JP7775535B2 - フレキシブル多層回路基板 - Google Patents

フレキシブル多層回路基板

Info

Publication number
JP7775535B2
JP7775535B2 JP2025539946A JP2025539946A JP7775535B2 JP 7775535 B2 JP7775535 B2 JP 7775535B2 JP 2025539946 A JP2025539946 A JP 2025539946A JP 2025539946 A JP2025539946 A JP 2025539946A JP 7775535 B2 JP7775535 B2 JP 7775535B2
Authority
JP
Japan
Prior art keywords
thickness
layer
ground conductor
resin layer
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025539946A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025121093A1 (https=
Inventor
卓 今泉
亮人 松富
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of JPWO2025121093A1 publication Critical patent/JPWO2025121093A1/ja
Application granted granted Critical
Publication of JP7775535B2 publication Critical patent/JP7775535B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2025539946A 2023-12-07 2024-11-13 フレキシブル多層回路基板 Active JP7775535B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023207116 2023-12-07
JP2023207116 2023-12-07
PCT/JP2024/040303 WO2025121093A1 (ja) 2023-12-07 2024-11-13 フレキシブル多層回路基板

Publications (2)

Publication Number Publication Date
JPWO2025121093A1 JPWO2025121093A1 (https=) 2025-06-12
JP7775535B2 true JP7775535B2 (ja) 2025-11-25

Family

ID=95979820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025539946A Active JP7775535B2 (ja) 2023-12-07 2024-11-13 フレキシブル多層回路基板

Country Status (3)

Country Link
JP (1) JP7775535B2 (https=)
TW (1) TW202529489A (https=)
WO (1) WO2025121093A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008035416A1 (en) 2006-09-21 2008-03-27 Daisho Denshi Co., Ltd. Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board
WO2023176643A1 (ja) 2022-03-17 2023-09-21 株式会社村田製作所 多層基板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06334279A (ja) * 1993-05-20 1994-12-02 Minolta Camera Co Ltd 多層フレキシブル電装基板
JP2023049844A (ja) * 2021-09-29 2023-04-10 キヤノン株式会社 フレキシブル配線板、電子モジュール、電子ユニットおよび電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008035416A1 (en) 2006-09-21 2008-03-27 Daisho Denshi Co., Ltd. Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board
WO2023176643A1 (ja) 2022-03-17 2023-09-21 株式会社村田製作所 多層基板

Also Published As

Publication number Publication date
WO2025121093A1 (ja) 2025-06-12
TW202529489A (zh) 2025-07-16
JPWO2025121093A1 (https=) 2025-06-12

Similar Documents

Publication Publication Date Title
US20090084583A1 (en) Multilayer printed wiring board and method for fabrication thereof
US12119531B2 (en) Signal transmission line comprising stacked insulating layers having a signal line and a ground conductor respectively spaced apart by a spacer with a hollow portion
JP2016063188A (ja) プリント配線板
US12036776B2 (en) Resin multilayer substrate and method for manufacturing resin multilayer substrate
CN114402699B (zh) 布线电路基板
US11266016B2 (en) Resin multilayer substrate and electronic apparatus
CN219204859U (zh) 多层基板
CN106572587B (zh) 柔性电路板及其制作方法
WO2019035248A1 (ja) フレキシブルプリント配線板
KR20200007308A (ko) 인쇄회로기판
CN207560432U (zh) 多层基板
JP4414365B2 (ja) 高速伝送用基板
JP7775535B2 (ja) フレキシブル多層回路基板
KR20200008389A (ko) 인쇄회로기판
JP2017045882A (ja) フレキシブル基板及びその製造方法並びに電子装置
CN211828497U (zh) 树脂多层基板以及电子设备
JP7180781B2 (ja) 伝送線路、および、伝送線路の製造方法
TW202247734A (zh) 配線電路基板及其製造方法
JP6048719B2 (ja) プリント配線板及び該プリント配線板の製造方法
TWI903357B (zh) 接合印刷線路板、印刷線路板以及接合印刷線路板的製造方法
JP7400821B2 (ja) 伝送線路の製造方法及び伝送線路
WO2021025025A1 (ja) 樹脂多層基板および樹脂多層基板の製造方法
KR20200029427A (ko) 인쇄회로기판
JP7480861B2 (ja) 積層基板および積層基板の製造方法
JP7790633B2 (ja) 多層回路基板

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250709

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20250709

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20251028

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20251112

R150 Certificate of patent or registration of utility model

Ref document number: 7775535

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150