JP7494925B2 - チップ型セラミック電子部品およびその製造方法 - Google Patents

チップ型セラミック電子部品およびその製造方法 Download PDF

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Publication number
JP7494925B2
JP7494925B2 JP2022551834A JP2022551834A JP7494925B2 JP 7494925 B2 JP7494925 B2 JP 7494925B2 JP 2022551834 A JP2022551834 A JP 2022551834A JP 2022551834 A JP2022551834 A JP 2022551834A JP 7494925 B2 JP7494925 B2 JP 7494925B2
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Japan
Prior art keywords
glass
conductive paste
free
sintered layer
ceramic body
Prior art date
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JP2022551834A
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English (en)
Japanese (ja)
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JPWO2022065004A1 (https=
JPWO2022065004A5 (https=
Inventor
孝太 善哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication of JPWO2022065004A5 publication Critical patent/JPWO2022065004A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
JP2022551834A 2020-09-25 2021-09-04 チップ型セラミック電子部品およびその製造方法 Active JP7494925B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020160733 2020-09-25
JP2020160733 2020-09-25
PCT/JP2021/032563 WO2022065004A1 (ja) 2020-09-25 2021-09-04 チップ型セラミック電子部品およびその製造方法

Publications (3)

Publication Number Publication Date
JPWO2022065004A1 JPWO2022065004A1 (https=) 2022-03-31
JPWO2022065004A5 JPWO2022065004A5 (https=) 2023-05-31
JP7494925B2 true JP7494925B2 (ja) 2024-06-04

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022551834A Active JP7494925B2 (ja) 2020-09-25 2021-09-04 チップ型セラミック電子部品およびその製造方法

Country Status (5)

Country Link
US (2) US12482601B2 (https=)
JP (1) JP7494925B2 (https=)
KR (1) KR102762517B1 (https=)
CN (1) CN116235262A (https=)
WO (1) WO2022065004A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101652850B1 (ko) * 2015-01-30 2016-08-31 삼성전기주식회사 칩 전자부품, 그 제조방법 및 이를 구비한 기판
KR20230102299A (ko) * 2021-12-30 2023-07-07 삼성전기주식회사 세라믹 전자부품

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001118424A (ja) 1999-10-19 2001-04-27 Kawatetsu Mining Co Ltd 導電ペースト用銅合金粉
JP2002367849A (ja) 2001-06-11 2002-12-20 Sumitomo Electric Ind Ltd セラミックコンデンサ用導電ペーストとそれを用いたセラミックコンデンサ
WO2007072894A1 (ja) 2005-12-22 2007-06-28 Namics Corporation 熱硬化性導電ペースト及びそれを用いて形成した外部電極を有する積層セラミック部品
JP2009099443A (ja) 2007-10-18 2009-05-07 Fukuda Metal Foil & Powder Co Ltd 導電材ペースト用銅合金粉
JP2013118358A (ja) 2011-10-31 2013-06-13 Murata Mfg Co Ltd セラミック電子部品及びその製造方法
JP2016072485A (ja) 2014-09-30 2016-05-09 株式会社村田製作所 積層セラミックコンデンサ
JP2017034010A (ja) 2015-07-30 2017-02-09 株式会社村田製作所 積層セラミックコンデンサおよびその製造方法
JP2018063998A (ja) 2016-10-11 2018-04-19 日立化成株式会社 電極用組成物、下地電極の製造方法、電子部品の製造方法及び電子部品
WO2020195522A1 (ja) 2019-03-28 2020-10-01 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法
WO2020195523A1 (ja) 2019-03-28 2020-10-01 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5266874B2 (ja) 2008-05-23 2013-08-21 パナソニック株式会社 セラミック電子部品の製造方法
JP2010123647A (ja) * 2008-11-18 2010-06-03 Panasonic Corp セラミックス電子部品、及びこれを用いた電子機器
JP2013058558A (ja) * 2011-09-07 2013-03-28 Tdk Corp 電子部品
KR101775913B1 (ko) * 2012-12-18 2017-09-07 가부시키가이샤 무라타 세이사쿠쇼 적층 세라믹 전자부품
JP2015109411A (ja) * 2013-10-25 2015-06-11 株式会社村田製作所 セラミック電子部品
US20160276303A1 (en) * 2015-03-17 2016-09-22 E I Du Pont De Nemours And Company Electronic component
JP2018067568A (ja) * 2016-10-17 2018-04-26 株式会社村田製作所 積層セラミックコンデンサの製造方法
TWI665691B (zh) * 2017-01-25 2019-07-11 禾伸堂企業股份有限公司 積層陶瓷電容器及其製造方法
KR101941954B1 (ko) * 2017-07-04 2019-01-24 삼성전기 주식회사 적층 세라믹 커패시터

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001118424A (ja) 1999-10-19 2001-04-27 Kawatetsu Mining Co Ltd 導電ペースト用銅合金粉
JP2002367849A (ja) 2001-06-11 2002-12-20 Sumitomo Electric Ind Ltd セラミックコンデンサ用導電ペーストとそれを用いたセラミックコンデンサ
WO2007072894A1 (ja) 2005-12-22 2007-06-28 Namics Corporation 熱硬化性導電ペースト及びそれを用いて形成した外部電極を有する積層セラミック部品
JP2009099443A (ja) 2007-10-18 2009-05-07 Fukuda Metal Foil & Powder Co Ltd 導電材ペースト用銅合金粉
JP2013118358A (ja) 2011-10-31 2013-06-13 Murata Mfg Co Ltd セラミック電子部品及びその製造方法
JP2016072485A (ja) 2014-09-30 2016-05-09 株式会社村田製作所 積層セラミックコンデンサ
JP2017034010A (ja) 2015-07-30 2017-02-09 株式会社村田製作所 積層セラミックコンデンサおよびその製造方法
JP2018063998A (ja) 2016-10-11 2018-04-19 日立化成株式会社 電極用組成物、下地電極の製造方法、電子部品の製造方法及び電子部品
WO2020195522A1 (ja) 2019-03-28 2020-10-01 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法
WO2020195523A1 (ja) 2019-03-28 2020-10-01 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法

Also Published As

Publication number Publication date
WO2022065004A1 (ja) 2022-03-31
KR102762517B1 (ko) 2025-02-05
JPWO2022065004A1 (https=) 2022-03-31
KR20230048436A (ko) 2023-04-11
CN116235262A (zh) 2023-06-06
US20250062074A1 (en) 2025-02-20
US12482601B2 (en) 2025-11-25
US20230230766A1 (en) 2023-07-20

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