CN118648383A - 传输基板的制造方法 - Google Patents

传输基板的制造方法 Download PDF

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Publication number
CN118648383A
CN118648383A CN202280090300.6A CN202280090300A CN118648383A CN 118648383 A CN118648383 A CN 118648383A CN 202280090300 A CN202280090300 A CN 202280090300A CN 118648383 A CN118648383 A CN 118648383A
Authority
CN
China
Prior art keywords
copper foil
speed transmission
panel
transmission path
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280090300.6A
Other languages
English (en)
Chinese (zh)
Inventor
田中悠也
宫川由大
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Publication of CN118648383A publication Critical patent/CN118648383A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
CN202280090300.6A 2022-02-24 2022-11-15 传输基板的制造方法 Pending CN118648383A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022026841 2022-02-24
PCT/JP2022/042376 WO2023162367A1 (ja) 2022-02-24 2022-11-15 伝送基板の製造方法
JP2022-026841 2022-12-14

Publications (1)

Publication Number Publication Date
CN118648383A true CN118648383A (zh) 2024-09-13

Family

ID=87765437

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280090300.6A Pending CN118648383A (zh) 2022-02-24 2022-11-15 传输基板的制造方法

Country Status (4)

Country Link
US (1) US20250151203A1 (https=)
JP (1) JP7790546B2 (https=)
CN (1) CN118648383A (https=)
WO (1) WO2023162367A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3738834B2 (ja) * 2001-12-28 2006-01-25 セイコーエプソン株式会社 配線基板の製造方法及び製造装置
JP3881949B2 (ja) * 2002-10-17 2007-02-14 東洋アルミニウム株式会社 アンテナ回路構成体およびそれを備えた機能カードならびにアンテナ回路構成体の製造方法
JP4127231B2 (ja) * 2004-03-29 2008-07-30 日立電線株式会社 半導体装置用テープキャリアの製造方法およびそのエッチング処理装置
JP4311450B2 (ja) * 2007-01-12 2009-08-12 三菱電機株式会社 アンテナ装置
JP5738109B2 (ja) * 2011-07-20 2015-06-17 京セラ株式会社 多数個取り配線基板
JP2016046376A (ja) * 2014-08-22 2016-04-04 アルプス電気株式会社 高周波モジュール及び高周波モジュールの製造方法
JP7060450B2 (ja) * 2018-05-31 2022-04-26 日東電工株式会社 配線回路基板集合体シート、その製造方法および配線回路基板の製造方法
JP7003012B2 (ja) * 2018-08-10 2022-02-04 日東電工株式会社 配線回路基板集合体シートおよびその製造方法

Also Published As

Publication number Publication date
US20250151203A1 (en) 2025-05-08
WO2023162367A1 (ja) 2023-08-31
JPWO2023162367A1 (https=) 2023-08-31
JP7790546B2 (ja) 2025-12-23

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