JP7519804B2 - 加工装置 - Google Patents
加工装置 Download PDFInfo
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- JP7519804B2 JP7519804B2 JP2020078520A JP2020078520A JP7519804B2 JP 7519804 B2 JP7519804 B2 JP 7519804B2 JP 2020078520 A JP2020078520 A JP 2020078520A JP 2020078520 A JP2020078520 A JP 2020078520A JP 7519804 B2 JP7519804 B2 JP 7519804B2
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- 238000012545 processing Methods 0.000 title claims description 296
- 238000010586 diagram Methods 0.000 claims description 90
- 238000000034 method Methods 0.000 claims description 35
- 230000008569 process Effects 0.000 claims description 35
- 239000000470 constituent Substances 0.000 claims description 10
- 230000032258 transport Effects 0.000 description 101
- 238000004140 cleaning Methods 0.000 description 46
- 238000013500 data storage Methods 0.000 description 28
- 238000001514 detection method Methods 0.000 description 22
- 230000006870 function Effects 0.000 description 13
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- 230000004044 response Effects 0.000 description 5
- 239000000523 sample Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000011960 computer-aided design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012905 input function Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
本発明の実施形態に係る加工装置1を図面に基づいて説明する。図1は、実施形態に係る加工装置1の構成例を示す斜視図である。図2は、図1の加工装置1の機能構成の一例を模式的に示す図である。実施形態に係る加工装置1は、図1に示すように、保持テーブル10と、ターンテーブル20と、仮置きテーブル30と、加工ユニット40と、搬送アーム51,52,53と、タッチパネル60と、洗浄ユニット70と、カセットステージ80と、カセット81,82と、制御ユニット90と、を備える。加工装置1は、本実施形態では、装置基台2と、装置カバー3とを備え、上記の加工装置1の構成要素を装置基台2上に備え、タッチパネル60を除く上記の構成要素を装置カバー3で覆っている。本発明に係る構成ユニットは、上記した加工装置1の構成要素のうち後述する被加工物100を保持するユニット全般であり、本実施形態では、具体的には、保持テーブル10、仮置きテーブル30、搬送アーム51,52,53、洗浄ユニット70の洗浄テーブル71及びカセット81,82を示す。
10 保持テーブル
40 加工ユニット
51 (第1の)搬送アーム
52 (第2の)搬送アーム
53 (第3の)搬送アーム
61 モニター
100 被加工物
200 配置図
Claims (2)
- 被加工物を保持する保持テーブルと、
該保持テーブルに保持された被加工物を加工する加工ユニットと、
被加工物を搬送する搬送アームと、
モニターと、を少なくとも備える加工装置であって、
1枚の被加工物が収容されるスロットを複数有し、複数の被加工物を収容するカセットが載置されるカセットステージをさらに備え、
該加工装置は、複数の被加工物を順次搬送して加工し、
該モニターは、該加工装置の各構成ユニットのイラストと、該加工装置が処理中の複数の被加工物のそれぞれのイラストと、を実際の該加工装置内の配置に基づき表示する配置図を、該加工装置及び該複数の被加工物のそれぞれを斜めから見て立体的に表示し、複数の被加工物のそれぞれのイラスト毎に、被加工物毎にそれぞれ紐付けられた該スロットの段数の番号の表示を付すことを特徴とする加工装置。 - 加工装置の少なくとも二つの構成ユニットは、上下方向に間隔をあけて配置され、該構成ユニットの移動中または固定位置において、該加工装置の上面から見ると重なる位置関係であり、
該モニターは、該加工装置の上面から見ると重なる位置関係である構成ユニット及び被加工物の各イラストを表示する位置を上下方向に間隔をあけて表示することを特徴とする請求項1に記載の加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020078520A JP7519804B2 (ja) | 2020-04-27 | 2020-04-27 | 加工装置 |
KR1020210040575A KR20210132596A (ko) | 2020-04-27 | 2021-03-29 | 가공 장치 |
CN202110447512.2A CN113635157A (zh) | 2020-04-27 | 2021-04-25 | 加工装置 |
TW110114862A TW202140193A (zh) | 2020-04-27 | 2021-04-26 | 加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020078520A JP7519804B2 (ja) | 2020-04-27 | 2020-04-27 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021171883A JP2021171883A (ja) | 2021-11-01 |
JP7519804B2 true JP7519804B2 (ja) | 2024-07-22 |
Family
ID=78281148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020078520A Active JP7519804B2 (ja) | 2020-04-27 | 2020-04-27 | 加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7519804B2 (ja) |
KR (1) | KR20210132596A (ja) |
CN (1) | CN113635157A (ja) |
TW (1) | TW202140193A (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009134542A (ja) | 2007-11-30 | 2009-06-18 | Jtekt Corp | 工作機械の干渉検出装置及び干渉マップ |
JP2009266221A (ja) | 2008-04-21 | 2009-11-12 | Mori Seiki Co Ltd | 加工シミュレーション方法及び加工シミュレーション装置 |
JP2018045727A (ja) | 2017-12-22 | 2018-03-22 | 株式会社牧野フライス製作所 | 工作機械の制御方法および工作機械の制御装置 |
JP2019198940A (ja) | 2018-05-18 | 2019-11-21 | 株式会社ディスコ | 加工装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014161948A (ja) | 2013-02-25 | 2014-09-08 | Disco Abrasive Syst Ltd | 研削装置、及び、研削ホイールの取付方法 |
-
2020
- 2020-04-27 JP JP2020078520A patent/JP7519804B2/ja active Active
-
2021
- 2021-03-29 KR KR1020210040575A patent/KR20210132596A/ko unknown
- 2021-04-25 CN CN202110447512.2A patent/CN113635157A/zh active Pending
- 2021-04-26 TW TW110114862A patent/TW202140193A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009134542A (ja) | 2007-11-30 | 2009-06-18 | Jtekt Corp | 工作機械の干渉検出装置及び干渉マップ |
JP2009266221A (ja) | 2008-04-21 | 2009-11-12 | Mori Seiki Co Ltd | 加工シミュレーション方法及び加工シミュレーション装置 |
JP2018045727A (ja) | 2017-12-22 | 2018-03-22 | 株式会社牧野フライス製作所 | 工作機械の制御方法および工作機械の制御装置 |
JP2019198940A (ja) | 2018-05-18 | 2019-11-21 | 株式会社ディスコ | 加工装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20210132596A (ko) | 2021-11-04 |
JP2021171883A (ja) | 2021-11-01 |
CN113635157A (zh) | 2021-11-12 |
TW202140193A (zh) | 2021-11-01 |
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