KR102725415B1 - 인 시투 스테이지 수정을 위한 능동 레티클 캐리어 - Google Patents
인 시투 스테이지 수정을 위한 능동 레티클 캐리어 Download PDFInfo
- Publication number
- KR102725415B1 KR102725415B1 KR1020237009897A KR20237009897A KR102725415B1 KR 102725415 B1 KR102725415 B1 KR 102725415B1 KR 1020237009897 A KR1020237009897 A KR 1020237009897A KR 20237009897 A KR20237009897 A KR 20237009897A KR 102725415 B1 KR102725415 B1 KR 102725415B1
- Authority
- KR
- South Korea
- Prior art keywords
- reticle
- carrier
- active
- turntable
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000011065 in-situ storage Methods 0.000 title description 5
- 238000007689 inspection Methods 0.000 claims abstract description 99
- 238000000034 method Methods 0.000 claims abstract description 46
- 238000012546 transfer Methods 0.000 claims description 26
- 238000004891 communication Methods 0.000 claims description 11
- 230000008878 coupling Effects 0.000 claims description 11
- 238000010168 coupling process Methods 0.000 claims description 11
- 238000005859 coupling reaction Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000002245 particle Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 230000005540 biological transmission Effects 0.000 description 8
- 230000006870 function Effects 0.000 description 6
- 230000007547 defect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000035945 sensitivity Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000012552 review Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 101000873785 Homo sapiens mRNA-decapping enzyme 1A Proteins 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 102100035856 mRNA-decapping enzyme 1A Human genes 0.000 description 1
- 238000007726 management method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70591—Testing optical components
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Library & Information Science (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063073937P | 2020-09-03 | 2020-09-03 | |
| US63/073,937 | 2020-09-03 | ||
| US17/446,035 US11774866B2 (en) | 2020-09-03 | 2021-08-26 | Active reticle carrier for in situ stage correction |
| US17/446,035 | 2021-08-26 | ||
| PCT/US2021/048570 WO2022051310A1 (en) | 2020-09-03 | 2021-09-01 | Active reticle carrier for in situ stage correction |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20230058659A KR20230058659A (ko) | 2023-05-03 |
| KR102725415B1 true KR102725415B1 (ko) | 2024-11-01 |
Family
ID=80356565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237009897A Active KR102725415B1 (ko) | 2020-09-03 | 2021-09-01 | 인 시투 스테이지 수정을 위한 능동 레티클 캐리어 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11774866B2 (https=) |
| EP (1) | EP4200669A4 (https=) |
| JP (1) | JP7592154B2 (https=) |
| KR (1) | KR102725415B1 (https=) |
| CN (1) | CN116057467B (https=) |
| WO (1) | WO2022051310A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI878825B (zh) * | 2023-03-10 | 2025-04-01 | 微程式資訊股份有限公司 | 可模擬光罩之感測總成 |
| US20250108972A1 (en) * | 2023-09-28 | 2025-04-03 | Entegris, Inc. | Large format reticle container |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000147747A (ja) | 1998-11-16 | 2000-05-26 | Seiko Epson Corp | マスク検査装置 |
| US20150131071A1 (en) | 2013-11-08 | 2015-05-14 | Samsung Electronics Co., Ltd. | Semiconductor device manufacturing apparatus |
| JP2015519593A (ja) | 2012-03-27 | 2015-07-09 | ケーエルエー−テンカー コーポレイション | Ｅｕｖレチクル検査ツールにおけるレチクルの取り扱い装置及び方法 |
| JP2016170310A (ja) | 2015-03-13 | 2016-09-23 | 株式会社荏原製作所 | レチクル搬送装置、検査装置およびレチクル搬送方法 |
| US20200033717A1 (en) | 2018-07-30 | 2020-01-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Reticle stage and method for using the same |
| US20200057383A1 (en) | 2018-08-17 | 2020-02-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for detecting euv pellicle rupture |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60195948A (ja) * | 1984-03-19 | 1985-10-04 | Hitachi Ltd | 検査装置 |
| US5608773A (en) * | 1993-11-30 | 1997-03-04 | Canon Kabushiki Kaisha | Mask holding device, and an exposure apparatus and a device manufacturing method using the device |
| JPH098103A (ja) * | 1995-06-19 | 1997-01-10 | Nikon Corp | 投影露光装置及び投影露光方法 |
