where the copper foil does not remain. It may be formed so as to remain or be removed so as not to be mixed.
  • a high-speed transmission board may be a transmission substrate including wiring for transmitting a signal having a frequency of less than 1 GHz.
  • INDUSTRIAL APPLICABILITY The present disclosure is applicable to the manufacture of transmission substrates in which the dimensional accuracy of wiring affects impedance variation.

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
PCT/JP2022/042376 2022-02-24 2022-11-15 伝送基板の製造方法 Ceased WO2023162367A1 (ja)

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US18/835,728 US20250151203A1 (en) 2022-02-24 2022-11-15 Method for producing transmission substrate
CN202280090300.6A CN118648383A (zh) 2022-02-24 2022-11-15 传输基板的制造方法
JP2024502828A JP7790546B2 (ja) 2022-02-24 2022-11-15 伝送基板の製造方法

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003198097A (ja) * 2001-12-28 2003-07-11 Seiko Epson Corp 配線基板の製造方法及び製造装置
JP2004140587A (ja) * 2002-10-17 2004-05-13 Toyo Aluminium Kk アンテナ回路構成体およびそれを備えた機能カード
JP2005285884A (ja) * 2004-03-29 2005-10-13 Hitachi Cable Ltd 半導体装置用テープキャリアの製造方法およびそのエッチング処理装置
JP2008172602A (ja) * 2007-01-12 2008-07-24 Mitsubishi Electric Corp アンテナ装置
JP2013026401A (ja) * 2011-07-20 2013-02-04 Kyocera Corp 多数個取り配線基板
JP2016046376A (ja) * 2014-08-22 2016-04-04 アルプス電気株式会社 高周波モジュール及び高周波モジュールの製造方法
JP2019212657A (ja) * 2018-05-31 2019-12-12 日東電工株式会社 配線回路基板集合体シート、その製造方法および配線回路基板の製造方法
WO2020031615A1 (ja) * 2018-08-10 2020-02-13 日東電工株式会社 配線回路基板集合体シートおよびその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003198097A (ja) * 2001-12-28 2003-07-11 Seiko Epson Corp 配線基板の製造方法及び製造装置
JP2004140587A (ja) * 2002-10-17 2004-05-13 Toyo Aluminium Kk アンテナ回路構成体およびそれを備えた機能カード
JP2005285884A (ja) * 2004-03-29 2005-10-13 Hitachi Cable Ltd 半導体装置用テープキャリアの製造方法およびそのエッチング処理装置
JP2008172602A (ja) * 2007-01-12 2008-07-24 Mitsubishi Electric Corp アンテナ装置
JP2013026401A (ja) * 2011-07-20 2013-02-04 Kyocera Corp 多数個取り配線基板
JP2016046376A (ja) * 2014-08-22 2016-04-04 アルプス電気株式会社 高周波モジュール及び高周波モジュールの製造方法
JP2019212657A (ja) * 2018-05-31 2019-12-12 日東電工株式会社 配線回路基板集合体シート、その製造方法および配線回路基板の製造方法
WO2020031615A1 (ja) * 2018-08-10 2020-02-13 日東電工株式会社 配線回路基板集合体シートおよびその製造方法

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JP7790546B2 (ja) 2025-12-23

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