JPWO2023162367A1 - - Google Patents

Info

Publication number
JPWO2023162367A1
JPWO2023162367A1 JP2024502828A JP2024502828A JPWO2023162367A1 JP WO2023162367 A1 JPWO2023162367 A1 JP WO2023162367A1 JP 2024502828 A JP2024502828 A JP 2024502828A JP 2024502828 A JP2024502828 A JP 2024502828A JP WO2023162367 A1 JPWO2023162367 A1 JP WO2023162367A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024502828A
Other languages
Japanese (ja)
Other versions
JPWO2023162367A5 (https=
JP7790546B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023162367A1 publication Critical patent/JPWO2023162367A1/ja
Publication of JPWO2023162367A5 publication Critical patent/JPWO2023162367A5/ja
Application granted granted Critical
Publication of JP7790546B2 publication Critical patent/JP7790546B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2024502828A 2022-02-24 2022-11-15 伝送基板の製造方法 Active JP7790546B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022026841 2022-02-24
JP2022026841 2022-02-24
PCT/JP2022/042376 WO2023162367A1 (ja) 2022-02-24 2022-11-15 伝送基板の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023162367A1 true JPWO2023162367A1 (https=) 2023-08-31
JPWO2023162367A5 JPWO2023162367A5 (https=) 2024-08-23
JP7790546B2 JP7790546B2 (ja) 2025-12-23

Family

ID=87765437

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024502828A Active JP7790546B2 (ja) 2022-02-24 2022-11-15 伝送基板の製造方法

Country Status (4)

Country Link
US (1) US20250151203A1 (https=)
JP (1) JP7790546B2 (https=)
CN (1) CN118648383A (https=)
WO (1) WO2023162367A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003198097A (ja) * 2001-12-28 2003-07-11 Seiko Epson Corp 配線基板の製造方法及び製造装置
JP2004140587A (ja) * 2002-10-17 2004-05-13 Toyo Aluminium Kk アンテナ回路構成体およびそれを備えた機能カード
JP2005285884A (ja) * 2004-03-29 2005-10-13 Hitachi Cable Ltd 半導体装置用テープキャリアの製造方法およびそのエッチング処理装置
JP2008172602A (ja) * 2007-01-12 2008-07-24 Mitsubishi Electric Corp アンテナ装置
JP2013026401A (ja) * 2011-07-20 2013-02-04 Kyocera Corp 多数個取り配線基板
JP2016046376A (ja) * 2014-08-22 2016-04-04 アルプス電気株式会社 高周波モジュール及び高周波モジュールの製造方法
JP2019212657A (ja) * 2018-05-31 2019-12-12 日東電工株式会社 配線回路基板集合体シート、その製造方法および配線回路基板の製造方法
WO2020031615A1 (ja) * 2018-08-10 2020-02-13 日東電工株式会社 配線回路基板集合体シートおよびその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003198097A (ja) * 2001-12-28 2003-07-11 Seiko Epson Corp 配線基板の製造方法及び製造装置
JP2004140587A (ja) * 2002-10-17 2004-05-13 Toyo Aluminium Kk アンテナ回路構成体およびそれを備えた機能カード
JP2005285884A (ja) * 2004-03-29 2005-10-13 Hitachi Cable Ltd 半導体装置用テープキャリアの製造方法およびそのエッチング処理装置
JP2008172602A (ja) * 2007-01-12 2008-07-24 Mitsubishi Electric Corp アンテナ装置
JP2013026401A (ja) * 2011-07-20 2013-02-04 Kyocera Corp 多数個取り配線基板
JP2016046376A (ja) * 2014-08-22 2016-04-04 アルプス電気株式会社 高周波モジュール及び高周波モジュールの製造方法
JP2019212657A (ja) * 2018-05-31 2019-12-12 日東電工株式会社 配線回路基板集合体シート、その製造方法および配線回路基板の製造方法
WO2020031615A1 (ja) * 2018-08-10 2020-02-13 日東電工株式会社 配線回路基板集合体シートおよびその製造方法

Also Published As

Publication number Publication date
CN118648383A (zh) 2024-09-13
US20250151203A1 (en) 2025-05-08
WO2023162367A1 (ja) 2023-08-31
JP7790546B2 (ja) 2025-12-23

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