JP7505573B2 - 光加工装置 - Google Patents

光加工装置 Download PDF

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Publication number
JP7505573B2
JP7505573B2 JP2022558672A JP2022558672A JP7505573B2 JP 7505573 B2 JP7505573 B2 JP 7505573B2 JP 2022558672 A JP2022558672 A JP 2022558672A JP 2022558672 A JP2022558672 A JP 2022558672A JP 7505573 B2 JP7505573 B2 JP 7505573B2
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JP
Japan
Prior art keywords
optical system
light beam
processing apparatus
optical
light
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JP2022558672A
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English (en)
Japanese (ja)
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JPWO2022091253A5 (https=
JPWO2022091253A1 (https=
Inventor
健太 須藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
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Nikon Corp
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Publication of JPWO2022091253A1 publication Critical patent/JPWO2022091253A1/ja
Publication of JPWO2022091253A5 publication Critical patent/JPWO2022091253A5/ja
Priority to JP2024095562A priority Critical patent/JP2024116337A/ja
Application granted granted Critical
Publication of JP7505573B2 publication Critical patent/JP7505573B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lenses (AREA)
JP2022558672A 2020-10-28 2020-10-28 光加工装置 Active JP7505573B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024095562A JP2024116337A (ja) 2020-10-28 2024-06-13 光加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/040446 WO2022091253A1 (ja) 2020-10-28 2020-10-28 光加工装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024095562A Division JP2024116337A (ja) 2020-10-28 2024-06-13 光加工装置

Publications (3)

Publication Number Publication Date
JPWO2022091253A1 JPWO2022091253A1 (https=) 2022-05-05
JPWO2022091253A5 JPWO2022091253A5 (https=) 2024-04-22
JP7505573B2 true JP7505573B2 (ja) 2024-06-25

Family

ID=81383793

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022558672A Active JP7505573B2 (ja) 2020-10-28 2020-10-28 光加工装置
JP2024095562A Pending JP2024116337A (ja) 2020-10-28 2024-06-13 光加工装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024095562A Pending JP2024116337A (ja) 2020-10-28 2024-06-13 光加工装置

Country Status (5)

Country Link
US (1) US20230390864A1 (https=)
EP (1) EP4238685A4 (https=)
JP (2) JP7505573B2 (https=)
CN (1) CN116438030A (https=)
WO (1) WO2022091253A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119665169A (zh) * 2023-09-19 2025-03-21 苏州佳世达光电有限公司 光源系统
WO2025181942A1 (ja) * 2024-02-28 2025-09-04 株式会社ニコン ビーム走査装置、加工装置および加工方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994029069A1 (fr) 1993-06-04 1994-12-22 Seiko Epson Corporation Appareil et procede d'usinage au laser, et panneau a cristaux liquides
WO2005084874A1 (ja) 2004-03-05 2005-09-15 Olympus Corporation レーザ加工装置
JP2010214431A (ja) 2009-03-17 2010-09-30 Disco Abrasive Syst Ltd 光学系及びレーザ加工装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62126630A (ja) * 1985-11-27 1987-06-08 Nec Corp レ−ザ加工装置
GB2226970B (en) 1989-01-11 1992-10-21 British Aerospace Methods of manufacture and surface treatment using laser radiation
JPH04313476A (ja) * 1991-04-01 1992-11-05 Canon Inc レーザ孔加工法
JPH05214600A (ja) 1992-02-04 1993-08-24 Tsutsumi Seisakusho:Kk 電解研磨方法及びその装置
JP2000271772A (ja) * 1999-03-23 2000-10-03 Hitachi Constr Mach Co Ltd レーザ加工方法及び装置
JP4730591B2 (ja) * 2005-06-08 2011-07-20 セイコーエプソン株式会社 レーザ加工装置およびレーザ加工方法
JP5241129B2 (ja) * 2007-04-25 2013-07-17 レーザージョブ株式会社 レーザ加工装置及びレーザ加工方法
JP5231883B2 (ja) 2008-07-03 2013-07-10 株式会社 光コム 距離計及び距離測定方法並びに光学的三次元形状測定機
CN101890575A (zh) * 2010-07-14 2010-11-24 中国科学院上海光学精密机械研究所 具有实时监测的基于达曼光栅的飞秒激光并行微加工装置
JP2012096277A (ja) * 2010-11-04 2012-05-24 Olympus Corp レーザ加工装置
PL2972479T3 (pl) * 2013-03-13 2021-04-19 Ipg Photonics (Canada) Inc. Sposoby i układy do charakteryzacji właściwości obróbki laserem poprzez pomiar dynamiki kapilary z zastosowaniem interferometrii
KR20150009123A (ko) * 2013-07-15 2015-01-26 삼성전자주식회사 레이저를 이용하여 반도체를 가공하는 장치
FR3010924B1 (fr) * 2013-09-20 2015-11-06 Essilor Int Dispositif et procede de marquage laser d'une lentille ophtalmique
DE102014200633B3 (de) * 2014-01-15 2015-05-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bearbeitungsvorrichtung und -verfahren zur Laserbearbeitung einer Oberfläche
JP6388823B2 (ja) * 2014-12-01 2018-09-12 株式会社ディスコ レーザー加工装置
DE102019119790A1 (de) * 2019-07-22 2021-01-28 4Jet Microtech Gmbh Laserbearbeitungsvorrichtung

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1994029069A1 (fr) 1993-06-04 1994-12-22 Seiko Epson Corporation Appareil et procede d'usinage au laser, et panneau a cristaux liquides
WO2005084874A1 (ja) 2004-03-05 2005-09-15 Olympus Corporation レーザ加工装置
JP2010214431A (ja) 2009-03-17 2010-09-30 Disco Abrasive Syst Ltd 光学系及びレーザ加工装置

Also Published As

Publication number Publication date
JP2024116337A (ja) 2024-08-27
EP4238685A4 (en) 2024-09-18
EP4238685A1 (en) 2023-09-06
CN116438030A (zh) 2023-07-14
WO2022091253A1 (ja) 2022-05-05
US20230390864A1 (en) 2023-12-07
JPWO2022091253A1 (https=) 2022-05-05

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