CN114785312A - 弹性波装置封装 - Google Patents

弹性波装置封装 Download PDF

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Publication number
CN114785312A
CN114785312A CN202110773549.4A CN202110773549A CN114785312A CN 114785312 A CN114785312 A CN 114785312A CN 202110773549 A CN202110773549 A CN 202110773549A CN 114785312 A CN114785312 A CN 114785312A
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CN
China
Prior art keywords
wave device
elastic wave
resin layer
metal film
film made
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110773549.4A
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English (en)
Chinese (zh)
Inventor
中村博文
熊谷浩一
门川裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyan Japan Technology Co ltd
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Sanyan Japan Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyan Japan Technology Co ltd filed Critical Sanyan Japan Technology Co ltd
Publication of CN114785312A publication Critical patent/CN114785312A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
CN202110773549.4A 2021-01-22 2021-07-08 弹性波装置封装 Pending CN114785312A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021008415A JP7610248B2 (ja) 2021-01-22 2021-01-22 弾性波デバイスパッケージ
JP2021-008415 2021-01-22

Publications (1)

Publication Number Publication Date
CN114785312A true CN114785312A (zh) 2022-07-22

Family

ID=82422604

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110773549.4A Pending CN114785312A (zh) 2021-01-22 2021-07-08 弹性波装置封装

Country Status (2)

Country Link
JP (1) JP7610248B2 (https=)
CN (1) CN114785312A (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111438A (ja) * 1993-10-08 1995-04-25 Hitachi Ltd 弾性表面波装置、及びその製造方法
JP2005223580A (ja) * 2004-02-05 2005-08-18 Matsushita Electric Ind Co Ltd 弾性表面波素子、弾性表面波デバイス及びその製造方法
WO2017110198A1 (ja) * 2015-12-21 2017-06-29 株式会社村田製作所 弾性波装置
CN110048688A (zh) * 2018-01-12 2019-07-23 株式会社村田制作所 弹性波装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10136743B4 (de) 2001-07-27 2013-02-14 Epcos Ag Verfahren zur hermetischen Verkapselung eines Bauelementes
JP2005184309A (ja) 2003-12-18 2005-07-07 Matsushita Electric Ind Co Ltd 弾性表面波デバイス及びその製造方法
JP2006318949A (ja) 2005-05-10 2006-11-24 Fujimaru Kogyo Kk ハーメチックシール用蓋体
WO2017212742A1 (ja) 2016-06-09 2017-12-14 株式会社村田製作所 弾性波装置
JP6449836B2 (ja) 2016-11-25 2019-01-09 太陽誘電株式会社 電子部品およびその製造方法
JP2018129631A (ja) 2017-02-07 2018-08-16 太陽誘電株式会社 弾性波デバイス

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07111438A (ja) * 1993-10-08 1995-04-25 Hitachi Ltd 弾性表面波装置、及びその製造方法
JP2005223580A (ja) * 2004-02-05 2005-08-18 Matsushita Electric Ind Co Ltd 弾性表面波素子、弾性表面波デバイス及びその製造方法
WO2017110198A1 (ja) * 2015-12-21 2017-06-29 株式会社村田製作所 弾性波装置
CN110048688A (zh) * 2018-01-12 2019-07-23 株式会社村田制作所 弹性波装置

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Publication number Publication date
JP7610248B2 (ja) 2025-01-08
JP2022112576A (ja) 2022-08-03

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