JP7699424B2 - フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板 - Google Patents

フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板 Download PDF

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Publication number
JP7699424B2
JP7699424B2 JP2019196803A JP2019196803A JP7699424B2 JP 7699424 B2 JP7699424 B2 JP 7699424B2 JP 2019196803 A JP2019196803 A JP 2019196803A JP 2019196803 A JP2019196803 A JP 2019196803A JP 7699424 B2 JP7699424 B2 JP 7699424B2
Authority
JP
Japan
Prior art keywords
film
thermosetting resin
printed wiring
flexible printed
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019196803A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021072324A (ja
Inventor
喬之 鈴川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Priority to JP2019196803A priority Critical patent/JP7699424B2/ja
Priority to KR1020200138162A priority patent/KR20210052274A/ko
Priority to TW109137216A priority patent/TW202124149A/zh
Publication of JP2021072324A publication Critical patent/JP2021072324A/ja
Priority to JP2024134892A priority patent/JP2024159771A/ja
Application granted granted Critical
Publication of JP7699424B2 publication Critical patent/JP7699424B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
JP2019196803A 2019-10-29 2019-10-29 フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板 Active JP7699424B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019196803A JP7699424B2 (ja) 2019-10-29 2019-10-29 フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板
KR1020200138162A KR20210052274A (ko) 2019-10-29 2020-10-23 플렉시블 프린트 배선판용 적층 필름의 제조 방법 및 플렉시블 프린트 배선판
TW109137216A TW202124149A (zh) 2019-10-29 2020-10-27 可撓性印刷線路板用積層薄膜的製造方法及可撓性印刷線路板
JP2024134892A JP2024159771A (ja) 2019-10-29 2024-08-13 フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019196803A JP7699424B2 (ja) 2019-10-29 2019-10-29 フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024134892A Division JP2024159771A (ja) 2019-10-29 2024-08-13 フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板

Publications (2)

Publication Number Publication Date
JP2021072324A JP2021072324A (ja) 2021-05-06
JP7699424B2 true JP7699424B2 (ja) 2025-06-27

Family

ID=75714059

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019196803A Active JP7699424B2 (ja) 2019-10-29 2019-10-29 フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板
JP2024134892A Pending JP2024159771A (ja) 2019-10-29 2024-08-13 フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024134892A Pending JP2024159771A (ja) 2019-10-29 2024-08-13 フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板

Country Status (3)

Country Link
JP (2) JP7699424B2 (enExample)
KR (1) KR20210052274A (enExample)
TW (1) TW202124149A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102555582B1 (ko) 2021-07-08 2023-07-17 주식회사 엠아이이큅먼트코리아 플립칩 본딩을 위한 정밀 가압장치
KR102582980B1 (ko) 2021-08-12 2023-09-26 주식회사 엠아이이큅먼트코리아 정밀 가압장치를 구비한 플립칩 레이저 본딩기

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019151716A (ja) 2018-03-01 2019-09-12 味の素株式会社 封止用樹脂組成物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3111441B2 (ja) * 1993-11-30 2000-11-20 宇部興産株式会社 プリント配線板用基板
TWI495561B (zh) * 2008-08-29 2015-08-11 Ajinomoto Kk Film with metal film
JP2015149552A (ja) 2014-02-05 2015-08-20 株式会社ニコン ウェアラブル型電子機器
JP6325326B2 (ja) * 2014-04-18 2018-05-16 積水フーラー株式会社 硬化性組成物
JP2017204538A (ja) 2016-05-10 2017-11-16 日立化成株式会社 柔軟性シート、透明フレキシブルプリント配線板及びそれらの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019151716A (ja) 2018-03-01 2019-09-12 味の素株式会社 封止用樹脂組成物

Also Published As

Publication number Publication date
JP2021072324A (ja) 2021-05-06
KR20210052274A (ko) 2021-05-10
TW202124149A (zh) 2021-07-01
JP2024159771A (ja) 2024-11-08

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