JP7603853B2 - 基板分割治具 - Google Patents

基板分割治具 Download PDF

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Publication number
JP7603853B2
JP7603853B2 JP2023573955A JP2023573955A JP7603853B2 JP 7603853 B2 JP7603853 B2 JP 7603853B2 JP 2023573955 A JP2023573955 A JP 2023573955A JP 2023573955 A JP2023573955 A JP 2023573955A JP 7603853 B2 JP7603853 B2 JP 7603853B2
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Japan
Prior art keywords
substrate
recess
base plate
dividing
holding unit
Prior art date
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Active
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JP2023573955A
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English (en)
Japanese (ja)
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JPWO2023136103A1 (https=
JPWO2023136103A5 (https=
Inventor
俊介 佐々木
剛 田邊
匠実 栗原
若輝 ▲濱▼田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2023136103A1 publication Critical patent/JPWO2023136103A1/ja
Publication of JPWO2023136103A5 publication Critical patent/JPWO2023136103A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2023573955A 2022-01-11 2022-12-23 基板分割治具 Active JP7603853B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022002423 2022-01-11
JP2022002423 2022-01-11
PCT/JP2022/047700 WO2023136103A1 (ja) 2022-01-11 2022-12-23 基板分割治具

Publications (3)

Publication Number Publication Date
JPWO2023136103A1 JPWO2023136103A1 (https=) 2023-07-20
JPWO2023136103A5 JPWO2023136103A5 (https=) 2024-04-15
JP7603853B2 true JP7603853B2 (ja) 2024-12-20

Family

ID=87278990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023573955A Active JP7603853B2 (ja) 2022-01-11 2022-12-23 基板分割治具

Country Status (2)

Country Link
JP (1) JP7603853B2 (https=)
WO (1) WO2023136103A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0784006B2 (ja) * 1986-07-29 1995-09-13 松下電器産業株式会社 基板分割装置
IT1218088B (it) * 1988-06-16 1990-04-12 Aisa Spa Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi
JPH0330395A (ja) * 1989-06-27 1991-02-08 Nec Gumma Ltd プリント配線基板分断装置
JPH03221400A (ja) * 1990-01-23 1991-09-30 Oki Electric Ind Co Ltd プリント基板の分割方法
JPH0740296A (ja) * 1993-08-04 1995-02-10 Sumitomo Kinzoku Ceramics:Kk セラミック基板の分割方法と分割用治具
JP3341473B2 (ja) * 1994-07-27 2002-11-05 株式会社デンソー 板材の折り曲げ応力測定装置

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Publication number Publication date
WO2023136103A1 (ja) 2023-07-20
JPWO2023136103A1 (https=) 2023-07-20

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