JPWO2023136103A1 - - Google Patents
Info
- Publication number
- JPWO2023136103A1 JPWO2023136103A1 JP2023573955A JP2023573955A JPWO2023136103A1 JP WO2023136103 A1 JPWO2023136103 A1 JP WO2023136103A1 JP 2023573955 A JP2023573955 A JP 2023573955A JP 2023573955 A JP2023573955 A JP 2023573955A JP WO2023136103 A1 JPWO2023136103 A1 JP WO2023136103A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022002423 | 2022-01-11 | ||
| PCT/JP2022/047700 WO2023136103A1 (ja) | 2022-01-11 | 2022-12-23 | 基板分割治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023136103A1 true JPWO2023136103A1 (ja) | 2023-07-20 |
| JPWO2023136103A5 JPWO2023136103A5 (ja) | 2024-04-15 |
Family
ID=87278990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023573955A Pending JPWO2023136103A1 (ja) | 2022-01-11 | 2022-12-23 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2023136103A1 (ja) |
| WO (1) | WO2023136103A1 (ja) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0784006B2 (ja) * | 1986-07-29 | 1995-09-13 | 松下電器産業株式会社 | 基板分割装置 |
| IT1218088B (it) * | 1988-06-16 | 1990-04-12 | Aisa Spa | Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi |
| JPH0330395A (ja) * | 1989-06-27 | 1991-02-08 | Nec Gumma Ltd | プリント配線基板分断装置 |
| JPH03221400A (ja) * | 1990-01-23 | 1991-09-30 | Oki Electric Ind Co Ltd | プリント基板の分割方法 |
| JPH0740296A (ja) * | 1993-08-04 | 1995-02-10 | Sumitomo Kinzoku Ceramics:Kk | セラミック基板の分割方法と分割用治具 |
| JP3341473B2 (ja) * | 1994-07-27 | 2002-11-05 | 株式会社デンソー | 板材の折り曲げ応力測定装置 |
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2022
- 2022-12-23 JP JP2023573955A patent/JPWO2023136103A1/ja active Pending
- 2022-12-23 WO PCT/JP2022/047700 patent/WO2023136103A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023136103A1 (ja) | 2023-07-20 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240118 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240118 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240806 |
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| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240912 |