CN116235262A - 片式陶瓷电子部件及其制造方法 - Google Patents

片式陶瓷电子部件及其制造方法 Download PDF

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Publication number
CN116235262A
CN116235262A CN202180063632.0A CN202180063632A CN116235262A CN 116235262 A CN116235262 A CN 116235262A CN 202180063632 A CN202180063632 A CN 202180063632A CN 116235262 A CN116235262 A CN 116235262A
Authority
CN
China
Prior art keywords
glass
conductive paste
free
electronic component
ceramic body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180063632.0A
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English (en)
Chinese (zh)
Inventor
善哉孝太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN116235262A publication Critical patent/CN116235262A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
CN202180063632.0A 2020-09-25 2021-09-04 片式陶瓷电子部件及其制造方法 Pending CN116235262A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-160733 2020-09-25
JP2020160733 2020-09-25
PCT/JP2021/032563 WO2022065004A1 (ja) 2020-09-25 2021-09-04 チップ型セラミック電子部品およびその製造方法

Publications (1)

Publication Number Publication Date
CN116235262A true CN116235262A (zh) 2023-06-06

Family

ID=80845218

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180063632.0A Pending CN116235262A (zh) 2020-09-25 2021-09-04 片式陶瓷电子部件及其制造方法

Country Status (5)

Country Link
US (2) US12482601B2 (https=)
JP (1) JP7494925B2 (https=)
KR (1) KR102762517B1 (https=)
CN (1) CN116235262A (https=)
WO (1) WO2022065004A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101652850B1 (ko) * 2015-01-30 2016-08-31 삼성전기주식회사 칩 전자부품, 그 제조방법 및 이를 구비한 기판
KR20230102299A (ko) * 2021-12-30 2023-07-07 삼성전기주식회사 세라믹 전자부품

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101341557A (zh) * 2005-12-22 2009-01-07 纳美仕有限公司 热固性导电糊以及具有使用其形成的外部电极的层叠陶瓷部件
US20160020028A1 (en) * 2013-10-25 2016-01-21 Murata Manufacturing Co., Ltd. Ceramic electronic component
JP2016072485A (ja) * 2014-09-30 2016-05-09 株式会社村田製作所 積層セラミックコンデンサ
US20170032896A1 (en) * 2015-07-30 2017-02-02 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor and manufacturing method therefor

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001118424A (ja) * 1999-10-19 2001-04-27 Kawatetsu Mining Co Ltd 導電ペースト用銅合金粉
JP2002367849A (ja) * 2001-06-11 2002-12-20 Sumitomo Electric Ind Ltd セラミックコンデンサ用導電ペーストとそれを用いたセラミックコンデンサ
JP5156328B2 (ja) * 2007-10-18 2013-03-06 福田金属箔粉工業株式会社 導電材ペースト用銅合金粉
JP5266874B2 (ja) 2008-05-23 2013-08-21 パナソニック株式会社 セラミック電子部品の製造方法
JP2010123647A (ja) * 2008-11-18 2010-06-03 Panasonic Corp セラミックス電子部品、及びこれを用いた電子機器
JP2013058558A (ja) * 2011-09-07 2013-03-28 Tdk Corp 電子部品
US9490055B2 (en) * 2011-10-31 2016-11-08 Murata Manufacturing Co., Ltd. Ceramic electronic component and manufacturing method thereof
KR101775913B1 (ko) * 2012-12-18 2017-09-07 가부시키가이샤 무라타 세이사쿠쇼 적층 세라믹 전자부품
US20160276303A1 (en) * 2015-03-17 2016-09-22 E I Du Pont De Nemours And Company Electronic component
JP2018063998A (ja) * 2016-10-11 2018-04-19 日立化成株式会社 電極用組成物、下地電極の製造方法、電子部品の製造方法及び電子部品
JP2018067568A (ja) * 2016-10-17 2018-04-26 株式会社村田製作所 積層セラミックコンデンサの製造方法
TWI665691B (zh) * 2017-01-25 2019-07-11 禾伸堂企業股份有限公司 積層陶瓷電容器及其製造方法
KR101941954B1 (ko) * 2017-07-04 2019-01-24 삼성전기 주식회사 적층 세라믹 커패시터
WO2020195522A1 (ja) * 2019-03-28 2020-10-01 株式会社村田製作所 チップ型セラミック電子部品およびその製造方法
KR102558658B1 (ko) * 2019-03-28 2023-07-24 가부시키가이샤 무라타 세이사쿠쇼 칩형 세라믹 전자부품의 제조 방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101341557A (zh) * 2005-12-22 2009-01-07 纳美仕有限公司 热固性导电糊以及具有使用其形成的外部电极的层叠陶瓷部件
US20160020028A1 (en) * 2013-10-25 2016-01-21 Murata Manufacturing Co., Ltd. Ceramic electronic component
JP2016072485A (ja) * 2014-09-30 2016-05-09 株式会社村田製作所 積層セラミックコンデンサ
US20170032896A1 (en) * 2015-07-30 2017-02-02 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor and manufacturing method therefor

Also Published As

Publication number Publication date
WO2022065004A1 (ja) 2022-03-31
KR102762517B1 (ko) 2025-02-05
JPWO2022065004A1 (https=) 2022-03-31
KR20230048436A (ko) 2023-04-11
US20250062074A1 (en) 2025-02-20
US12482601B2 (en) 2025-11-25
JP7494925B2 (ja) 2024-06-04
US20230230766A1 (en) 2023-07-20

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