JPWO2025121093A1 - - Google Patents

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Publication number
JPWO2025121093A1
JPWO2025121093A1 JP2025539946A JP2025539946A JPWO2025121093A1 JP WO2025121093 A1 JPWO2025121093 A1 JP WO2025121093A1 JP 2025539946 A JP2025539946 A JP 2025539946A JP 2025539946 A JP2025539946 A JP 2025539946A JP WO2025121093 A1 JPWO2025121093 A1 JP WO2025121093A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2025539946A
Other languages
Japanese (ja)
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JP7775535B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2025121093A1 publication Critical patent/JPWO2025121093A1/ja
Application granted granted Critical
Publication of JP7775535B2 publication Critical patent/JP7775535B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
JP2025539946A 2023-12-07 2024-11-13 フレキシブル多層回路基板 Active JP7775535B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023207116 2023-12-07
JP2023207116 2023-12-07
PCT/JP2024/040303 WO2025121093A1 (ja) 2023-12-07 2024-11-13 フレキシブル多層回路基板

Publications (2)

Publication Number Publication Date
JPWO2025121093A1 true JPWO2025121093A1 (https=) 2025-06-12
JP7775535B2 JP7775535B2 (ja) 2025-11-25

Family

ID=95979820

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025539946A Active JP7775535B2 (ja) 2023-12-07 2024-11-13 フレキシブル多層回路基板

Country Status (3)

Country Link
JP (1) JP7775535B2 (https=)
TW (1) TW202529489A (https=)
WO (1) WO2025121093A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06334279A (ja) * 1993-05-20 1994-12-02 Minolta Camera Co Ltd 多層フレキシブル電装基板
WO2008035416A1 (en) * 2006-09-21 2008-03-27 Daisho Denshi Co., Ltd. Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board
JP2023049844A (ja) * 2021-09-29 2023-04-10 キヤノン株式会社 フレキシブル配線板、電子モジュール、電子ユニットおよび電子機器
WO2023176643A1 (ja) * 2022-03-17 2023-09-21 株式会社村田製作所 多層基板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06334279A (ja) * 1993-05-20 1994-12-02 Minolta Camera Co Ltd 多層フレキシブル電装基板
WO2008035416A1 (en) * 2006-09-21 2008-03-27 Daisho Denshi Co., Ltd. Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board
JP2023049844A (ja) * 2021-09-29 2023-04-10 キヤノン株式会社 フレキシブル配線板、電子モジュール、電子ユニットおよび電子機器
WO2023176643A1 (ja) * 2022-03-17 2023-09-21 株式会社村田製作所 多層基板

Also Published As

Publication number Publication date
WO2025121093A1 (ja) 2025-06-12
TW202529489A (zh) 2025-07-16
JP7775535B2 (ja) 2025-11-25

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