JP7551893B2 - スパッタリングターゲット及び、スパッタリングターゲットの製造方法 - Google Patents

スパッタリングターゲット及び、スパッタリングターゲットの製造方法 Download PDF

Info

Publication number
JP7551893B2
JP7551893B2 JP2023501674A JP2023501674A JP7551893B2 JP 7551893 B2 JP7551893 B2 JP 7551893B2 JP 2023501674 A JP2023501674 A JP 2023501674A JP 2023501674 A JP2023501674 A JP 2023501674A JP 7551893 B2 JP7551893 B2 JP 7551893B2
Authority
JP
Japan
Prior art keywords
component
sputtering target
substrate
insert material
alloy layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023501674A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023017667A1 (https=
JPWO2023017667A5 (https=
Inventor
周平 村田
将也 岩渕
祐介 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JX Nippon Mining and Metals Corp
Original Assignee
JX Nippon Mining and Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp
Publication of JPWO2023017667A1 publication Critical patent/JPWO2023017667A1/ja
Publication of JPWO2023017667A5 publication Critical patent/JPWO2023017667A5/ja
Application granted granted Critical
Publication of JP7551893B2 publication Critical patent/JP7551893B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H01J37/3429—Plural materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B22F3/15—Hot isostatic pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B23K20/023—Thermo-compression bonding
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C14/00—Alloys based on titanium
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • C22F1/047—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon of alloys with magnesium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
    • C22F1/18—High-melting or refractory metals or alloys based thereon
    • C22F1/183—High-melting or refractory metals or alloys based thereon of titanium or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B22F3/15—Hot isostatic pressing
    • B22F2003/153—Hot isostatic pressing apparatus specific to HIP
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles ; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/06—Alloys based on aluminium with magnesium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
JP2023501674A 2021-08-11 2022-06-10 スパッタリングターゲット及び、スパッタリングターゲットの製造方法 Active JP7551893B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021131384 2021-08-11
JP2021131384 2021-08-11
PCT/JP2022/023495 WO2023017667A1 (ja) 2021-08-11 2022-06-10 スパッタリングターゲット及び、スパッタリングターゲットの製造方法

Publications (3)

Publication Number Publication Date
JPWO2023017667A1 JPWO2023017667A1 (https=) 2023-02-16
JPWO2023017667A5 JPWO2023017667A5 (https=) 2023-07-19
JP7551893B2 true JP7551893B2 (ja) 2024-09-17

Family

ID=85199733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023501674A Active JP7551893B2 (ja) 2021-08-11 2022-06-10 スパッタリングターゲット及び、スパッタリングターゲットの製造方法

Country Status (8)

Country Link
US (1) US12234544B2 (https=)
EP (1) EP4386108A4 (https=)
JP (1) JP7551893B2 (https=)
KR (1) KR102870278B1 (https=)
CN (1) CN116261605B (https=)
IL (1) IL301507A (https=)
TW (1) TWI841980B (https=)
WO (1) WO2023017667A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102901902B1 (ko) * 2023-05-26 2025-12-19 제엠제코(주) 금속 클립 구조체 및 이를 구비한 반도체 패키지

