CN116438030A - 光加工装置 - Google Patents

光加工装置 Download PDF

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Publication number
CN116438030A
CN116438030A CN202080106603.3A CN202080106603A CN116438030A CN 116438030 A CN116438030 A CN 116438030A CN 202080106603 A CN202080106603 A CN 202080106603A CN 116438030 A CN116438030 A CN 116438030A
Authority
CN
China
Prior art keywords
optical system
light
light beam
processing device
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080106603.3A
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English (en)
Chinese (zh)
Inventor
须藤健太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of CN116438030A publication Critical patent/CN116438030A/zh
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multi-focusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lenses (AREA)
CN202080106603.3A 2020-10-28 2020-10-28 光加工装置 Pending CN116438030A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/040446 WO2022091253A1 (ja) 2020-10-28 2020-10-28 光加工装置

Publications (1)

Publication Number Publication Date
CN116438030A true CN116438030A (zh) 2023-07-14

Family

ID=81383793

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080106603.3A Pending CN116438030A (zh) 2020-10-28 2020-10-28 光加工装置

Country Status (5)

Country Link
US (1) US20230390864A1 (https=)
EP (1) EP4238685A4 (https=)
JP (2) JP7505573B2 (https=)
CN (1) CN116438030A (https=)
WO (1) WO2022091253A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119665169A (zh) * 2023-09-19 2025-03-21 苏州佳世达光电有限公司 光源系统
WO2025181942A1 (ja) * 2024-02-28 2025-09-04 株式会社ニコン ビーム走査装置、加工装置および加工方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62126630A (ja) * 1985-11-27 1987-06-08 Nec Corp レ−ザ加工装置
JP2000271772A (ja) * 1999-03-23 2000-10-03 Hitachi Constr Mach Co Ltd レーザ加工方法及び装置
JP2010214431A (ja) * 2009-03-17 2010-09-30 Disco Abrasive Syst Ltd 光学系及びレーザ加工装置
CN101890575A (zh) * 2010-07-14 2010-11-24 中国科学院上海光学精密机械研究所 具有实时监测的基于达曼光栅的飞秒激光并行微加工装置
US20150017784A1 (en) * 2013-07-15 2015-01-15 Samsung Electronics Co., Ltd. Semiconductor processing apparatus using laser
US20160039045A1 (en) * 2013-03-13 2016-02-11 Queen's University At Kingston Methods and Systems for Characterizing Laser Machining Properties by Measuring Keyhole Dynamics Using Interferometry
CN106102982A (zh) * 2014-01-15 2016-11-09 弗劳恩霍夫应用研究促进协会 用于激光加工表面的加工装置和方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2226970B (en) 1989-01-11 1992-10-21 British Aerospace Methods of manufacture and surface treatment using laser radiation
JPH04313476A (ja) * 1991-04-01 1992-11-05 Canon Inc レーザ孔加工法
JPH05214600A (ja) 1992-02-04 1993-08-24 Tsutsumi Seisakusho:Kk 電解研磨方法及びその装置
EP0656241B1 (en) * 1993-06-04 1998-12-23 Seiko Epson Corporation Apparatus and method for laser machining
TWI250910B (en) * 2004-03-05 2006-03-11 Olympus Corp Apparatus for laser machining
JP4730591B2 (ja) * 2005-06-08 2011-07-20 セイコーエプソン株式会社 レーザ加工装置およびレーザ加工方法
JP5241129B2 (ja) * 2007-04-25 2013-07-17 レーザージョブ株式会社 レーザ加工装置及びレーザ加工方法
JP5231883B2 (ja) 2008-07-03 2013-07-10 株式会社 光コム 距離計及び距離測定方法並びに光学的三次元形状測定機
JP2012096277A (ja) * 2010-11-04 2012-05-24 Olympus Corp レーザ加工装置
FR3010924B1 (fr) * 2013-09-20 2015-11-06 Essilor Int Dispositif et procede de marquage laser d'une lentille ophtalmique
JP6388823B2 (ja) * 2014-12-01 2018-09-12 株式会社ディスコ レーザー加工装置
DE102019119790A1 (de) * 2019-07-22 2021-01-28 4Jet Microtech Gmbh Laserbearbeitungsvorrichtung

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62126630A (ja) * 1985-11-27 1987-06-08 Nec Corp レ−ザ加工装置
JP2000271772A (ja) * 1999-03-23 2000-10-03 Hitachi Constr Mach Co Ltd レーザ加工方法及び装置
JP2010214431A (ja) * 2009-03-17 2010-09-30 Disco Abrasive Syst Ltd 光学系及びレーザ加工装置
CN101890575A (zh) * 2010-07-14 2010-11-24 中国科学院上海光学精密机械研究所 具有实时监测的基于达曼光栅的飞秒激光并行微加工装置
US20160039045A1 (en) * 2013-03-13 2016-02-11 Queen's University At Kingston Methods and Systems for Characterizing Laser Machining Properties by Measuring Keyhole Dynamics Using Interferometry
US20150017784A1 (en) * 2013-07-15 2015-01-15 Samsung Electronics Co., Ltd. Semiconductor processing apparatus using laser
CN106102982A (zh) * 2014-01-15 2016-11-09 弗劳恩霍夫应用研究促进协会 用于激光加工表面的加工装置和方法

Also Published As

Publication number Publication date
JP2024116337A (ja) 2024-08-27
EP4238685A4 (en) 2024-09-18
JP7505573B2 (ja) 2024-06-25
EP4238685A1 (en) 2023-09-06
WO2022091253A1 (ja) 2022-05-05
US20230390864A1 (en) 2023-12-07
JPWO2022091253A1 (https=) 2022-05-05

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