JPWO2023136103A1 - - Google Patents
Info
- Publication number
- JPWO2023136103A1 JPWO2023136103A1 JP2023573955A JP2023573955A JPWO2023136103A1 JP WO2023136103 A1 JPWO2023136103 A1 JP WO2023136103A1 JP 2023573955 A JP2023573955 A JP 2023573955A JP 2023573955 A JP2023573955 A JP 2023573955A JP WO2023136103 A1 JPWO2023136103 A1 JP WO2023136103A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022002423 | 2022-01-11 | ||
| JP2022002423 | 2022-01-11 | ||
| PCT/JP2022/047700 WO2023136103A1 (ja) | 2022-01-11 | 2022-12-23 | 基板分割治具 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023136103A1 true JPWO2023136103A1 (https=) | 2023-07-20 |
| JPWO2023136103A5 JPWO2023136103A5 (https=) | 2024-04-15 |
| JP7603853B2 JP7603853B2 (ja) | 2024-12-20 |
Family
ID=87278990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023573955A Active JP7603853B2 (ja) | 2022-01-11 | 2022-12-23 | 基板分割治具 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7603853B2 (https=) |
| WO (1) | WO2023136103A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6334103A (ja) * | 1986-07-29 | 1988-02-13 | 松下電器産業株式会社 | 基板分割装置 |
| JPH0278504A (ja) * | 1988-06-16 | 1990-03-19 | Aisa Spa | セラミック基板自動分離装置 |
| JPH0330395A (ja) * | 1989-06-27 | 1991-02-08 | Nec Gumma Ltd | プリント配線基板分断装置 |
| JPH03221400A (ja) * | 1990-01-23 | 1991-09-30 | Oki Electric Ind Co Ltd | プリント基板の分割方法 |
| JPH0740296A (ja) * | 1993-08-04 | 1995-02-10 | Sumitomo Kinzoku Ceramics:Kk | セラミック基板の分割方法と分割用治具 |
| JPH0843282A (ja) * | 1994-07-27 | 1996-02-16 | Nippondenso Co Ltd | 板材の折り曲げ応力測定装置 |
-
2022
- 2022-12-23 JP JP2023573955A patent/JP7603853B2/ja active Active
- 2022-12-23 WO PCT/JP2022/047700 patent/WO2023136103A1/ja not_active Ceased
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6334103A (ja) * | 1986-07-29 | 1988-02-13 | 松下電器産業株式会社 | 基板分割装置 |
| JPH0278504A (ja) * | 1988-06-16 | 1990-03-19 | Aisa Spa | セラミック基板自動分離装置 |
| JPH0330395A (ja) * | 1989-06-27 | 1991-02-08 | Nec Gumma Ltd | プリント配線基板分断装置 |
| JPH03221400A (ja) * | 1990-01-23 | 1991-09-30 | Oki Electric Ind Co Ltd | プリント基板の分割方法 |
| JPH0740296A (ja) * | 1993-08-04 | 1995-02-10 | Sumitomo Kinzoku Ceramics:Kk | セラミック基板の分割方法と分割用治具 |
| JPH0843282A (ja) * | 1994-07-27 | 1996-02-16 | Nippondenso Co Ltd | 板材の折り曲げ応力測定装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023136103A1 (ja) | 2023-07-20 |
| JP7603853B2 (ja) | 2024-12-20 |
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