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002105635A (ja) 2000-10-02 2002-04-10 Nikko Materials Co Ltd 高純度コバルトターゲットと銅合金製バッキングプレートとの拡散接合ターゲット組立体及びその製造方法
JP2002294437A (ja) 2001-04-02 2002-10-09 Mitsubishi Materials Corp 銅合金スパッタリングターゲット
JP2003500546A (ja) 1999-06-02 2003-01-07 ジョンソン・マッセイ・エレクトロニクス・インコーポレーテッド 銅スパッター用ターゲットアセンブリー及びその製造方法
WO2020195030A1 (ja) 2019-03-28 2020-10-01 Ｊｘ金属株式会社 スパッタリングターゲット製品及びスパッタリングターゲット製品の再生品を製造する方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3469261B2 (ja) 1992-12-07 2003-11-25 株式会社ジャパンエナジー 拡散接合されたスパッタリングターゲット組立体及びその製造方法
US5693203A (en) 1992-09-29 1997-12-02 Japan Energy Corporation Sputtering target assembly having solid-phase bonded interface
JP3866320B2 (ja) 1995-02-09 2007-01-10 日本碍子株式会社 接合体、および接合体の製造方法
JP3829367B2 (ja) * 1996-08-02 2006-10-04 東ソー株式会社 スパッタリングターゲット
US5993621A (en) 1997-07-11 1999-11-30 Johnson Matthey Electronics, Inc. Titanium sputtering target
JPH1177365A (ja) 1997-07-18 1999-03-23 Kobe Steel Ltd ＴｉＡｌ系金属間化合物とＴｉ基合金を接合するためのインサート材およびその接合方法、並びに接合体
JPH11236665A (ja) * 1998-02-20 1999-08-31 Japan Energy Corp スパッタリングタ−ゲット用バッキングプレ−ト及びスパッタリングタ−ゲット／バッキングプレ−ト組立体
KR20020068535A (ko) 1999-11-22 2002-08-27 가부시키 가이샤 닛코 마테리알즈 스퍼터링용 티타늄 타겟트
JP2002294440A (ja) * 2001-04-03 2002-10-09 Sumitomo Chem Co Ltd スパッタリング用ターゲットとその製造方法
US20090078570A1 (en) * 2003-08-11 2009-03-26 Wuwen Yi Target/backing plate constructions, and methods of forming target/backing plate constructions
JP5144576B2 (ja) 2009-03-31 2013-02-13 Ｊｘ日鉱日石金属株式会社 スパッタリング用チタンターゲット
SG189977A1 (en) * 2010-10-27 2013-06-28 Jx Nippon Mining & Metals Corp Sputtering target backing plate assembly and method for producing same
US10844475B2 (en) 2015-12-28 2020-11-24 Jx Nippon Mining & Metals Corporation Method for manufacturing sputtering target
JP6271798B2 (ja) 2016-07-13 2018-01-31 住友化学株式会社 スパッタリングターゲットの製造方法
US10900102B2 (en) 2016-09-30 2021-01-26 Honeywell International Inc. High strength aluminum alloy backing plate and methods of making
CN111989421B (zh) * 2018-05-21 2022-12-06 株式会社爱发科 溅射靶材及其制造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003500546A (ja) 1999-06-02 2003-01-07 ジョンソン・マッセイ・エレクトロニクス・インコーポレーテッド 銅スパッター用ターゲットアセンブリー及びその製造方法
JP2002105635A (ja) 2000-10-02 2002-04-10 Nikko Materials Co Ltd 高純度コバルトターゲットと銅合金製バッキングプレートとの拡散接合ターゲット組立体及びその製造方法
JP2002294437A (ja) 2001-04-02 2002-10-09 Mitsubishi Materials Corp 銅合金スパッタリングターゲット
WO2020195030A1 (ja) 2019-03-28 2020-10-01 Ｊｘ金属株式会社 スパッタリングターゲット製品及びスパッタリングターゲット製品の再生品を製造する方法

Also Published As

Publication number Publication date
US20240026525A1 (en) 2024-01-25
CN116261605A (zh) 2023-06-13
WO2023017667A1 (ja) 2023-02-16
JPWO2023017667A1 (https=) 2023-02-16
EP4386108A4 (en) 2025-06-18
KR102870278B1 (ko) 2025-10-15
CN116261605B (zh) 2025-04-25
KR20230035626A (ko) 2023-03-14
TWI841980B (zh) 2024-05-11
TW202307238A (zh) 2023-02-16
IL301507A (en) 2023-05-01
EP4386108A1 (en) 2024-06-19
US12234544B2 (en) 2025-02-25

Similar Documents

Publication Publication Date Title
US9383143B2 (en) Metallic thin-film bonding and alloy generation
WO2014046130A1 (ja) アルミニウム部材と銅部材との接合構造
JP7196193B2 (ja) 放熱部材
JP7551893B2 (ja) スパッタリングターゲット及び、スパッタリングターゲットの製造方法
JP4594488B2 (ja) スパッタリングターゲット
WO2012086490A1 (ja) 回転ツール
JPS60166165A (ja) 窒化物系セラミックスと金属との接合方法
WO2021085451A1 (ja) 銅／セラミックス接合体、絶縁回路基板、及び、銅／セラミックス接合体の製造方法、絶縁回路基板の製造方法
JP6786090B2 (ja) 放熱板材
US6723213B2 (en) Titanium target assembly for sputtering and method for preparing the same
WO2025018350A1 (ja) 銅アルミニウムクラッド材の製造方法、ヒートシンクの製造方法、銅アルミニウムクラッド材及びヒートシンク
WO2024195792A1 (ja) 静電チャック装置
JP2025144282A (ja) 金属／セラミックス接合体、ろう材、および、金属／セラミックス接合体の製造方法
US20240227353A1 (en) Composite material
JPH06172993A (ja) 拡散接合されたスパッタリングターゲット組立体及びその製造方法
JP7846978B2 (ja) 金属接合体
US20250327172A1 (en) Cobalt-titanium alloy sputtering target assembly and method of making
CN120513316A (zh) 将含钨靶扩散接合到铜合金背板
JP2015081355A (ja) スパッタリングターゲットおよびスパッタリングターゲットの製造方法
US20250197987A1 (en) Molybdenum sputtering target assembly and method of making
JP2013180479A (ja) 積層体、ヒートシンクおよび積層体の製造方法
TW202600843A (zh) 鈷鈮合金濺鍍靶材總成及製造方法
TW202544263A (zh) 具有高橫向斷裂強度之鉬濺鍍靶材
TW202516035A (zh) 濺鍍靶材總成及其形成方法
WO2025105309A9 (ja) スパッタリングターゲット組立体及び膜

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230111

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230329

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240604

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240712

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240806

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240904

R150 Certificate of patent or registration of utility model

Ref document number: 7551893

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150