JPWO2023233597A1 - - Google Patents
Info
- Publication number
- JPWO2023233597A1 JPWO2023233597A1 JP2024524084A JP2024524084A JPWO2023233597A1 JP WO2023233597 A1 JPWO2023233597 A1 JP WO2023233597A1 JP 2024524084 A JP2024524084 A JP 2024524084A JP 2024524084 A JP2024524084 A JP 2024524084A JP WO2023233597 A1 JPWO2023233597 A1 JP WO2023233597A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3402—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
- H10P72/3302—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
- H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/022370 WO2023233597A1 (ja) | 2022-06-01 | 2022-06-01 | 基板搬送装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023233597A1 true JPWO2023233597A1 (https=) | 2023-12-07 |
| JPWO2023233597A5 JPWO2023233597A5 (https=) | 2025-02-27 |
| JP7752243B2 JP7752243B2 (ja) | 2025-10-09 |
Family
ID=89026155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024524084A Active JP7752243B2 (ja) | 2022-06-01 | 2022-06-01 | 基板搬送装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250316514A1 (https=) |
| JP (1) | JP7752243B2 (https=) |
| DE (1) | DE112022006917T5 (https=) |
| WO (1) | WO2023233597A1 (https=) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07211764A (ja) * | 1994-01-20 | 1995-08-11 | Nikon Corp | レーザ応用装置 |
| JPH11135594A (ja) * | 1997-10-30 | 1999-05-21 | Kokusai Electric Co Ltd | カセット搬送方法および装置 |
| JP2002110756A (ja) * | 2000-09-22 | 2002-04-12 | Applied Materials Inc | オープンカセット用ロードポート |
| JP2007250563A (ja) * | 2006-03-13 | 2007-09-27 | Disco Abrasive Syst Ltd | 研削装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5825948B2 (ja) | 2011-09-14 | 2015-12-02 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法 |
| JP6217567B2 (ja) | 2014-09-08 | 2017-10-25 | 信越半導体株式会社 | 半導体製造装置、半導体基板の製造方法及び搬送ロボット |
| JP6822953B2 (ja) | 2014-11-25 | 2021-01-27 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 基板キャリア及びパージチャンバの環境制御を伴う基板処理のシステム、装置、及び方法 |
-
2022
- 2022-06-01 WO PCT/JP2022/022370 patent/WO2023233597A1/ja not_active Ceased
- 2022-06-01 DE DE112022006917.1T patent/DE112022006917T5/de active Pending
- 2022-06-01 JP JP2024524084A patent/JP7752243B2/ja active Active
- 2022-06-01 US US18/865,773 patent/US20250316514A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07211764A (ja) * | 1994-01-20 | 1995-08-11 | Nikon Corp | レーザ応用装置 |
| JPH11135594A (ja) * | 1997-10-30 | 1999-05-21 | Kokusai Electric Co Ltd | カセット搬送方法および装置 |
| JP2002110756A (ja) * | 2000-09-22 | 2002-04-12 | Applied Materials Inc | オープンカセット用ロードポート |
| JP2007250563A (ja) * | 2006-03-13 | 2007-09-27 | Disco Abrasive Syst Ltd | 研削装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023233597A1 (ja) | 2023-12-07 |
| US20250316514A1 (en) | 2025-10-09 |
| DE112022006917T5 (de) | 2025-01-09 |
| JP7752243B2 (ja) | 2025-10-09 |
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