TW202529489A - 撓性多層電路基板 - Google Patents

撓性多層電路基板

Info

Publication number
TW202529489A
TW202529489A TW113144301A TW113144301A TW202529489A TW 202529489 A TW202529489 A TW 202529489A TW 113144301 A TW113144301 A TW 113144301A TW 113144301 A TW113144301 A TW 113144301A TW 202529489 A TW202529489 A TW 202529489A
Authority
TW
Taiwan
Prior art keywords
thickness
layer
ground conductor
resin layer
thickness direction
Prior art date
Application number
TW113144301A
Other languages
English (en)
Chinese (zh)
Inventor
今泉卓
松富亮人
Original Assignee
日商日東電工股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日東電工股份有限公司 filed Critical 日商日東電工股份有限公司
Publication of TW202529489A publication Critical patent/TW202529489A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
TW113144301A 2023-12-07 2024-11-18 撓性多層電路基板 TW202529489A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-207116 2023-12-07
JP2023207116 2023-12-07

Publications (1)

Publication Number Publication Date
TW202529489A true TW202529489A (zh) 2025-07-16

Family

ID=95979820

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113144301A TW202529489A (zh) 2023-12-07 2024-11-18 撓性多層電路基板

Country Status (3)

Country Link
JP (1) JP7775535B2 (https=)
TW (1) TW202529489A (https=)
WO (1) WO2025121093A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06334279A (ja) * 1993-05-20 1994-12-02 Minolta Camera Co Ltd 多層フレキシブル電装基板
WO2008035416A1 (en) 2006-09-21 2008-03-27 Daisho Denshi Co., Ltd. Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board
JP2023049844A (ja) * 2021-09-29 2023-04-10 キヤノン株式会社 フレキシブル配線板、電子モジュール、電子ユニットおよび電子機器
CN223261692U (zh) 2022-03-17 2025-08-22 株式会社村田制作所 多层基板

Also Published As

Publication number Publication date
WO2025121093A1 (ja) 2025-06-12
JPWO2025121093A1 (https=) 2025-06-12
JP7775535B2 (ja) 2025-11-25

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