| JPH10270535A (ja) * | 1997-03-25 | 1998-10-09 | Nikon Corp | 移動ステージ装置、及び該ステージ装置を用いた回路デバイス製造方法 |
| JPH11288878A (ja) * | 1998-04-03 | 1999-10-19 | Canon Inc | マスク搬送装置およびマスク搬送方法、ならびに該マスク搬送装置を用いた露光装置 |
| JPH11307425A (ja) * | 1998-04-22 | 1999-11-05 | Nikon Corp | マスクの受け渡し方法、及び該方法を使用する露光装置 |
| JP4717112B2 (ja) * | 2005-06-13 | 2011-07-06 | エーエスエムエル ネザーランズ ビー．ブイ． | 偏光アナライザ、偏光センサおよびリソグラフィ装置の偏光特性を判定するための方法 |
| EP2418545B1 (en) | 2010-08-12 | 2018-10-10 | Applied Materials, Inc. | Mask handling module |
| US10090179B2 (en) | 2011-06-28 | 2018-10-02 | Brooks Automation, Inc. | Semiconductor stocker systems and methods |
| WO2018111227A1 (en) | 2016-12-12 | 2018-06-21 | Intel Corporation | Systems, apparatuses, and methods for performing reticle inspections |
| CN109426082A (zh) | 2017-08-21 | 2019-03-05 | 上海微电子装备（集团）股份有限公司 | 一种掩模版的传输系统以及传输方法 |
-
2021
- 2021-08-26 US US17/446,035 patent/US11774866B2/en active Active
- 2021-09-01 JP JP2023514448A patent/JP7592154B2/ja active Active
- 2021-09-01 WO PCT/US2021/048570 patent/WO2022051310A1/en not_active Ceased
- 2021-09-01 CN CN202180053904.9A patent/CN116057467B/zh active Active
- 2021-09-01 EP EP21865005.9A patent/EP4200669A4/en active Pending
- 2021-09-01 KR KR1020237009897A patent/KR102725415B1/ko active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000147747A (ja) | 1998-11-16 | 2000-05-26 | Seiko Epson Corp | マスク検査装置 |
| JP2015519593A (ja) | 2012-03-27 | 2015-07-09 | ケーエルエー−テンカー コーポレイション | Ｅｕｖレチクル検査ツールにおけるレチクルの取り扱い装置及び方法 |
| US20150131071A1 (en) | 2013-11-08 | 2015-05-14 | Samsung Electronics Co., Ltd. | Semiconductor device manufacturing apparatus |
| JP2016170310A (ja) | 2015-03-13 | 2016-09-23 | 株式会社荏原製作所 | レチクル搬送装置、検査装置およびレチクル搬送方法 |
| US20200033717A1 (en) | 2018-07-30 | 2020-01-30 | Taiwan Semiconductor Manufacturing Co., Ltd. | Reticle stage and method for using the same |
| US20200057383A1 (en) | 2018-08-17 | 2020-02-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for detecting euv pellicle rupture |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022051310A1 (en) | 2022-03-10 |
| JP7592154B2 (ja) | 2024-11-29 |
| EP4200669A1 (en) | 2023-06-28 |
| CN116057467B (zh) | 2024-03-08 |
| CN116057467A (zh) | 2023-05-02 |
| US11774866B2 (en) | 2023-10-03 |
| KR20230058659A (ko) | 2023-05-03 |
| JP2023540297A (ja) | 2023-09-22 |
| US20220066333A1 (en) | 2022-03-03 |
| EP4200669A4 (en) | 2024-10-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9851643B2 (en) | Apparatus and methods for reticle handling in an EUV reticle inspection tool | |
| EP0898300B1 (en) | Method for processing a semiconductor wafer on a robotic track having access to in situ wafer backside particle detection | |
| KR102725415B1 (ko) | 인 시투 스테이지 수정을 위한 능동 레티클 캐리어 | |
| JP3978140B2 (ja) | 処理ツールにおいて基板上の欠陥を検出するための構成および方法 | |
| JP2015518662A (ja) | 半導体ウエハ加工における効率的な材料処理 | |
| CN111696893B (zh) | 基板处理装置以及物品制造方法 | |
| JP2023174692A (ja) | リソグラフィ装置の一部を洗浄するためのシステム | |
| TWI850972B (zh) | 用於清潔微影設備之一部分之清潔工具及方法 | |
| US20250021024A1 (en) | Utility stage for photolithographic apparatus and method | |
| KR20060011671A (ko) | 파티클 감지수단을 갖는 노광설비의 얼라인장치 | |
| KR102774957B1 (ko) | 레티클 포드 베이스플레이트 검사 장치 | |
| TWI844084B (zh) | 感測器系統 | |
| US20260026294A1 (en) | Systems and methods for wafer overview image scan and pre-alignment of film frame carrier | |
| US20250244257A1 (en) | Apparatus and method for handling wafer storage box | |
| KR20260004203A (ko) | 반송 장치, 리소그래피 장치 및 물품 제조 방법 | |
| TW202541218A (zh) | 基板處理裝置之調整方法、基板處理裝置及物品製造方法 | |
| JP2024168773A (ja) | 基板処理装置、基板処理方法及び物品の製造方法 | |
| JP2025080592A (ja) | 露光装置、露光装置の制御方法、異物検査装置、および物品製造方法 | |
| CN117916670A (zh) | 传感器系统 | |
| HK1018123B (en) | Method and apparatus for processing a semiconductor wafer on a robotic track having access to in situ wafer backside particle detection |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20230322 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20240619 Comment text: Request for Examination of Application |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20241002 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20241030 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20241030 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration |