JPWO2025121093A1 - - Google Patents
Info
- Publication number
- JPWO2025121093A1 JPWO2025121093A1 JP2025539946A JP2025539946A JPWO2025121093A1 JP WO2025121093 A1 JPWO2025121093 A1 JP WO2025121093A1 JP 2025539946 A JP2025539946 A JP 2025539946A JP 2025539946 A JP2025539946 A JP 2025539946A JP WO2025121093 A1 JPWO2025121093 A1 JP WO2025121093A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023207116 | 2023-12-07 | ||
| JP2023207116 | 2023-12-07 | ||
| PCT/JP2024/040303 WO2025121093A1 (ja) | 2023-12-07 | 2024-11-13 | フレキシブル多層回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025121093A1 true JPWO2025121093A1 (https=) | 2025-06-12 |
| JP7775535B2 JP7775535B2 (ja) | 2025-11-25 |
Family
ID=95979820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025539946A Active JP7775535B2 (ja) | 2023-12-07 | 2024-11-13 | フレキシブル多層回路基板 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7775535B2 (https=) |
| TW (1) | TW202529489A (https=) |
| WO (1) | WO2025121093A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06334279A (ja) * | 1993-05-20 | 1994-12-02 | Minolta Camera Co Ltd | 多層フレキシブル電装基板 |
| WO2008035416A1 (en) * | 2006-09-21 | 2008-03-27 | Daisho Denshi Co., Ltd. | Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board |
| JP2023049844A (ja) * | 2021-09-29 | 2023-04-10 | キヤノン株式会社 | フレキシブル配線板、電子モジュール、電子ユニットおよび電子機器 |
| WO2023176643A1 (ja) * | 2022-03-17 | 2023-09-21 | 株式会社村田製作所 | 多層基板 |
-
2024
- 2024-11-13 WO PCT/JP2024/040303 patent/WO2025121093A1/ja active Pending
- 2024-11-13 JP JP2025539946A patent/JP7775535B2/ja active Active
- 2024-11-18 TW TW113144301A patent/TW202529489A/zh unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06334279A (ja) * | 1993-05-20 | 1994-12-02 | Minolta Camera Co Ltd | 多層フレキシブル電装基板 |
| WO2008035416A1 (en) * | 2006-09-21 | 2008-03-27 | Daisho Denshi Co., Ltd. | Flex-rigid printed circuit board, and method for manufacturing the flex-rigid printed circuit board |
| JP2023049844A (ja) * | 2021-09-29 | 2023-04-10 | キヤノン株式会社 | フレキシブル配線板、電子モジュール、電子ユニットおよび電子機器 |
| WO2023176643A1 (ja) * | 2022-03-17 | 2023-09-21 | 株式会社村田製作所 | 多層基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025121093A1 (ja) | 2025-06-12 |
| TW202529489A (zh) | 2025-07-16 |
| JP7775535B2 (ja) | 2025-11-25 |
Similar Documents
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