JP7646806B2 - 半導体基板、並びに半導体基板の製造方法および製造装置 - Google Patents

半導体基板、並びに半導体基板の製造方法および製造装置 Download PDF

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JP7646806B2
JP7646806B2 JP2023502483A JP2023502483A JP7646806B2 JP 7646806 B2 JP7646806 B2 JP 7646806B2 JP 2023502483 A JP2023502483 A JP 2023502483A JP 2023502483 A JP2023502483 A JP 2023502483A JP 7646806 B2 JP7646806 B2 JP 7646806B2
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semiconductor
seed
pattern
substrate
semiconductor substrate
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JPWO2022181686A5 (https=
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克明 正木
剛 神川
敏洋 小林
雄一郎 林
優太 青木
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Kyocera Corp
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JP2023502483A 2021-02-26 2022-02-24 半導体基板、並びに半導体基板の製造方法および製造装置 Active JP7646806B2 (ja)

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US (1) US20240234141A9 (https=)
EP (1) EP4300605A4 (https=)
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KR (2) KR102869418B1 (https=)
CN (1) CN116941016A (https=)
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US12463033B2 (en) 2022-10-19 2025-11-04 Kyocera Corporation Semiconductor substrate, and manufacturing method and manufacturing apparatus of semiconductor substrate
WO2024084634A1 (ja) * 2022-10-19 2024-04-25 京セラ株式会社 半導体基板、半導体基板の製造方法および製造装置
WO2024084664A1 (ja) * 2022-10-20 2024-04-25 京セラ株式会社 半導体基板、テンプレート基板、並びにテンプレート基板の製造方法および製造装置
WO2024201629A1 (ja) * 2023-03-27 2024-10-03 京セラ株式会社 半導体成長用テンプレート基板、半導体基板、半導体成長用テンプレート基板の製造方法および製造装置、並びに半導体基板の製造方法および製造装置
TW202528574A (zh) * 2023-09-22 2025-07-16 日商京瓷股份有限公司 模片基板及其製造方法、半導體基板及其製造方法、模片基板之製造裝置以及半導體裝置之製造方法
WO2025115743A1 (ja) * 2023-11-30 2025-06-05 京セラ株式会社 半導体基板並びにその製造方法および製造装置、半導体デバイス
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TW202537182A (zh) * 2023-12-11 2025-09-16 日商京瓷股份有限公司 半導體基板以及其製造方法及製造裝置、半導體器件

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