JP7592154B2 - 原位置ステージ補正のためのアクティブレチクルキャリア - Google Patents

原位置ステージ補正のためのアクティブレチクルキャリア Download PDF

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Publication number
JP7592154B2
JP7592154B2 JP2023514448A JP2023514448A JP7592154B2 JP 7592154 B2 JP7592154 B2 JP 7592154B2 JP 2023514448 A JP2023514448 A JP 2023514448A JP 2023514448 A JP2023514448 A JP 2023514448A JP 7592154 B2 JP7592154 B2 JP 7592154B2
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JP
Japan
Prior art keywords
reticle
carrier
active
rotating plate
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2023514448A
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English (en)
Japanese (ja)
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JP2023540297A (ja
JP2023540297A5 (https=
Inventor
アブネル サフラニ
アディ パヒマ
ロン ルドイ
シャイ マーク
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KLA Corp
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KLA Corp
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Publication of JP2023540297A5 publication Critical patent/JP2023540297A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Library & Information Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
JP2023514448A 2020-09-03 2021-09-01 原位置ステージ補正のためのアクティブレチクルキャリア Active JP7592154B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202063073937P 2020-09-03 2020-09-03
US63/073,937 2020-09-03
US17/446,035 US11774866B2 (en) 2020-09-03 2021-08-26 Active reticle carrier for in situ stage correction
US17/446,035 2021-08-26
PCT/US2021/048570 WO2022051310A1 (en) 2020-09-03 2021-09-01 Active reticle carrier for in situ stage correction

Publications (3)

Publication Number Publication Date
JP2023540297A JP2023540297A (ja) 2023-09-22
JP2023540297A5 JP2023540297A5 (https=) 2024-06-20
JP7592154B2 true JP7592154B2 (ja) 2024-11-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023514448A Active JP7592154B2 (ja) 2020-09-03 2021-09-01 原位置ステージ補正のためのアクティブレチクルキャリア

Country Status (6)

Country Link
US (1) US11774866B2 (https=)
EP (1) EP4200669A4 (https=)
JP (1) JP7592154B2 (https=)
KR (1) KR102725415B1 (https=)
CN (1) CN116057467B (https=)
WO (1) WO2022051310A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI878825B (zh) * 2023-03-10 2025-04-01 微程式資訊股份有限公司 可模擬光罩之感測總成
US20250108972A1 (en) * 2023-09-28 2025-04-03 Entegris, Inc. Large format reticle container

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000147747A (ja) 1998-11-16 2000-05-26 Seiko Epson Corp マスク検査装置
JP2015519593A (ja) 2012-03-27 2015-07-09 ケーエルエー−テンカー コーポレイション Ｅｕｖレチクル検査ツールにおけるレチクルの取り扱い装置及び方法
JP2016170310A (ja) 2015-03-13 2016-09-23 株式会社荏原製作所 レチクル搬送装置、検査装置およびレチクル搬送方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60195948A (ja) * 1984-03-19 1985-10-04 Hitachi Ltd 検査装置
US5608773A (en) * 1993-11-30 1997-03-04 Canon Kabushiki Kaisha Mask holding device, and an exposure apparatus and a device manufacturing method using the device
JPH098103A (ja) * 1995-06-19 1997-01-10 Nikon Corp 投影露光装置及び投影露光方法
JPH10270535A (ja) * 1997-03-25 1998-10-09 Nikon Corp 移動ステージ装置、及び該ステージ装置を用いた回路デバイス製造方法
JPH11288878A (ja) * 1998-04-03 1999-10-19 Canon Inc マスク搬送装置およびマスク搬送方法、ならびに該マスク搬送装置を用いた露光装置
JPH11307425A (ja) * 1998-04-22 1999-11-05 Nikon Corp マスクの受け渡し方法、及び該方法を使用する露光装置
JP4717112B2 (ja) * 2005-06-13 2011-07-06 エーエスエムエル ネザーランズ ビー．ブイ． 偏光アナライザ、偏光センサおよびリソグラフィ装置の偏光特性を判定するための方法
EP2418545B1 (en) 2010-08-12 2018-10-10 Applied Materials, Inc. Mask handling module
US10090179B2 (en) 2011-06-28 2018-10-02 Brooks Automation, Inc. Semiconductor stocker systems and methods
US20150131071A1 (en) * 2013-11-08 2015-05-14 Samsung Electronics Co., Ltd. Semiconductor device manufacturing apparatus
WO2018111227A1 (en) 2016-12-12 2018-06-21 Intel Corporation Systems, apparatuses, and methods for performing reticle inspections
CN109426082A (zh) 2017-08-21 2019-03-05 上海微电子装备（集团）股份有限公司 一种掩模版的传输系统以及传输方法
US10663871B2 (en) * 2018-07-30 2020-05-26 Taiwan Semiconductor Manufacturing Co., Ltd. Reticle stage and method for using the same
US10976674B2 (en) * 2018-08-17 2021-04-13 Taiwan Semiconductor Manufacturing Co., Ltd. Method for detecting EUV pellicle rupture

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000147747A (ja) 1998-11-16 2000-05-26 Seiko Epson Corp マスク検査装置
JP2015519593A (ja) 2012-03-27 2015-07-09 ケーエルエー−テンカー コーポレイション Ｅｕｖレチクル検査ツールにおけるレチクルの取り扱い装置及び方法
JP2016170310A (ja) 2015-03-13 2016-09-23 株式会社荏原製作所 レチクル搬送装置、検査装置およびレチクル搬送方法

Also Published As

Publication number Publication date
KR102725415B1 (ko) 2024-11-01
WO2022051310A1 (en) 2022-03-10
EP4200669A1 (en) 2023-06-28
CN116057467B (zh) 2024-03-08
CN116057467A (zh) 2023-05-02
US11774866B2 (en) 2023-10-03
KR20230058659A (ko) 2023-05-03
JP2023540297A (ja) 2023-09-22
US20220066333A1 (en) 2022-03-03
EP4200669A4 (en) 2024-10-16

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