JP7610248B2 - 弾性波デバイスパッケージ - Google Patents
弾性波デバイスパッケージ Download PDFInfo
- Publication number
- JP7610248B2 JP7610248B2 JP2021008415A JP2021008415A JP7610248B2 JP 7610248 B2 JP7610248 B2 JP 7610248B2 JP 2021008415 A JP2021008415 A JP 2021008415A JP 2021008415 A JP2021008415 A JP 2021008415A JP 7610248 B2 JP7610248 B2 JP 7610248B2
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- wave device
- film made
- metal film
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910052751 metal Inorganic materials 0.000 claims description 76
- 239000002184 metal Substances 0.000 claims description 76
- 239000000758 substrate Substances 0.000 claims description 47
- 239000011347 resin Substances 0.000 claims description 35
- 229920005989 resin Polymers 0.000 claims description 35
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 239000010936 titanium Substances 0.000 claims description 14
- 229910052719 titanium Inorganic materials 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 11
- 229910001374 Invar Inorganic materials 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 23
- 238000007747 plating Methods 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000005240 physical vapour deposition Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021008415A JP7610248B2 (ja) | 2021-01-22 | 2021-01-22 | 弾性波デバイスパッケージ |
| CN202110773549.4A CN114785312A (zh) | 2021-01-22 | 2021-07-08 | 弹性波装置封装 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021008415A JP7610248B2 (ja) | 2021-01-22 | 2021-01-22 | 弾性波デバイスパッケージ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022112576A JP2022112576A (ja) | 2022-08-03 |
| JP2022112576A5 JP2022112576A5 (https=) | 2024-01-24 |
| JP7610248B2 true JP7610248B2 (ja) | 2025-01-08 |
Family
ID=82422604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021008415A Active JP7610248B2 (ja) | 2021-01-22 | 2021-01-22 | 弾性波デバイスパッケージ |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7610248B2 (https=) |
| CN (1) | CN114785312A (https=) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004537178A (ja) | 2001-07-27 | 2004-12-09 | エプコス アクチエンゲゼルシャフト | 構成素子を気密封止するための方法 |
| JP2005184309A (ja) | 2003-12-18 | 2005-07-07 | Matsushita Electric Ind Co Ltd | 弾性表面波デバイス及びその製造方法 |
| JP2005223580A (ja) | 2004-02-05 | 2005-08-18 | Matsushita Electric Ind Co Ltd | 弾性表面波素子、弾性表面波デバイス及びその製造方法 |
| JP2006318949A (ja) | 2005-05-10 | 2006-11-24 | Fujimaru Kogyo Kk | ハーメチックシール用蓋体 |
| WO2017212742A1 (ja) | 2016-06-09 | 2017-12-14 | 株式会社村田製作所 | 弾性波装置 |
| JP2018085490A (ja) | 2016-11-25 | 2018-05-31 | 太陽誘電株式会社 | 電子部品およびその製造方法 |
| JP2018129631A (ja) | 2017-02-07 | 2018-08-16 | 太陽誘電株式会社 | 弾性波デバイス |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07111438A (ja) * | 1993-10-08 | 1995-04-25 | Hitachi Ltd | 弾性表面波装置、及びその製造方法 |
| KR102091424B1 (ko) * | 2015-12-21 | 2020-03-20 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치 |
| JP2019125871A (ja) * | 2018-01-12 | 2019-07-25 | 株式会社村田製作所 | 弾性波装置 |
-
2021
- 2021-01-22 JP JP2021008415A patent/JP7610248B2/ja active Active
- 2021-07-08 CN CN202110773549.4A patent/CN114785312A/zh active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004537178A (ja) | 2001-07-27 | 2004-12-09 | エプコス アクチエンゲゼルシャフト | 構成素子を気密封止するための方法 |
| JP2005184309A (ja) | 2003-12-18 | 2005-07-07 | Matsushita Electric Ind Co Ltd | 弾性表面波デバイス及びその製造方法 |
| JP2005223580A (ja) | 2004-02-05 | 2005-08-18 | Matsushita Electric Ind Co Ltd | 弾性表面波素子、弾性表面波デバイス及びその製造方法 |
| JP2006318949A (ja) | 2005-05-10 | 2006-11-24 | Fujimaru Kogyo Kk | ハーメチックシール用蓋体 |
| WO2017212742A1 (ja) | 2016-06-09 | 2017-12-14 | 株式会社村田製作所 | 弾性波装置 |
| JP2018085490A (ja) | 2016-11-25 | 2018-05-31 | 太陽誘電株式会社 | 電子部品およびその製造方法 |
| JP2018129631A (ja) | 2017-02-07 | 2018-08-16 | 太陽誘電株式会社 | 弾性波デバイス |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2022112576A (ja) | 2022-08-03 |
| CN114785312A (zh) | 2022-07-22 |
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