JP7592434B2 - ワークピース支持装置およびワークピース支持方法 - Google Patents

ワークピース支持装置およびワークピース支持方法 Download PDF

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Publication number
JP7592434B2
JP7592434B2 JP2020144540A JP2020144540A JP7592434B2 JP 7592434 B2 JP7592434 B2 JP 7592434B2 JP 2020144540 A JP2020144540 A JP 2020144540A JP 2020144540 A JP2020144540 A JP 2020144540A JP 7592434 B2 JP7592434 B2 JP 7592434B2
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JP
Japan
Prior art keywords
workpiece
bernoulli chuck
liquid
gas
liquid discharge
Prior art date
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Application number
JP2020144540A
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English (en)
Japanese (ja)
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JP2022039487A5 (enExample
JP2022039487A (ja
Inventor
誠 柏木
真於 伊沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2020144540A priority Critical patent/JP7592434B2/ja
Priority to TW110130411A priority patent/TWI899310B/zh
Priority to EP21191826.3A priority patent/EP3961683B1/en
Priority to US17/405,351 priority patent/US11804398B2/en
Priority to KR1020210109315A priority patent/KR20220029400A/ko
Priority to CN202110984857.1A priority patent/CN114102370A/zh
Publication of JP2022039487A publication Critical patent/JP2022039487A/ja
Publication of JP2022039487A5 publication Critical patent/JP2022039487A5/ja
Application granted granted Critical
Publication of JP7592434B2 publication Critical patent/JP7592434B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/18—Accessories
    • B24B21/20—Accessories for controlling or adjusting the tracking or the tension of the grinding belt
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Jigs For Machine Tools (AREA)
JP2020144540A 2020-08-28 2020-08-28 ワークピース支持装置およびワークピース支持方法 Active JP7592434B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2020144540A JP7592434B2 (ja) 2020-08-28 2020-08-28 ワークピース支持装置およびワークピース支持方法
EP21191826.3A EP3961683B1 (en) 2020-08-28 2021-08-18 Workpiece supporting apparatus and workpiece supporting method
US17/405,351 US11804398B2 (en) 2020-08-28 2021-08-18 Workpiece supporting apparatus and workpiece supporting method
TW110130411A TWI899310B (zh) 2020-08-28 2021-08-18 工件支承裝置、工件處理裝置、工件搬運裝置、工件支承方法及工件處理方法
KR1020210109315A KR20220029400A (ko) 2020-08-28 2021-08-19 워크피스 지지 장치 및 워크피스 지지 방법
CN202110984857.1A CN114102370A (zh) 2020-08-28 2021-08-25 工件支承装置、工件处理装置、工件输送装置、工件支承方法及工件处理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020144540A JP7592434B2 (ja) 2020-08-28 2020-08-28 ワークピース支持装置およびワークピース支持方法

Publications (3)

Publication Number Publication Date
JP2022039487A JP2022039487A (ja) 2022-03-10
JP2022039487A5 JP2022039487A5 (enExample) 2023-08-28
JP7592434B2 true JP7592434B2 (ja) 2024-12-02

Family

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JP2020144540A Active JP7592434B2 (ja) 2020-08-28 2020-08-28 ワークピース支持装置およびワークピース支持方法

Country Status (5)

Country Link
US (1) US11804398B2 (enExample)
EP (1) EP3961683B1 (enExample)
JP (1) JP7592434B2 (enExample)
KR (1) KR20220029400A (enExample)
CN (1) CN114102370A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025173591A1 (ja) * 2024-02-16 2025-08-21 東京エレクトロン株式会社 基板処理装置、及び基板処理方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003203891A (ja) 2001-10-30 2003-07-18 Dainippon Screen Mfg Co Ltd 基板処理装置
KR100820190B1 (ko) 2006-11-21 2008-04-07 (주)이노맥스 스핀 척 장치
JP2009277870A (ja) 2008-05-14 2009-11-26 Tokyo Electron Ltd 塗布装置、塗布方法、塗布、現像装置及び記憶媒体
US20130048607A1 (en) 2011-08-22 2013-02-28 Lam Research Ag Method and device for wet treatment of plate-like articles
JP2014003237A (ja) 2012-06-20 2014-01-09 Tokyo Electron Ltd 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2015126174A (ja) 2013-12-27 2015-07-06 芝浦メカトロニクス株式会社 基板保持装置及び基板保持方法
JP2018111146A (ja) 2017-01-10 2018-07-19 東京エレクトロン株式会社 基板処理システムおよび基板処理方法
JP2019077003A (ja) 2017-10-25 2019-05-23 株式会社荏原製作所 研磨装置
US20190311938A1 (en) 2016-07-06 2019-10-10 Acm Research (Shanghai) Inc. Substrate supporting apparatus
JP2020161636A (ja) 2019-03-26 2020-10-01 株式会社東京精密 ウエハ搬送装置

