CN116250178A - 弹性波装置 - Google Patents

弹性波装置 Download PDF

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Publication number
CN116250178A
CN116250178A CN202180066040.4A CN202180066040A CN116250178A CN 116250178 A CN116250178 A CN 116250178A CN 202180066040 A CN202180066040 A CN 202180066040A CN 116250178 A CN116250178 A CN 116250178A
Authority
CN
China
Prior art keywords
elastic wave
wave device
layer
support substrate
piezoelectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180066040.4A
Other languages
English (en)
Chinese (zh)
Inventor
林泰伸
山崎直
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN116250178A publication Critical patent/CN116250178A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02818—Means for compensation or elimination of undesirable effects
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/058—Holders or supports for surface acoustic wave devices
    • H03H9/059—Holders or supports for surface acoustic wave devices consisting of mounting pads or bumps
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders or supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
CN202180066040.4A 2020-10-09 2021-10-05 弹性波装置 Pending CN116250178A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020171184 2020-10-09
JP2020-171184 2020-10-09
PCT/JP2021/036793 WO2022075311A1 (ja) 2020-10-09 2021-10-05 弾性波装置

Publications (1)

Publication Number Publication Date
CN116250178A true CN116250178A (zh) 2023-06-09

Family

ID=81126930

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180066040.4A Pending CN116250178A (zh) 2020-10-09 2021-10-05 弹性波装置

Country Status (4)

Country Link
US (1) US12512811B2 (https=)
JP (1) JP7601108B2 (https=)
CN (1) CN116250178A (https=)
WO (1) WO2022075311A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116722838B (zh) * 2023-06-29 2024-08-02 北京超材信息科技有限公司 声表面波滤波器及组、多工器及射频模组

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107615658A (zh) * 2015-06-25 2018-01-19 株式会社村田制作所 弹性波装置
US20190007023A1 (en) * 2017-06-30 2019-01-03 Texas Instruments Incorporated Acoustic wave resonators having fresnel surfaces
CN111052606A (zh) * 2017-08-31 2020-04-21 株式会社村田制作所 弹性波装置以及具备该弹性波装置的弹性波模块
CN111066244A (zh) * 2017-08-29 2020-04-24 株式会社村田制作所 弹性波装置、高频前端电路以及通信装置
CN111510106A (zh) * 2020-05-06 2020-08-07 中电科技德清华莹电子有限公司 一种声表面波谐振结构滤波器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105794107B (zh) 2013-12-27 2018-12-25 株式会社村田制作所 弹性波装置以及其制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107615658A (zh) * 2015-06-25 2018-01-19 株式会社村田制作所 弹性波装置
US20190007023A1 (en) * 2017-06-30 2019-01-03 Texas Instruments Incorporated Acoustic wave resonators having fresnel surfaces
CN111066244A (zh) * 2017-08-29 2020-04-24 株式会社村田制作所 弹性波装置、高频前端电路以及通信装置
CN111052606A (zh) * 2017-08-31 2020-04-21 株式会社村田制作所 弹性波装置以及具备该弹性波装置的弹性波模块
CN111510106A (zh) * 2020-05-06 2020-08-07 中电科技德清华莹电子有限公司 一种声表面波谐振结构滤波器

Also Published As

Publication number Publication date
JP7601108B2 (ja) 2024-12-17
WO2022075311A1 (ja) 2022-04-14
JPWO2022075311A1 (https=) 2022-04-14
US12512811B2 (en) 2025-12-30
US20230223916A1 (en) 2023-07-13

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