JP7647880B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP7647880B2
JP7647880B2 JP2023521004A JP2023521004A JP7647880B2 JP 7647880 B2 JP7647880 B2 JP 7647880B2 JP 2023521004 A JP2023521004 A JP 2023521004A JP 2023521004 A JP2023521004 A JP 2023521004A JP 7647880 B2 JP7647880 B2 JP 7647880B2
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JP
Japan
Prior art keywords
electrode layer
main surface
layer
electrode
dielectric film
Prior art date
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Active
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JP2023521004A
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English (en)
Japanese (ja)
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JPWO2022239717A5 (https=
JPWO2022239717A1 (https=
Inventor
真臣 原田
是清 伊藤
武史 香川
勇太 今村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
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Publication of JPWO2022239717A1 publication Critical patent/JPWO2022239717A1/ja
Publication of JPWO2022239717A5 publication Critical patent/JPWO2022239717A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2023521004A 2021-05-10 2022-05-09 半導体装置 Active JP7647880B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021079848 2021-05-10
JP2021079848 2021-05-10
PCT/JP2022/019619 WO2022239717A1 (ja) 2021-05-10 2022-05-09 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2022239717A1 JPWO2022239717A1 (https=) 2022-11-17
JPWO2022239717A5 JPWO2022239717A5 (https=) 2024-02-13
JP7647880B2 true JP7647880B2 (ja) 2025-03-18

Family

ID=84029613

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023521004A Active JP7647880B2 (ja) 2021-05-10 2022-05-09 半導体装置

Country Status (4)

Country Link
US (1) US12424383B2 (https=)
JP (1) JP7647880B2 (https=)
CN (1) CN117280433A (https=)
WO (1) WO2022239717A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121693790A (zh) * 2023-09-08 2026-03-17 株式会社村田制作所 无源电子部件

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008153497A (ja) 2006-12-19 2008-07-03 Murata Mfg Co Ltd 誘電体薄膜キャパシタの製造方法
JP2008252011A (ja) 2007-03-30 2008-10-16 Taiyo Yuden Co Ltd 誘電体キャパシタ
WO2008149622A1 (ja) 2007-05-30 2008-12-11 Kyocera Corporation キャパシタ，共振器、フィルタ装置，通信装置、並びに電気回路
WO2018008625A1 (ja) 2016-07-07 2018-01-11 株式会社村田製作所 キャパシタ
JP2020115587A (ja) 2016-06-28 2020-07-30 株式会社村田製作所 キャパシタ
JP2020202307A (ja) 2019-06-11 2020-12-17 株式会社村田製作所 キャパシタ

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0547586A (ja) 1991-08-16 1993-02-26 Toshiba Corp コンデンサ部品
TW563142B (en) * 2001-07-12 2003-11-21 Hitachi Ltd Thin film capacitor, and electronic circuit component
US6635498B2 (en) * 2001-12-20 2003-10-21 Texas Instruments Incorporated Method of patterning a FeRAM capacitor with a sidewall during bottom electrode etch
JP4166013B2 (ja) 2001-12-26 2008-10-15 富士通株式会社 薄膜キャパシタ製造方法
JP2006196871A (ja) * 2004-12-15 2006-07-27 Kyocera Corp 薄膜コンデンサおよび可変容量コンデンサならびに電子部品
WO2006117912A1 (ja) * 2005-04-27 2006-11-09 Murata Manufacturing Co., Ltd 薄膜キャパシタおよびその製造方法
US7304339B2 (en) * 2005-09-22 2007-12-04 Agile Rf, Inc. Passivation structure for ferroelectric thin-film devices
JP4596167B2 (ja) * 2006-02-24 2010-12-08 セイコーエプソン株式会社 キャパシタの製造方法
JP5098422B2 (ja) * 2007-04-27 2012-12-12 株式会社村田製作所 薄膜電子部品
JP6489202B2 (ja) * 2015-02-27 2019-03-27 株式会社村田製作所 キャパシタ
JP6737118B2 (ja) * 2016-10-11 2020-08-05 Tdk株式会社 薄膜コンデンサ
WO2019026771A1 (ja) * 2017-07-31 2019-02-07 株式会社村田製作所 キャパシタ
JP2022144464A (ja) * 2021-03-19 2022-10-03 住友電工デバイス・イノベーション株式会社 キャパシタ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008153497A (ja) 2006-12-19 2008-07-03 Murata Mfg Co Ltd 誘電体薄膜キャパシタの製造方法
JP2008252011A (ja) 2007-03-30 2008-10-16 Taiyo Yuden Co Ltd 誘電体キャパシタ
WO2008149622A1 (ja) 2007-05-30 2008-12-11 Kyocera Corporation キャパシタ，共振器、フィルタ装置，通信装置、並びに電気回路
JP2020115587A (ja) 2016-06-28 2020-07-30 株式会社村田製作所 キャパシタ
WO2018008625A1 (ja) 2016-07-07 2018-01-11 株式会社村田製作所 キャパシタ
JP2020202307A (ja) 2019-06-11 2020-12-17 株式会社村田製作所 キャパシタ

Also Published As

Publication number Publication date
CN117280433A (zh) 2023-12-22
JPWO2022239717A1 (https=) 2022-11-17
WO2022239717A1 (ja) 2022-11-17
US12424383B2 (en) 2025-09-23
US20240062958A1 (en) 2024-02-22

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