JPWO2023136103A1 - - Google Patents

Info

Publication number
JPWO2023136103A1
JPWO2023136103A1 JP2023573955A JP2023573955A JPWO2023136103A1 JP WO2023136103 A1 JPWO2023136103 A1 JP WO2023136103A1 JP 2023573955 A JP2023573955 A JP 2023573955A JP 2023573955 A JP2023573955 A JP 2023573955A JP WO2023136103 A1 JPWO2023136103 A1 JP WO2023136103A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023573955A
Other versions
JPWO2023136103A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023136103A1 publication Critical patent/JPWO2023136103A1/ja
Publication of JPWO2023136103A5 publication Critical patent/JPWO2023136103A5/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F3/00—Severing by means other than cutting; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
JP2023573955A 2022-01-11 2022-12-23 Pending JPWO2023136103A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022002423 2022-01-11
PCT/JP2022/047700 WO2023136103A1 (ja) 2022-01-11 2022-12-23 基板分割治具

Publications (2)

Publication Number Publication Date
JPWO2023136103A1 true JPWO2023136103A1 (ja) 2023-07-20
JPWO2023136103A5 JPWO2023136103A5 (ja) 2024-04-15

Family

ID=87278990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023573955A Pending JPWO2023136103A1 (ja) 2022-01-11 2022-12-23

Country Status (2)

Country Link
JP (1) JPWO2023136103A1 (ja)
WO (1) WO2023136103A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0784006B2 (ja) * 1986-07-29 1995-09-13 松下電器産業株式会社 基板分割装置
IT1218088B (it) * 1988-06-16 1990-04-12 Aisa Spa Attrezzatura per la separazione automatica lungo le linee di frattura per flessione predisposte in piastrelle ceramiche di base di circuiti elettronici ibridi
JPH0330395A (ja) * 1989-06-27 1991-02-08 Nec Gumma Ltd プリント配線基板分断装置
JPH03221400A (ja) * 1990-01-23 1991-09-30 Oki Electric Ind Co Ltd プリント基板の分割方法
JPH0740296A (ja) * 1993-08-04 1995-02-10 Sumitomo Kinzoku Ceramics:Kk セラミック基板の分割方法と分割用治具
JP3341473B2 (ja) * 1994-07-27 2002-11-05 株式会社デンソー 板材の折り曲げ応力測定装置

Also Published As

Publication number Publication date
WO2023136103A1 (ja) 2023-07-20

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Legal Events

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