JP7481865B2 - 半導体装置用基板、および半導体装置 - Google Patents

半導体装置用基板、および半導体装置 Download PDF

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Publication number
JP7481865B2
JP7481865B2 JP2020043371A JP2020043371A JP7481865B2 JP 7481865 B2 JP7481865 B2 JP 7481865B2 JP 2020043371 A JP2020043371 A JP 2020043371A JP 2020043371 A JP2020043371 A JP 2020043371A JP 7481865 B2 JP7481865 B2 JP 7481865B2
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Prior art keywords
external electrode
semiconductor device
mounting pad
substrate
surface layer
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Japanese (ja)
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JP2021145060A5 (https=
JP2021145060A (ja
Inventor
佑也 五郎丸
旺 上田
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Maxell Ltd
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Maxell Ltd
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Priority to JP2020043371A priority Critical patent/JP7481865B2/ja
Priority to CN202110235071.XA priority patent/CN113394115B/zh
Priority to CN202511899866.5A priority patent/CN121693197A/zh
Publication of JP2021145060A publication Critical patent/JP2021145060A/ja
Publication of JP2021145060A5 publication Critical patent/JP2021145060A5/ja
Priority to JP2024072243A priority patent/JP7664455B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations

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  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
  • Hall/Mr Elements (AREA)
JP2020043371A 2020-03-12 2020-03-12 半導体装置用基板、および半導体装置 Active JP7481865B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020043371A JP7481865B2 (ja) 2020-03-12 2020-03-12 半導体装置用基板、および半導体装置
CN202110235071.XA CN113394115B (zh) 2020-03-12 2021-03-03 半导体装置用基板、半导体装置用基板的制造方法以及半导体装置
CN202511899866.5A CN121693197A (zh) 2020-03-12 2021-03-03 半导体装置用基板、半导体装置用基板的制造方法以及半导体装置
JP2024072243A JP7664455B2 (ja) 2020-03-12 2024-04-26 半導体装置用基板、および半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020043371A JP7481865B2 (ja) 2020-03-12 2020-03-12 半導体装置用基板、および半導体装置

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JP2021145060A JP2021145060A (ja) 2021-09-24
JP2021145060A5 JP2021145060A5 (https=) 2023-01-10
JP7481865B2 true JP7481865B2 (ja) 2024-05-13

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JP2024072243A Active JP7664455B2 (ja) 2020-03-12 2024-04-26 半導体装置用基板、および半導体装置

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CN (2) CN121693197A (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023045901A (ja) * 2021-09-22 2023-04-03 マクセル株式会社 半導体装置用基板
US20250389981A1 (en) * 2022-03-30 2025-12-25 Sumitomo Osaka Cement Co., Ltd. Optical waveguide element, and optical modulation device and optical transmission apparatus using same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001189214A (ja) 1999-12-28 2001-07-10 Daido Electronics Co Ltd 希土類ボンド磁石およびその製造方法
JP2004214265A (ja) 2002-12-27 2004-07-29 Kyushu Hitachi Maxell Ltd 半導体装置および半導体装置の製造方法
JP2005227134A (ja) 2004-02-13 2005-08-25 Hitachi Metals Ltd 磁気センサー
JP2010040679A (ja) 2008-08-01 2010-02-18 Kyushu Hitachi Maxell Ltd 半導体装置とその製造方法
JP2011104909A (ja) 2009-11-19 2011-06-02 Hitachi Maxell Ltd ロール金型及びその製造方法
JP2014216431A (ja) 2013-04-24 2014-11-17 Ｓｈマテリアル株式会社 半導体素子搭載用基板の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0670981B2 (ja) * 1986-07-08 1994-09-07 三洋電機株式会社 電極形成方法
JPH04146632A (ja) * 1990-10-09 1992-05-20 Seiko Epson Corp 半導体装置の実装方法
JP3016305B2 (ja) * 1992-05-18 2000-03-06 ソニー株式会社 リードフレームの製造方法と半導体装置の製造方法
JPH0661392A (ja) * 1992-08-04 1994-03-04 Hitachi Cable Ltd 半導体装置用リードフレーム
JP3026485B2 (ja) * 1997-02-28 2000-03-27 日本電解株式会社 リードフレーム材とその製法
JPH1174413A (ja) * 1997-07-01 1999-03-16 Sony Corp リードフレームとリードフレームの製造方法と半導体装置と半導体装置の組立方法と電子機器
JP2002289739A (ja) * 2001-03-23 2002-10-04 Dainippon Printing Co Ltd 樹脂封止型半導体装置および半導体装置用回路部材とその製造方法
WO2014156791A1 (ja) * 2013-03-29 2014-10-02 富士電機株式会社 半導体装置および半導体装置の製造方法
JP5866719B2 (ja) * 2014-03-19 2016-02-17 日立マクセル株式会社 半導体装置用の中間成形品及び半導体装置
JP2016165005A (ja) * 2016-04-19 2016-09-08 大日本印刷株式会社 半導体装置およびその製造方法、ならびに半導体装置用基板およびその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001189214A (ja) 1999-12-28 2001-07-10 Daido Electronics Co Ltd 希土類ボンド磁石およびその製造方法
JP2004214265A (ja) 2002-12-27 2004-07-29 Kyushu Hitachi Maxell Ltd 半導体装置および半導体装置の製造方法
JP2005227134A (ja) 2004-02-13 2005-08-25 Hitachi Metals Ltd 磁気センサー
JP2010040679A (ja) 2008-08-01 2010-02-18 Kyushu Hitachi Maxell Ltd 半導体装置とその製造方法
JP2011104909A (ja) 2009-11-19 2011-06-02 Hitachi Maxell Ltd ロール金型及びその製造方法
JP2014216431A (ja) 2013-04-24 2014-11-17 Ｓｈマテリアル株式会社 半導体素子搭載用基板の製造方法

Also Published As

Publication number Publication date
JP2021145060A (ja) 2021-09-24
JP7664455B2 (ja) 2025-04-17
CN113394115B (zh) 2026-01-06
JP2024096242A (ja) 2024-07-12
CN113394115A (zh) 2021-09-14
CN121693197A (zh) 2026-03-17

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