JP7752243B2 - 基板搬送装置 - Google Patents

基板搬送装置

Info

Publication number
JP7752243B2
JP7752243B2 JP2024524084A JP2024524084A JP7752243B2 JP 7752243 B2 JP7752243 B2 JP 7752243B2 JP 2024524084 A JP2024524084 A JP 2024524084A JP 2024524084 A JP2024524084 A JP 2024524084A JP 7752243 B2 JP7752243 B2 JP 7752243B2
Authority
JP
Japan
Prior art keywords
shutter mechanism
storage container
substrate
substrate transport
transport robot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024524084A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023233597A1 (https=
JPWO2023233597A5 (https=
Inventor
慧太 川上
智貴 羽石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Publication of JPWO2023233597A1 publication Critical patent/JPWO2023233597A1/ja
Publication of JPWO2023233597A5 publication Critical patent/JPWO2023233597A5/ja
Application granted granted Critical
Publication of JP7752243B2 publication Critical patent/JP7752243B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2024524084A 2022-06-01 2022-06-01 基板搬送装置 Active JP7752243B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/022370 WO2023233597A1 (ja) 2022-06-01 2022-06-01 基板搬送装置

Publications (3)

Publication Number Publication Date
JPWO2023233597A1 JPWO2023233597A1 (https=) 2023-12-07
JPWO2023233597A5 JPWO2023233597A5 (https=) 2025-02-27
JP7752243B2 true JP7752243B2 (ja) 2025-10-09

Family

ID=89026155

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024524084A Active JP7752243B2 (ja) 2022-06-01 2022-06-01 基板搬送装置

Country Status (4)

Country Link
US (1) US20250316514A1 (https=)
JP (1) JP7752243B2 (https=)
DE (1) DE112022006917T5 (https=)
WO (1) WO2023233597A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110756A (ja) 2000-09-22 2002-04-12 Applied Materials Inc オープンカセット用ロードポート
JP2007250563A (ja) 2006-03-13 2007-09-27 Disco Abrasive Syst Ltd 研削装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07211764A (ja) * 1994-01-20 1995-08-11 Nikon Corp レーザ応用装置
JPH11135594A (ja) * 1997-10-30 1999-05-21 Kokusai Electric Co Ltd カセット搬送方法および装置
JP5825948B2 (ja) 2011-09-14 2015-12-02 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP6217567B2 (ja) 2014-09-08 2017-10-25 信越半導体株式会社 半導体製造装置、半導体基板の製造方法及び搬送ロボット
JP6822953B2 (ja) 2014-11-25 2021-01-27 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板キャリア及びパージチャンバの環境制御を伴う基板処理のシステム、装置、及び方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002110756A (ja) 2000-09-22 2002-04-12 Applied Materials Inc オープンカセット用ロードポート
JP2007250563A (ja) 2006-03-13 2007-09-27 Disco Abrasive Syst Ltd 研削装置

Also Published As

Publication number Publication date
JPWO2023233597A1 (https=) 2023-12-07
WO2023233597A1 (ja) 2023-12-07
US20250316514A1 (en) 2025-10-09
DE112022006917T5 (de) 2025-01-09

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