TW202124149A - 可撓性印刷線路板用積層薄膜的製造方法及可撓性印刷線路板 - Google Patents

可撓性印刷線路板用積層薄膜的製造方法及可撓性印刷線路板 Download PDF

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Publication number
TW202124149A
TW202124149A TW109137216A TW109137216A TW202124149A TW 202124149 A TW202124149 A TW 202124149A TW 109137216 A TW109137216 A TW 109137216A TW 109137216 A TW109137216 A TW 109137216A TW 202124149 A TW202124149 A TW 202124149A
Authority
TW
Taiwan
Prior art keywords
film
flexible printed
printed wiring
thermosetting resin
wiring board
Prior art date
Application number
TW109137216A
Other languages
English (en)
Chinese (zh)
Inventor
鈴川喬之
Original Assignee
日商昭和電工材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商昭和電工材料股份有限公司 filed Critical 日商昭和電工材料股份有限公司
Publication of TW202124149A publication Critical patent/TW202124149A/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Structure Of Printed Boards (AREA)
TW109137216A 2019-10-29 2020-10-27 可撓性印刷線路板用積層薄膜的製造方法及可撓性印刷線路板 TW202124149A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-196803 2019-10-29
JP2019196803A JP7699424B2 (ja) 2019-10-29 2019-10-29 フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板

Publications (1)

Publication Number Publication Date
TW202124149A true TW202124149A (zh) 2021-07-01

Family

ID=75714059

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109137216A TW202124149A (zh) 2019-10-29 2020-10-27 可撓性印刷線路板用積層薄膜的製造方法及可撓性印刷線路板

Country Status (3)

Country Link
JP (2) JP7699424B2 (enExample)
KR (1) KR20210052274A (enExample)
TW (1) TW202124149A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102555582B1 (ko) 2021-07-08 2023-07-17 주식회사 엠아이이큅먼트코리아 플립칩 본딩을 위한 정밀 가압장치
KR102582980B1 (ko) 2021-08-12 2023-09-26 주식회사 엠아이이큅먼트코리아 정밀 가압장치를 구비한 플립칩 레이저 본딩기

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3111441B2 (ja) * 1993-11-30 2000-11-20 宇部興産株式会社 プリント配線板用基板
TWI495561B (zh) * 2008-08-29 2015-08-11 Ajinomoto Kk Film with metal film
JP2015149552A (ja) 2014-02-05 2015-08-20 株式会社ニコン ウェアラブル型電子機器
JP6325326B2 (ja) * 2014-04-18 2018-05-16 積水フーラー株式会社 硬化性組成物
JP2017204538A (ja) 2016-05-10 2017-11-16 日立化成株式会社 柔軟性シート、透明フレキシブルプリント配線板及びそれらの製造方法
JP7225546B2 (ja) * 2018-03-01 2023-02-21 味の素株式会社 封止用樹脂組成物

Also Published As

Publication number Publication date
JP7699424B2 (ja) 2025-06-27
JP2021072324A (ja) 2021-05-06
KR20210052274A (ko) 2021-05-10
JP2024159771A (ja) 2024-11-08

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