JPWO2022075311A1 - - Google Patents
Info
- Publication number
- JPWO2022075311A1 JPWO2022075311A1 JP2022555499A JP2022555499A JPWO2022075311A1 JP WO2022075311 A1 JPWO2022075311 A1 JP WO2022075311A1 JP 2022555499 A JP2022555499 A JP 2022555499A JP 2022555499 A JP2022555499 A JP 2022555499A JP WO2022075311 A1 JPWO2022075311 A1 JP WO2022075311A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/058—Holders or supports for surface acoustic wave devices
- H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders or supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020171184 | 2020-10-09 | ||
| JP2020171184 | 2020-10-09 | ||
| PCT/JP2021/036793 WO2022075311A1 (ja) | 2020-10-09 | 2021-10-05 | 弾性波装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022075311A1 true JPWO2022075311A1 (https=) | 2022-04-14 |
| JPWO2022075311A5 JPWO2022075311A5 (https=) | 2023-05-24 |
| JP7601108B2 JP7601108B2 (ja) | 2024-12-17 |
Family
ID=81126930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022555499A Active JP7601108B2 (ja) | 2020-10-09 | 2021-10-05 | 弾性波装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12512811B2 (https=) |
| JP (1) | JP7601108B2 (https=) |
| CN (1) | CN116250178A (https=) |
| WO (1) | WO2022075311A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116722838B (zh) * | 2023-06-29 | 2024-08-02 | 北京超材信息科技有限公司 | 声表面波滤波器及组、多工器及射频模组 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105794107B (zh) | 2013-12-27 | 2018-12-25 | 株式会社村田制作所 | 弹性波装置以及其制造方法 |
| DE112016002901B4 (de) * | 2015-06-25 | 2021-09-23 | Murata Manufacturing Co., Ltd. | Vorrichtung für elastische Wellen |
| US10615772B2 (en) * | 2017-06-30 | 2020-04-07 | Texas Instruments Incorporated | Acoustic wave resonators having Fresnel surfaces |
| KR102292154B1 (ko) | 2017-08-29 | 2021-08-23 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성파 장치, 고주파 프론트 엔드 회로 및 통신 장치 |
| WO2019044178A1 (ja) * | 2017-08-31 | 2019-03-07 | 株式会社村田製作所 | 弾性波装置およびそれを備えた弾性波モジュール |
| CN111510106A (zh) * | 2020-05-06 | 2020-08-07 | 中电科技德清华莹电子有限公司 | 一种声表面波谐振结构滤波器 |
-
2021
- 2021-10-05 WO PCT/JP2021/036793 patent/WO2022075311A1/ja not_active Ceased
- 2021-10-05 JP JP2022555499A patent/JP7601108B2/ja active Active
- 2021-10-05 CN CN202180066040.4A patent/CN116250178A/zh active Pending
-
2023
- 2023-03-23 US US18/125,156 patent/US12512811B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7601108B2 (ja) | 2024-12-17 |
| WO2022075311A1 (ja) | 2022-04-14 |
| CN116250178A (zh) | 2023-06-09 |
| US12512811B2 (en) | 2025-12-30 |
| US20230223916A1 (en) | 2023-07-13 |
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