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Publication number Priority date Publication date Assignee Title
JPS6343428U (enExample) * 1986-09-05 1988-03-23
JPS6384026A (ja) * 1986-09-29 1988-04-14 Hitachi Ltd 半導体基板のベ−キング装置
JPH08330398A (ja) * 1995-05-30 1996-12-13 Sony Corp ウエハ処理方法および装置
JP4299111B2 (ja) * 2003-11-18 2009-07-22 株式会社ディスコ 研削装置
JP4359885B2 (ja) * 2004-05-27 2009-11-11 信越半導体株式会社 ベルヌーイチャック
JP2007067054A (ja) * 2005-08-30 2007-03-15 Fluoro Mechanic Kk ベルヌーイチャック
JP2007214529A (ja) * 2006-01-13 2007-08-23 Fluoro Mechanic Kk ベルヌーイチャック
KR100885180B1 (ko) * 2006-12-27 2009-02-23 세메스 주식회사 기판 지지유닛, 그리고 상기 기판 지지유닛을 구비하는기판처리장치 및 방법
JP2009032744A (ja) * 2007-07-24 2009-02-12 Fluoro Mechanic Kk ベルヌーイチャック
JP2010082489A (ja) * 2008-09-29 2010-04-15 Seiko Epson Corp フラッシング受容装置およびこれを備えた液滴吐出装置
DE102010022333B4 (de) * 2010-06-01 2013-11-14 Festo Ag & Co. Kg Bernoulli-Sauggreifer
JP2013089892A (ja) * 2011-10-21 2013-05-13 Ihi Corp チャック装置
TWI556878B (zh) 2014-02-26 2016-11-11 辛耘企業股份有限公司 流體加速裝置
JP6568773B2 (ja) * 2015-11-10 2019-08-28 東京エレクトロン株式会社 基板搬送装置及び剥離システム
JP2017112255A (ja) * 2015-12-17 2017-06-22 株式会社ディスコ 搬送装置
CN118343498A (zh) * 2018-03-01 2024-07-16 杭州孚亚科技有限公司 吸紧装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003203891A (ja) 2001-10-30 2003-07-18 Dainippon Screen Mfg Co Ltd 基板処理装置
KR100820190B1 (ko) 2006-11-21 2008-04-07 (주)이노맥스 스핀 척 장치
JP2009277870A (ja) 2008-05-14 2009-11-26 Tokyo Electron Ltd 塗布装置、塗布方法、塗布、現像装置及び記憶媒体
US20130048607A1 (en) 2011-08-22 2013-02-28 Lam Research Ag Method and device for wet treatment of plate-like articles
JP2014003237A (ja) 2012-06-20 2014-01-09 Tokyo Electron Ltd 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP2015126174A (ja) 2013-12-27 2015-07-06 芝浦メカトロニクス株式会社 基板保持装置及び基板保持方法
US20190311938A1 (en) 2016-07-06 2019-10-10 Acm Research (Shanghai) Inc. Substrate supporting apparatus
JP2018111146A (ja) 2017-01-10 2018-07-19 東京エレクトロン株式会社 基板処理システムおよび基板処理方法
JP2019077003A (ja) 2017-10-25 2019-05-23 株式会社荏原製作所 研磨装置
JP2020161636A (ja) 2019-03-26 2020-10-01 株式会社東京精密 ウエハ搬送装置

Also Published As

Publication number Publication date
EP3961683A1 (en) 2022-03-02
TW202213593A (zh) 2022-04-01
US11804398B2 (en) 2023-10-31
CN114102370A (zh) 2022-03-01
EP3961683B1 (en) 2023-07-26
JP2022039487A (ja) 2022-03-10
KR20220029400A (ko) 2022-03-08
US20220068695A1 (en) 2022-03-03

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