JP7601108B2 - 弾性波装置 - Google Patents

弾性波装置 Download PDF

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Publication number
JP7601108B2
JP7601108B2 JP2022555499A JP2022555499A JP7601108B2 JP 7601108 B2 JP7601108 B2 JP 7601108B2 JP 2022555499 A JP2022555499 A JP 2022555499A JP 2022555499 A JP2022555499 A JP 2022555499A JP 7601108 B2 JP7601108 B2 JP 7601108B2
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JP
Japan
Prior art keywords
piezoelectric layer
wave device
support substrate
layer
acoustic wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022555499A
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English (en)
Japanese (ja)
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JPWO2022075311A1 (https=
JPWO2022075311A5 (https=
Inventor
泰伸 林
直 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2022075311A1 publication Critical patent/JPWO2022075311A1/ja
Publication of JPWO2022075311A5 publication Critical patent/JPWO2022075311A5/ja
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
JP2022555499A 2020-10-09 2021-10-05 弾性波装置 Active JP7601108B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020171184 2020-10-09
JP2020171184 2020-10-09
PCT/JP2021/036793 WO2022075311A1 (ja) 2020-10-09 2021-10-05 弾性波装置

Publications (3)

Publication Number Publication Date
JPWO2022075311A1 JPWO2022075311A1 (https=) 2022-04-14
JPWO2022075311A5 JPWO2022075311A5 (https=) 2023-05-24
JP7601108B2 true JP7601108B2 (ja) 2024-12-17

Family

ID=81126930

Family Applications (1)

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JP2022555499A Active JP7601108B2 (ja) 2020-10-09 2021-10-05 弾性波装置

Country Status (4)

Country Link
US (1) US12512811B2 (https=)
JP (1) JP7601108B2 (https=)
CN (1) CN116250178A (https=)
WO (1) WO2022075311A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116722838B (zh) * 2023-06-29 2024-08-02 北京超材信息科技有限公司 声表面波滤波器及组、多工器及射频模组

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016208426A1 (ja) 2015-06-25 2016-12-29 株式会社村田製作所 弾性波装置
WO2019044203A1 (ja) 2017-08-29 2019-03-07 株式会社村田製作所 弾性波装置、高周波フロントエンド回路及び通信装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105794107B (zh) 2013-12-27 2018-12-25 株式会社村田制作所 弹性波装置以及其制造方法
US10615772B2 (en) * 2017-06-30 2020-04-07 Texas Instruments Incorporated Acoustic wave resonators having Fresnel surfaces
WO2019044178A1 (ja) * 2017-08-31 2019-03-07 株式会社村田製作所 弾性波装置およびそれを備えた弾性波モジュール
CN111510106A (zh) * 2020-05-06 2020-08-07 中电科技德清华莹电子有限公司 一种声表面波谐振结构滤波器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016208426A1 (ja) 2015-06-25 2016-12-29 株式会社村田製作所 弾性波装置
WO2019044203A1 (ja) 2017-08-29 2019-03-07 株式会社村田製作所 弾性波装置、高周波フロントエンド回路及び通信装置

Also Published As

Publication number Publication date
WO2022075311A1 (ja) 2022-04-14
JPWO2022075311A1 (https=) 2022-04-14
CN116250178A (zh) 2023-06-09
US12512811B2 (en) 2025-12-30
US20230223916A1 (en) 2023-07-13

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