JP7609864B2 - 光硬化性シリコーン組成物及びその硬化物 - Google Patents

光硬化性シリコーン組成物及びその硬化物 Download PDF

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Publication number
JP7609864B2
JP7609864B2 JP2022527765A JP2022527765A JP7609864B2 JP 7609864 B2 JP7609864 B2 JP 7609864B2 JP 2022527765 A JP2022527765 A JP 2022527765A JP 2022527765 A JP2022527765 A JP 2022527765A JP 7609864 B2 JP7609864 B2 JP 7609864B2
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Japan
Prior art keywords
group
component
cured product
formula
photocurable silicone
Prior art date
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JP2022527765A
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English (en)
Japanese (ja)
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JP2023502362A5 (https=
JP2023502362A (ja
Inventor
ユク、チュヨン
パク、ジョンチャン
敦司 杉江
キム、ドック
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Toray Co Ltd
Dow Silicones Corp
Original Assignee
Dow Toray Co Ltd
Dow Corning Corp
Dow Silicones Corp
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Publication of JP2023502362A publication Critical patent/JP2023502362A/ja
Publication of JP2023502362A5 publication Critical patent/JP2023502362A5/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/28—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5397—Phosphine oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2190/00—Compositions for sealing or packing joints

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP2022527765A 2019-11-24 2020-11-19 光硬化性シリコーン組成物及びその硬化物 Active JP7609864B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962939639P 2019-11-24 2019-11-24
US62/939,639 2019-11-24
PCT/US2020/061167 WO2021102074A1 (en) 2019-11-24 2020-11-19 Photocurable silicone composition and cured product thereof

Publications (3)

Publication Number Publication Date
JP2023502362A JP2023502362A (ja) 2023-01-24
JP2023502362A5 JP2023502362A5 (https=) 2023-11-06
JP7609864B2 true JP7609864B2 (ja) 2025-01-07

Family

ID=75981059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022527765A Active JP7609864B2 (ja) 2019-11-24 2020-11-19 光硬化性シリコーン組成物及びその硬化物

Country Status (7)

Country Link
US (1) US12404374B2 (https=)
EP (1) EP4061874B1 (https=)
JP (1) JP7609864B2 (https=)
KR (1) KR20220107215A (https=)
CN (1) CN114667307A (https=)
TW (1) TW202130739A (https=)
WO (1) WO2021102074A1 (https=)

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Publication number Priority date Publication date Assignee Title
JP2011088995A (ja) 2009-10-21 2011-05-06 Toagosei Co Ltd 硬化型コーティング剤組成物
JP2016216589A (ja) 2015-05-19 2016-12-22 Dic株式会社 ポリシロキサン、樹脂組成物、塗料及び積層体
WO2018066379A1 (ja) 2016-10-03 2018-04-12 東レ・ダウコーニング株式会社 光硬化性液状シリコーン組成物およびその硬化物
JP2019507813A (ja) 2016-03-07 2019-03-22 ダウ シリコーンズ コーポレーション 光硬化性シリコーン組成物及びその硬化物

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US4946874A (en) 1983-10-26 1990-08-07 Dow Corning Corporation Fast ultraviolet radiation curing silicone composition containing two vinyl polymers
US4808638A (en) 1986-10-14 1989-02-28 Loctite Corporation Thiolene compositions on based bicyclic 'ene compounds
JPH0637592B2 (ja) 1989-03-07 1994-05-18 信越化学工業株式会社 紫外線硬化性オルガノポリシロキサン組成物
JPH02245060A (ja) 1989-03-17 1990-09-28 Toshiba Silicone Co Ltd 紫外線硬化性シリコーンゲル組成物
JPH0364389A (ja) 1989-08-03 1991-03-19 Toshiba Silicone Co Ltd 紫外線硬化型シリコーン接着剤組成物
CA2033641A1 (en) 1990-01-09 1991-07-10 Michael A. Lutz Uv curable silicone resin-organic mercaptan composition
CA2038350A1 (en) 1990-04-10 1991-10-11 William E. Dennis Silicone organic conformal coatings cured by thiol addition of olefin functional silicones
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US9909007B2 (en) 2013-08-29 2018-03-06 Dow Corning Corporation Curable silicone composition, cured product thereof, and optical semiconductor device
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Publication number Publication date
WO2021102074A1 (en) 2021-05-27
US20230013987A1 (en) 2023-01-19
CN114667307A (zh) 2022-06-24
EP4061874A4 (en) 2023-12-20
KR20220107215A (ko) 2022-08-02
JP2023502362A (ja) 2023-01-24
EP4061874A1 (en) 2022-09-28
US12404374B2 (en) 2025-09-02
TW202130739A (zh) 2021-08-16
EP4061874B1 (en) 2025-01-22

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