KR20210052274A - 플렉시블 프린트 배선판용 적층 필름의 제조 방법 및 플렉시블 프린트 배선판 - Google Patents
플렉시블 프린트 배선판용 적층 필름의 제조 방법 및 플렉시블 프린트 배선판 Download PDFInfo
- Publication number
- KR20210052274A KR20210052274A KR1020200138162A KR20200138162A KR20210052274A KR 20210052274 A KR20210052274 A KR 20210052274A KR 1020200138162 A KR1020200138162 A KR 1020200138162A KR 20200138162 A KR20200138162 A KR 20200138162A KR 20210052274 A KR20210052274 A KR 20210052274A
- Authority
- KR
- South Korea
- Prior art keywords
- flexible printed
- printed wiring
- film
- curing
- laminated film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2019-196803 | 2019-10-29 | ||
| JP2019196803A JP7699424B2 (ja) | 2019-10-29 | 2019-10-29 | フレキシブルプリント配線板用積層フィルムの製造方法及びフレキシブルプリント配線板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20210052274A true KR20210052274A (ko) | 2021-05-10 |
Family
ID=75714059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020200138162A Pending KR20210052274A (ko) | 2019-10-29 | 2020-10-23 | 플렉시블 프린트 배선판용 적층 필름의 제조 방법 및 플렉시블 프린트 배선판 |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP7699424B2 (enExample) |
| KR (1) | KR20210052274A (enExample) |
| TW (1) | TW202124149A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230009005A (ko) | 2021-07-08 | 2023-01-17 | 주식회사 엠아이이큅먼트코리아 | 플립칩 본딩을 위한 정밀 가압장치 |
| KR20230024511A (ko) | 2021-08-12 | 2023-02-21 | 주식회사 엠아이이큅먼트코리아 | 정밀 가압장치를 구비한 플립칩 레이저 본딩기 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015149552A (ja) | 2014-02-05 | 2015-08-20 | 株式会社ニコン | ウェアラブル型電子機器 |
| JP2017204538A (ja) | 2016-05-10 | 2017-11-16 | 日立化成株式会社 | 柔軟性シート、透明フレキシブルプリント配線板及びそれらの製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3111441B2 (ja) * | 1993-11-30 | 2000-11-20 | 宇部興産株式会社 | プリント配線板用基板 |
| TWI495561B (zh) * | 2008-08-29 | 2015-08-11 | Ajinomoto Kk | Film with metal film |
| JP6325326B2 (ja) * | 2014-04-18 | 2018-05-16 | 積水フーラー株式会社 | 硬化性組成物 |
| JP7225546B2 (ja) * | 2018-03-01 | 2023-02-21 | 味の素株式会社 | 封止用樹脂組成物 |
-
2019
- 2019-10-29 JP JP2019196803A patent/JP7699424B2/ja active Active
-
2020
- 2020-10-23 KR KR1020200138162A patent/KR20210052274A/ko active Pending
- 2020-10-27 TW TW109137216A patent/TW202124149A/zh unknown
-
2024
- 2024-08-13 JP JP2024134892A patent/JP2024159771A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015149552A (ja) | 2014-02-05 | 2015-08-20 | 株式会社ニコン | ウェアラブル型電子機器 |
| JP2017204538A (ja) | 2016-05-10 | 2017-11-16 | 日立化成株式会社 | 柔軟性シート、透明フレキシブルプリント配線板及びそれらの製造方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230009005A (ko) | 2021-07-08 | 2023-01-17 | 주식회사 엠아이이큅먼트코리아 | 플립칩 본딩을 위한 정밀 가압장치 |
| KR20230024511A (ko) | 2021-08-12 | 2023-02-21 | 주식회사 엠아이이큅먼트코리아 | 정밀 가압장치를 구비한 플립칩 레이저 본딩기 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7699424B2 (ja) | 2025-06-27 |
| JP2021072324A (ja) | 2021-05-06 |
| TW202124149A (zh) | 2021-07-01 |
| JP2024159771A (ja) | 2024-11-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20201023 |
|
| PG1501 | Laying open of application | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20250512 Patent event code: PE09021S01D |